Hee-Jin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: An optical pick-up device includes: a yoke plate having yokes formed at a front side where a magnetic body and a magnetic driving coil are positioned to drive an objective lens; a frame molded to the yoke plate in such a manner that a portion of the rear side of the yoke plate is inserted thereinto; and a PCB with at least two portions fixed to the frame, for applying a drive signal to the magnetic driving unit. Since the frame is press-fit to the yoke plate and the PCB with several portions coated with the adhesive is fixedly attached to the frame, it is not necessary to use an engaging member such as a screw, so that its assembly can be improved and the frame and the PCB can be prevented from being shaken.
Abstract: A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim portion adapted to be attached to ends of the inner portions of the leads and a projecting portion that projects between the ends of the inner portions of the leads such that an upper surface of the projecting portion is in approximately the same plane as an upper surface of the inner portions of the leads. An insulative adhesive may be used to attach the ends of the inner portions of the leads to the rim portion of the heat spreader. Also, insulation members may be attached to upper surfaces of the ends of the inner portions of the leads for receiving a large size chip.