Patents by Inventor Hee-Jin Park

Hee-Jin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8321153
    Abstract: Disclosed herein is a method of finding an isotopic cluster in a polypeptide and determining the monoisotopic mass of the cluster. The method comprises an algorithm for finding an isotopic cluster based on a probabilistic model, defined by each of peaks in the isotopic cluster, and determining the monoisotopic mass of the isotopic cluster. The probabilistic model of the isotopic cluster includes characteristic functions for mass, that is, a function of the ratio of two peak intensities, and a function of the product of two ratios obtained from three peaks. These characteristic functions for mass define the shape of peaks acceptable in an actual isotopic cluster for the mass of any isotopic cluster. The algorithm of finding the isotopic cluster based on the functions uses the characteristics to score the degree of the approximation of any isotopic cluster to the spectral shape of a theoretical cluster.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: November 27, 2012
    Assignees: SNU R & DB Foundation, University of Seoul Foundation of Industry Academic Cooperation
    Inventors: Kun Soo Park, Joo Young Yoon, Sun Ho Lee, Eun Ok Paek, Hee Jin Park, Sang Won Lee
  • Patent number: 8223248
    Abstract: An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: July 17, 2012
    Assignee: Hynix Semiconductor Inc.
    Inventors: Seung Hyun Lee, Chan Ki Hwang, Seung Ho Lee, Hee Jin Park
  • Publication number: 20120113181
    Abstract: There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 10, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Han Kwon, Ju Hwan Yang, Jun Young Kim, Ha Yoon Song, Jae Hun Kim, Hee Jin Park, Young Seuck Yoo, Sung Nam Cho
  • Publication number: 20120024573
    Abstract: There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs.
    Type: Application
    Filed: May 11, 2011
    Publication date: February 2, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Ji Han Kwon, Ha Yoon Song, Young Seuck Yoo, Hee Jin Park, Jun Young Kim, Ju Hwan Yang, Sung Nam Cho
  • Patent number: 7885870
    Abstract: A system for providing banking services by use of a mobile communication system, in which a variety of financial transactions including inquiry of at least one financial account of at least one financial institution, transfer and remittance, and loan and its interest payment are processed by the mobile communication system. The system includes: the mobile communication system, provided with an integrated circuit (IC) card and a memory device to which a banking application is installed, for transmitting and receiving data by wireless, the IC card being stored with information on a personal identification number (PIN) and information related to financial accounts including a loan account.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: February 8, 2011
    Assignee: LG Uplus Corp.
    Inventors: Deok-Young Nam, Hyung-Seok Kim, Jun-Hyung Kim, Hee-Jin Park
  • Publication number: 20100259657
    Abstract: An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.
    Type: Application
    Filed: June 25, 2009
    Publication date: October 14, 2010
    Inventors: Seung Hyun LEE, Chan Ki HWANG, Seung Ho LEE, Hee Jin PARK
  • Patent number: 7629679
    Abstract: A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: December 8, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hee-Jin Park
  • Publication number: 20090051023
    Abstract: Provided is a stack package comprising: a substrate comprising a cavity; a first semiconductor chip disposed in the cavity; and a second semiconductor chip stacked on the substrate and electrically connected to the substrate by a plurality of conductive external terminals such as conductive bumps. Since both a horizontal packaging method using bonding wires and a flip-chip packaging method are used and the bonding wires of the horizontal package and the conductive external terminals for the flip-chip bonding are formed on substantially the same plane, the total height of the stack package is reduced.
    Type: Application
    Filed: January 4, 2008
    Publication date: February 26, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-Duk NAM, Hee-Jin PARK, Jeong-Joon OH
  • Patent number: 7485959
    Abstract: A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. The insulating protective openings protect the solder column against stress faults to form reliable electrical connections and to support high-density electrical connections between the semiconductor package and the package mounting substrate.
    Type: Grant
    Filed: January 11, 2006
    Date of Patent: February 3, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-Joon Yoo, Jin-Ho Kim, Hee-Jin Park, Tae-Sung Yoon, Chan-Suk Lee
  • Patent number: 7374079
    Abstract: A method of providing banking services by use of a mobile communication system having a removable built-in integrated circuit (IC) card chip in which personal identification number (PIN) information and related information on financial accounts of a user are stored. The method includes selecting an electronic bankbook service and selecting any one from financial transactions for the electronic bankbook service and comparing the PIN information input at the mobile communication system with the PIN information stored in the IC card chip, and authenticating access to data stored in the IC card chip on the mobile communication system.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: May 20, 2008
    Assignee: LG Telecom, Ltd.
