Patents by Inventor Hee-Seok JUNG

Hee-Seok JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10999957
    Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 4, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Nam Gyun Yim, Eun Bae Park, Hong Seok Lee, Jong Yun Kim, Woo Sung Jung, Mi Jung Kim, Chang Ju Lee, Hee Sun Oh
  • Publication number: 20210028567
    Abstract: A board mating connector includes a signal contact unit, a first ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit, a second ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit and at least a portion of the first ground portion, and an elastic member disposed between the first ground portion and the second ground portion to provide an elastic restoring force in a first direction. The first ground portion includes a first protrusion protruding outward or inward from a lower end portion thereof, and the second ground portion includes a second protrusion protruding from an upper end portion thereof in a direction different from that of the first protrusion. The first protrusion is engaged with the second protrusion in the hollow portion of the second ground portion.
    Type: Application
    Filed: June 19, 2020
    Publication date: January 28, 2021
    Inventors: Sun Hwa Cha, Hwa Yoon Song, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10804635
    Abstract: In one example, a board mating connector, in which a signal contact unit and a ground contact unit are interlocked, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a ground portion and another ground portion which is relatively moved in contact with the ground portion so as to be coupled to and interlocked with a connection portion through the dielectric unit.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: October 13, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10790604
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: September 29, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20200305287
    Abstract: A portable communication device is provided that includes a display including a display area and a connecting area extending from one side of the display area; a back panel disposed on a rear surface of the display, the back panel including an opening formed therein; a flexible printed circuit board (FPCB) connected with the connecting area; and a biometric sensor electrically coupled with the FPCB, with the connecting area being housed and bent within the portable communication device such that the biometric sensor is placed under the opening.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Inventors: Hyung Dal KIM, Oh Hyuck KWON, Han Vit KANG, Jun Young KIM, Moon Kyeong KIM, Sang Seob KIM, Jung Sik PARK, Hee Seok JUNG, Sung CHO, Heung Sik SHIN, Ji Woong OH
  • Patent number: 10750612
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: August 18, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20200259282
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10700456
    Abstract: A board-mating connector with a reduced coupling height includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 30, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10681803
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 9, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10681823
    Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: June 9, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hyung Dal Kim, Oh Hyuck Kwon, Han Vit Kang, Jun Young Kim, Moon Kyeong Kim, Sang Seob Kim, Jung Sik Park, Hee Seok Jung, Sung Cho, Heung Sik Shin, Ji Woong Oh
  • Patent number: 10622765
    Abstract: In one example, the present invention relates to a signal contact unit with ameliorated passive inter-modulation distortion (PIMD) characteristics, and a board mating connector including the same. The signal contact unit includes a housing which has a housing insertion hole of which one side is open; a contact portion which has a contact portion insertion hole of which the other side is open; and a signal spring which is inserted between the one side of the housing insertion hole and the other side of the contact portion insertion hole, wherein one side of the housing is partially inserted into the contact portion insertion hole, and in a state in which the signal spring is compressed, an inner side of the contact portion comes into contact with an outer side of the housing so that the housing and the contact portion are electrically connected.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 14, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: D886073
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: June 2, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee seok Jung
  • Patent number: D908097
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: January 19, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908637
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908638
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908639
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D909311
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: February 2, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D913945
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 23, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Jin Uk Lee, Hee seok Jung, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D914606
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 30, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D915286
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: April 6, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim