Abstract: In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate, wherein the I/O solder balls are electrically connected to the semiconductor chip and the dummy solder balls are electrically isolated from the semiconductor chip, and the I/O solder balls and the dummy solder balls have the same ball size and ball pitch and are uniformly provided over the second surface of the substrate.

Abstract: In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and plurality of in/out (I/O) solder balls and dummy solder balls provided on the second surface of the substrate, wherein the I/O solder balls are electrically connected to the semiconductor chip and the dummy solder balls are electrically isolated from the semiconductor chip, and the I/O solder balls and the dummy solder balls have the same ball size and ball pitch and are uniformly provided over the second surface of the substrate.

Abstract: In one embodiment, a semiconductor package and a package mounting substrate are joined using a conductive material column such as a solder column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. By forming the insulating protective openings with sufficient depth, each protects the solder column against stress faults and thereby forms more reliable electrical connections and supports high-density electrical connections between the semiconductor package and the package mounting substrate.

Abstract: A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.

Abstract: The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.

Abstract: A method of providing banking services by use of a mobile communication system having a removable built-in integrated circuit (IC) card chip in which personal identification number (PIN) information and related information on financial accounts of a user are stored. The method includes selecting an electronic bankbook service and selecting any one from financial transactions for the electronic bankbook service and comparing the PIN information input at the mobile communication system with the PIN information stored in the IC card chip, and authenticating access to data stored in the IC card chip on the mobile communication system.

Abstract: A system for providing banking services by use of a mobile communication system, in which a variety of financial transactions including inquiry of at least one financial account of at least one financial institution, transfer and remittance, and loan and its interest payment are processed by the mobile communication system. The system includes: the mobile communication system, provided with an integrated circuit (IC) card and a memory device to which a banking application is installed, for transmitting and receiving data by wireless, the IC card being stored with information on a personal identification number (PIN) and information related to financial accounts including a loan account.

Abstract: The present invention provides a stacked chip package having at least one heat transfer wire. The heat transfer wire is disposed between the stacked chips and at least one end of each transfer wire is connected to a dummy pad provided on the board. Therefore, the heat generated by the chips and trapped between the chips can be effectively dissipated. The heat transfer wires can be formed on the uppermost chip of the stacked chips to enhance the heat dissipation. In addition, by controlling the number or the size of the heat transfer wire, the thermal characteristics of the stacked chip package can be modified.

Abstract: An optical pick-up device includes: a yoke plate having yokes formed at a front side where a magnetic body and a magnetic driving coil are positioned to drive an objective lens; a frame molded to the yoke plate in such a manner that a portion of the rear side of the yoke plate is inserted thereinto; and a PCB with at least two portions fixed to the frame, for applying a drive signal to the magnetic driving unit. Since the frame is press-fit to the yoke plate and the PCB with several portions coated with the adhesive is fixedly attached to the frame, it is not necessary to use an engaging member such as a screw, so that its assembly can be improved and the frame and the PCB can be prevented from being shaken.

Abstract: A semiconductor chip stack package includes first and second semiconductor chips and a method for manufacturing the same are disclosed. Each chip has an active surface on which a plurality of electrode pads are formed, and a rear surface opposite to the active surface. The rear surfaces of the first and second chips face each other. The chip stack package further includes a single lead frame which has a plurality of leads that are disposed over and attached to the active surface of one of the first and second chips. Each electrode pad of the first and second chips is electrically connected to a corresponding one of the leads.

Abstract: An optical pick-up device includes: a yoke plate having yokes formed at a front side where a magnetic body and a magnetic driving coil are positioned to drive an objective lens; a frame molded to the yoke plate in such a manner that a portion of the rear side of the yoke plate is inserted thereinto; and a PCB with at least two portions fixed to the frame, for applying a drive signal to the magnetic driving unit. Since the frame is press-fit to the yoke plate and the PCB with several portions coated with the adhesive is fixedly attached to the frame, it is not necessary to use an engaging member such as a screw, so that its assembly can be improved and the frame and the PCB can be prevented from being shaken.

Abstract: A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim portion adapted to be attached to ends of the inner portions of the leads and a projecting portion that projects between the ends of the inner portions of the leads such that an upper surface of the projecting portion is in approximately the same plane as an upper surface of the inner portions of the leads. An insulative adhesive may be used to attach the ends of the inner portions of the leads to the rim portion of the heat spreader. Also, insulation members may be attached to upper surfaces of the ends of the inner portions of the leads for receiving a large size chip.