Patents by Inventor Hee-Sun Chun

Hee-Sun Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915880
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun Chun, Hyoung Uk Kim, Jae Sung Park, Hyeg Soon An, Ku Tak Lee, Eun Ha Jang
  • Patent number: 11894192
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode, wherein the dielectric layer includes a triple point in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point, wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode may be 1% by weight or less.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: February 6, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung In Baik, Hee Sun Chun, Jae Sung Park, Hyoung Uk Kim
  • Publication number: 20230411076
    Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 21, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun CHUN, Hui Sun PARK, Tae Hyung KIM, Jeong Wook SEO, Hyo Ju LEE, Hyeg Soon AN, Jin Woo KIM, Seok Hyun YOON
  • Patent number: 11830678
    Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/G1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Su Hong, Seung In Baik, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Publication number: 20230335338
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body. The dielectric layer includes a BaTiO3-based base material main ingredient, a sub-ingredient including Dy, and an additive. The additive is one or more of Sm, Gd and Tb, and a content of the additive is 25 mol or more and less than 50 mol relative to 100 mol of Dy. The dielectric layer includes a plurality of dielectric grains. When an average grain size of the plurality of dielectric grains is represented by G, and an average thickness of the dielectric layer is represented by td, 1.75?td/G?2.23 is satisfied.
    Type: Application
    Filed: August 31, 2022
    Publication date: October 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyeg Soon AN, Hui Sun PARK, Jeong Wook SEO, Tae Hyung KIM, Hee Sun CHUN, Hyo Ju LEE, Jin Woo KIM, Seok Hyun YOON
  • Patent number: 11791103
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1]?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyeg Soon An, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park, Je Hee Lee
  • Patent number: 11776750
    Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: October 3, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun Chun, Hui Sun Park, Tae Hyung Kim, Jeong Wook Seo, Hyo Ju Lee, Hyeg Soon An, Jin Woo Kim, Seok Hyun Yoon
  • Publication number: 20230253153
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Gi NAM, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hee Sun CHUN, Jae Sung PARK
  • Patent number: 11715596
    Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: August 1, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sung Park, Jeong Ryeol Kim, In Tae Seo, Jong Han Kim, Hyung Soon Kwon, Hee Sun Chun
  • Patent number: 11657971
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Gi Nam, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Publication number: 20230130377
    Abstract: A multilayer capacitor includes a body including a laminate structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer therebetween, and first and second external electrodes spaced apart on the body, to be connected to at least one first internal electrode and at least one second internal electrode, respectively. The body includes, in a larger molar content, at least one selected from the group consisting of Dy, Tb, Y, Sm, Ho, Gd, Er, Ce, La and Nd in a capacitance formation region including a region between at least one first internal electrode and at least one second internal electrode than in a margin region including a region between a boundary line of at least one first internal electrode and at least one second internal electrode and a surface of the body.
    Type: Application
    Filed: January 7, 2022
    Publication date: April 27, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Wook SEO, Hee Sun CHUN, Tae Hyung KIM, Hui Sun PARK, Hyeg Soon AN, Hyo Ju LEE, Jin Woo KIM, Seok Hyun YOON
  • Publication number: 20230126670
    Abstract: A ceramic electronic component includes: a body including an active portion, including a first dielectric layer and an internal electrode, and a margin portion disposed a side surface of the active portion and including a second dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The first and second dielectric layers have different dielectric compositions. The first dielectric layer includes tin (Sn) and dysprosium (Dy). The second dielectric layer includes magnesium (Mg).
    Type: Application
    Filed: January 6, 2022
    Publication date: April 27, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyung KIM, Hee Sun CHUN, Hyo Ju LEE, Hyeg Soon AN, Hui Sun PARK, Jeong Wook SEO, Jin Woo KIM, Seok Hyun YOON
  • Publication number: 20230129325
    Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.
    Type: Application
    Filed: January 10, 2022
    Publication date: April 27, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun CHUN, Hui Sun PARK, Tae Hyung KIM, Jeong Wook SEO, Hyo Ju LEE, Hyeg Soon AN, Jin Woo KIM, Seok Hyun YOON
  • Patent number: 11636979
    Abstract: A dielectric composition includes: a BaTiO3-based main component and a first accessory component, wherein the first accessory component includes dysprosium (Dy) and terbium (Tb), the sum (Dy+Tb) of contents of dysprosium (Dy) and terbium (Tb) is more than 1.5 mol and 2.0 mol or less based on 100 mol of Ti of the main component, and 0.1?Tb/Dy<0.15 in which Tb/Dy is a ratio of the content of terbium (Tb) to the content of dysprosium (Dy).
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 25, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun Chun, Hong Gi Nam, Je Hee Lee, Ji Su Hong, Seung In Baik, Jae Sung Park
  • Publication number: 20230119343
    Abstract: A dielectric composition includes a BaTiO3-based component as a main component, a donor component including a first element and a second element each having a shorter ionic radius and greater atomic weight than Ba, and an acceptor component including at least one of Mg, Al, Mn and V. An ionic radius of the second element is greater than an ionic radius of the first element, a molar content of the second element is less than a molar content of the first element, and a molar content of the acceptor component is greater than a molar content of the donor component.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 20, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hui Sun Park, Seok Hyun Yoon, Jin Woo Kim, Jeong Wook Seo, Hyeg Soon An, Tae Hyung Kim, Hyo Ju Lee, Hee Sun Chun
  • Publication number: 20220270822
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y)(Zr, Sn, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode, wherein the dielectric layer includes a triple point in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point, wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode may be 1% by weight or less.
    Type: Application
    Filed: September 3, 2021
    Publication date: August 25, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung In Baik, Hee Sun Chun, Jae Sung Park, Hyoung Uk Kim
  • Publication number: 20220270824
    Abstract: A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1] ?0.1?(Tm?Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.
    Type: Application
    Filed: October 13, 2021
    Publication date: August 25, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyeg Soon AN, Seung In BAIK, Ji Su HONG, Eun Ha JANG, Hee Sun CHUN, Jae Sung PARK, Je Hee LEE
  • Publication number: 20220230810
    Abstract: A ceramic electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a grain boundary disposed between adjacent grains, and GB1/B1 is 5 or more in mass ratio, where G1 is a content of Si of one of the plurality of grains and GB1 is a content of Si of the grain boundary.
    Type: Application
    Filed: October 20, 2021
    Publication date: July 21, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Su Hong, Seung In Baik, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Publication number: 20220230809
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.
    Type: Application
    Filed: October 12, 2021
    Publication date: July 21, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun CHUN, Hyoung Uk KIM, Jae Sung PARK, Hyeg Soon AN, Ku Tak LEE, Eun Ha JANG
  • Publication number: 20220223343
    Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sung PARK, Jeong Ryeol KIM, In Tae SEO, Jong Han KIM, Hyung Soon KWON, Hee Sun CHUN