    Inventors: Deok-Young Nam, Hyung-Seok Kim, Jun-Hyung Kim, Hee-Jin Park
  • Patent number: 7368821
    Abstract: In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate, wherein the I/O solder balls are electrically connected to the semiconductor chip and the dummy solder balls are electrically isolated from the semiconductor chip, and the I/O solder balls and the dummy solder balls have the same ball size and ball pitch and are uniformly provided over the second surface of the substrate.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: May 6, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Young Kim, Jin-Ho Kim, Hee-Jin Park, Young-Hee Song, Tae-Sung Yoon
  • Publication number: 20060231952
    Abstract: In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate, wherein the I/O solder balls are electrically connected to the semiconductor chip and the dummy solder balls are electrically isolated from the semiconductor chip, and the I/O solder balls and the dummy solder balls have the same ball size and ball pitch and are uniformly provided over the second surface of the substrate.
    Type: Application
    Filed: September 22, 2005
    Publication date: October 19, 2006
    Inventors: Sang-Young Kim, Jin-Ho Kim, Hee-Jin Park, Young-Hee Song, Tae-Sung Yoon
  • Publication number: 20060157848
    Abstract: In one embodiment, a semiconductor package and a package mounting substrate are joined using a conductive material column such as a solder column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. By forming the insulating protective openings with sufficient depth, each protects the solder column against stress faults and thereby forms more reliable electrical connections and supports high-density electrical connections between the semiconductor package and the package mounting substrate.
    Type: Application
    Filed: January 11, 2006
    Publication date: July 20, 2006
    Inventors: Cheol-Joon Yoo, Jin-Ho Kim, Hee-Jin Park, Tae-Sung Yoon, Chan-Suk Lee
  • Publication number: 20060118926
    Abstract: A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
    Type: Application
    Filed: November 23, 2005
    Publication date: June 8, 2006
    Inventor: Hee-Jin Park
  • Patent number: 6857470
    Abstract: The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: February 22, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee-Jin Park, Tae-Gyeong Chung, Eun-Chul Ahn
  • Publication number: 20040267665
    Abstract: A system for providing banking services by use of a mobile communication system, in which a variety of financial transactions including inquiry of at least one financial account of at least one financial institution, transfer and remittance, and loan and its interest payment are processed by the mobile communication system. The system includes: the mobile communication system, provided with an integrated circuit (IC) card and a memory device to which a banking application is installed, for transmitting and receiving data by wireless, the IC card being stored with information on a personal identification number (PIN) and information related to financial accounts including a loan account.
    Type: Application
    Filed: June 22, 2004
    Publication date: December 30, 2004
    Applicant: LG TeleCom, Ltd.
    Inventors: Deok-Young Nam, Hyung-Seok Kim, Jun-Hyung Kim, Hee-Jin Park
  • Publication number: 20040267664
    Abstract: A method of providing banking services by use of a mobile communication system having a removable built-in integrated circuit (IC) card chip in which personal identification number (PIN) information and related information on financial accounts of a user are stored. The method includes selecting an electronic bankbook service and selecting any one from financial transactions for the electronic bankbook service and comparing the PIN information input at the mobile communication system with the PIN information stored in the IC card chip, and authenticating access to data stored in the IC card chip on the mobile communication system.
    Type: Application
    Filed: June 22, 2004
    Publication date: December 30, 2004
    Applicant: LG TeleCom, Ltd.
    Inventors: Deok-Young Nam, Hyung-Seok Kim, Jun-Hyung Kim, Hee-Jin Park
  • Publication number: 20040196635
    Abstract: The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.
    Type: Application
    Filed: November 20, 2003
    Publication date: October 7, 2004
    Inventors: Hee-Jin Park, Tae-Gyeong Chung, Eun-Chul Ahn
  • Patent number: 6633519
    Abstract: An optical pick-up device includes: a yoke plate having yokes formed at a front side where a magnetic body and a magnetic driving coil are positioned to drive an objective lens; a frame molded to the yoke plate in such a manner that a portion of the rear side of the yoke plate is inserted thereinto; and a PCB with at least two portions fixed to the frame, for applying a drive signal to the magnetic driving unit. Since the frame is press-fit to the yoke plate and the PCB with several portions coated with the adhesive is fixedly attached to the frame, it is not necessary to use an engaging member such as a screw, so that its assembly can be improved and the frame and the PCB can be prevented from being shaken.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: October 14, 2003
    Assignee: LG Electronics Inc.
    Inventors: Hee Jin Park, In Woo Lee
  • Publication number: 20020084519
    Abstract: A semiconductor chip stack package includes first and second semiconductor chips and a method for manufacturing the same are disclosed. Each chip has an active surface on which a plurality of electrode pads are formed, and a rear surface opposite to the active surface. The rear surfaces of the first and second chips face each other. The chip stack package further includes a single lead frame which has a plurality of leads that are disposed over and attached to the active surface of one of the first and second chips. Each electrode pad of the first and second chips is electrically connected to a corresponding one of the leads.
    Type: Application
    Filed: October 9, 2001
    Publication date: July 4, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ill-Heung Choi, Young-Hee Song, Kwan-Jai Lee, Hee-Jin Park