Abstract: An information handling system includes a rear node that includes an airflow control device a thermal manager. The thermal manager identifies a front node mating event between the rear node and a front node; in response to the front node mating event: obtains front node airflow characteristics for the front node; determines an airflow rate using, at least in part, the front node airflow characteristics; and sets an operating point of the airflow control device based on the airflow rate.

Abstract: An information handling system may include a processor, a memory, modules including one or more information handling resources and having a corresponding airflow impedance associated therewith, and a cooling system that includes a controller and of air movers. The controller may be configured to, in response to a determination that a first module of the plurality of modules has a first airflow impedance higher than an upper threshold impedance and that a second module of the plurality of modules has a second airflow impedance lower than a lower threshold impedance: determine a scaling factor based on the first and second airflow impedances, scaling factor being usable by the controller to adjust an amount of airflow provided by the plurality of air movers; and control the plurality of air movers in an open-loop fashion according to the scaling factor.

Abstract: An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.

Abstract: When conflicting thermal parameters for thermal control exist in both of a personality module and one of a power table and a thermal table, wherein the power table comprises a plurality of entries each setting forth supported parameters for power management of one or more information handling resources, wherein the thermal table comprises a plurality of entries each setting forth parameters for thermal management of the one or more information handling resources, and wherein a personality module comprises a plurality of entries each setting forth custom parameters for system-specific power/thermal management of the one or more information handling resources, each entry of the personality module including an attribute associated with the custom parameters, a method may perform selecting one of the conflicting thermal parameters as a selected thermal parameter based on the at least one attribute; and writing an entry associated with the selected thermal parameter to final thermal.

Abstract: In accordance with embodiments of the present disclosure, a system may include a cooling subsystem comprising at least one air mover configured to generate a cooling airflow in the system and a thermal manager communicatively coupled to the cooling subsystem and configured to: (i) determine a minimum air mover speed and maximum air mover speed based on a minimum sound level and a maximum sound level for sound generated by the at least one air mover; and (ii) operate the at least one air mover in accordance with thermal requirements of the system subject to the maximum air mover speed and the minimum air mover speed.

Abstract: A dual in-line memory module (DIMM) thermal control system for intelligent DIMM thermal controls for maximum uptime may include a memory subsystem. The memory subsystem may include a first DIMM and a first serial presence detect (SPD) module associated with the first DIMM. The DIMM thermal control system may also include a baseboard management controller (BMC). The BMC may, when a first DIMM failure of the first DIMM may be detected, record a first failure event in a first failure events log of the first SPD module. The first failure event may comprise the first DIMM failure and associated first thermal telemetry data of the first DIMM. The BMC may also adjust DIMM thermal control settings to reduce temperature of the first DIMM based on the first failure events log including at least the first failure event.

Abstract: Heat-rejecting media may thermally couple to an information handling resource, and the heat-rejecting media may include active heat-rejecting media configured to thermally couple to the information handling resource and thermally couple between the information handling resource and an active cooling system such that the active cooling system causes heat transferred to the active heat-rejecting media from the information handling resource to be transferred from the active heat-rejecting media and passive heat-rejecting media extending from the active heat-rejecting media and configured to thermally couple to the information handling resource and thermally couple between the information handling resource and a system-level air mover other than the active cooling system and configured to drive airflow to components of an information handling system comprising the information handling resource such that the heat transferred to the passive heat-rejecting media from the information handling resource is transferred

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a circuit board, a device communicatively coupled to the circuit board via an electrical interface, a temperature sensor for sensing a measured temperature associated with the device, an air mover, a heating element thermally coupled to the electrical interface, and a thermal control system. The thermal control system may be configured to receive a temperature signal from the temperature sensor indicative of the measured temperature, responsive to the measured temperature being above a maximum threshold temperature, control the air mover to generate airflow sufficient to at least reduce the measured temperature to below the maximum threshold temperature, and responsive to the measured temperature being below a minimum threshold temperature, control the heating element to cause the measured temperature to be maintained above the minimum threshold temperature.

Abstract: An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.

Abstract: Method, systems are provided for providing automated open-loop control of an airflow cooling system in an IHS (Information Handling System), where the open-loop control is automatically adjusted based on changes to the components installed by the IHS. An airflow impedance, providing an amount a component physically impedes airflow, is retrieved for a new component. An estimated airflow delivery to the installed location of the new component is determined and scaled based on the airflow impedance of the new component and based on the ability to bypass the new component with ventilated airflow. An airflow delivery target for the new component is determined based on the ambient air temperature available at the installed new component. The airflow delivery target is scaled based on the installed location of the new component. The airflow cooling system is operated to equalize the estimated airflow delivery to the new component with the airflow delivery target for new component.

Abstract: An information handling system may include a processor; a plurality of connectors configured to receive a corresponding plurality of information handling resources, wherein each connector is located within a particular physical region of the information handling system and is communicatively coupled to the processor; and a management controller communicatively coupled to the processor and configured to provide out-of-band management of the information handling system. The management controller may be further configured to store a data structure that includes a mapping between respective ones of the physical regions and the connectors located within those physical regions; receive a command relating to a particular physical region; and based on the mapping in the data structure, transmit the command, via the connectors that are located in the particular physical region, to the information handling resources received by those connectors.

Abstract: An information handling system may include a processor, a memory, modules including one or more information handling resources and having a corresponding airflow impedance associated therewith, and a cooling system that includes a controller and of air movers. The controller may be configured to, in response to a determination that a first module of the plurality of modules has a first airflow impedance higher than an upper threshold impedance and that a second module of the plurality of modules has a second airflow impedance lower than a lower threshold impedance: determine a scaling factor based on the first and second airflow impedances, scaling factor being usable by the controller to adjust an amount of airflow provided by the plurality of air movers; and control the plurality of air movers in an open-loop fashion according to the scaling factor.

Abstract: An information handling system may include a processor; a memory communicatively coupled to the processor; and a cooling system that includes a plurality of air movers and a cooling system controller. The cooling system controller may be configured to: store a data structure that includes information indicative of an expected number of air movers for the information handling system, wherein the expected number of air movers is based on configuration data for the information handling system; determine a detected number of air movers in the plurality of air movers of the cooling system; and in response to a determination that the expected number of air movers is not equal to the detected number of air movers, cause an alert to be sent to a user regarding an incorrect number of air movers.

Abstract: An information handling system may include a processor; a plurality of connectors configured to receive a corresponding plurality of information handling resources, wherein each connector is located within a particular physical region of the information handling system and is communicatively coupled to the processor; and a management controller communicatively coupled to the processor and configured to provide out-of-band management of the information handling system. The management controller may be further configured to store a data structure that includes a mapping between respective ones of the physical regions and the connectors located within those physical regions; receive a command relating to a particular physical region; and based on the mapping in the data structure, transmit the command, via the connectors that are located in the particular physical region, to the information handling resources received by those connectors.

Abstract: In accordance with these and other embodiments of the present disclosure, an information handling system may include a plurality of information handling resources including a thermal manager and a liquid cooling adapter comprising fluidic conduits for conveying a refrigerant liquid between a cooling distribution unit external to the information handling system and at least one of the plurality of information handling resources, a computer-readable medium configured to store information regarding the liquid cooling adapter, and a sideband interface communicatively coupled between the computer-readable medium and the thermal manager such that the thermal manager receives the information regarding the liquid cooling adapter from the computer-readable medium and provides thermal control of the information handling system in accordance with the information regarding the liquid cooling adapter.

Abstract: An information handling system may include a circuit board that includes a plurality of expansion slots. The information handling system may further include a cooling card coupled to at least one of the plurality of expansion slots, and a processor coupled to the circuit board (but where the cooling card does not contain the processor). Further, the processor may include a heat exchanger coupled thereto. The cooling card may include a heatsink, and a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled to the heat exchanger.

Abstract: In accordance with embodiments of the present disclosure, a system may include a plurality of slots each configured to receive a modular information handling system, a plurality of air movers each configured to cool at least one modular information handling system disposed in at least one of the plurality of slots, and a controller communicatively coupled to the plurality of slots and the plurality of air movers and configured to, based on one or more thermal operational parameters associated with the plurality of slots and the plurality of air movers, determine an optimal allocation of at least one workload to a particular information handling system of a plurality of modular information handling systems received in the plurality of slots.

Abstract: In accordance with embodiments of the present disclosure, a system may include a controller configured to control a process value using closed-loop control, wherein: (i) when using closed-loop control, the controller controls the process value based on a measured process value indicative of the process value communicated from a sensor and by generating a driving signal that is a maximum of a first driving signal which is the function of the measured process value and a second driving signal; and (ii) the controller is configured to disable polling by the controller of the sensor for the measured process value when the driving signal is greater than a threshold open-loop driving signal sufficient to maintain the process value within a desired range of the process value in the absence of closed-loop control.

Abstract: In accordance with embodiments of the present disclosure, a system may include a cooling subsystem for cooling components of an information handling system and a thermal manager communicatively coupled to the cooling subsystem. The thermal manager may be configured to receive information regarding a reference performance metric for the cooling subsystem, based on the reference performance metric, modify at least one thermal control parameter for thermally controlling the information handling system from a baseline setting associated with a hardware configuration of the information handling system, and thermally control the information handling system in accordance with the at least one thermal control parameter as modified.

Abstract: Embodiments of the invention are directed to methods and systems for backflow prevention for computing devices. In an embodiment, a system of sensors, processors, and airflow stimulation devices, such as fans, are used to prevent backflow of high temperature gasses through a server housing. The backflow of high temperature gasses may be a result of a pressure differential between a region in which cooling gases are disposed and a region in which high temperature exhaust gasses are disposed.