Abstract: The invention relates to methods for manufacturing a rotor (14) for an electric machine (13), having the following method steps: a) manufacturing a magnetic element (8) by bonding permanent magnets (1, 1?, 1?, 1??) by means of a first adhesive, each permanent magnet (1, 1?, 1?, 1??) having a side with a magnetic North pole (N) and a side with a magnetic South pole (S), the permanent magnets (1, 1?, 1?, 1??) being arranged during bonding such that the sides of the magnetic North poles (N) or the sides of the magnetic South poles (S) form a common underside (3, 3?, 3?, 3??) of the magnetic elements (8), the first adhesive having a hard consistency in the cured state; and b) bonding the underside of the magnetic element (8) to a yoke (12) by means of a second adhesive, the second adhesive being soft and elastic in the cured state. Furthermore, the invention relates to an associated rotor.

Abstract: In a method for the production of a gradient encapsulation layer 20 on a piezoelectric actuator 1, based on this gradient encapsulation layer 20, the piezoelectric actuator 1 does not 5 require an additional housing-like enveloping structure in order to be protected externally. The gradient encapsulation layer 20 is produced by cold gas spraying of particles having different material properties.

Abstract: The invention relates to methods for manufacturing a rotor (14) for an electric machine (13), having the following method steps: a) manufacturing a magnetic element (8) by bonding permanent magnets (1, 1?, 1?, 1??) by means of a first adhesive, each permanent magnet (1, 1?, 1?, 1??) having a side with a magnetic North pole (N) and a side with a magnetic South pole (S), the permanent magnets (1, 1?, 1?, 1??) being arranged during bonding such that the sides of the magnetic North poles (N) or the sides of the magnetic South poles (S) form a common underside (3, 3?, 3?, 3??) of the magnetic elements (8), the first adhesive having a hard consistency in the cured state; and b) bonding the underside of the magnetic element (8) to a yoke (12) by means of a second adhesive, the second adhesive being soft and elastic in the cured state. Furthermore, the invention relates to an associated rotor.

Abstract: In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

Abstract: In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

Abstract: In a method for the production of a gradient encapsulation layer 20 on a piezoelectric actuator 1, based on this gradient encapsulation layer 20, the piezoelectric actuator 1 does not 5 require an additional housing-like enveloping structure in order to be protected externally. The gradient encapsulation layer 20 is produced by cold gas spraying of particles having different material properties.

Abstract: A thermally conductive and electrically insulating material, especially a paste, for mounting electrical and/or electronic components in housings and/or on cooling elements. The material is free of silicons and has a high filling ratio with moderate viscosity.

Abstract: A component involving a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure, wherein the barrier layer has the reaction product of an epoxy resin and a polymeric polyol.

Abstract: A method of producing a surface wave component with a drain for pyroelectric voltage includes forming electrically-conductive structures on a piezoelectric substrate. The structures form an acoustic path comprising an electroacoustic transducer. The method also includes forming a high-resistance layer on an entire surface of the substrate and on top of the electrically-conductive structures, and removing the high-resistance layer from at least a region corresponding to the electroacoustic transducer, such that at least a region outside the acoustic path remains covered by the high-resistance layer.

Abstract: A component involving a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure, wherein the barrier layer has the reaction product of an epoxy resin and a polymeric polyol.

Abstract: A method of encapsulating components based on organic semiconductors, includes adhesively bonding a housing to a substrate. Bonding is carried out using a UV-curable reactive adhesive including an epoxy resin, a hydroxy-functional reaction product of an epoxide compound with a phenolic compound, a silane-type adhesion promoter, and a photoinitiator, and also if desired, filler. This method is used in particular for encapsulating organic light-emitting diodes (OLEDs).

Abstract: In order to harmlessly dissipate pyroelectrical voltages in components on pyroelectric substrates, it is proposed to provide a high-resistance layer on the substrate. This may be applied over the entire surface, using the thin-layer method, and subsequently may be structured in such a way that electrically-conductive component structures remain uncovered.

Abstract: A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.

Abstract: The invention relates to a single-component adhesive system that consists at least of a casting resin, in particular of an epoxy casting resin, and a multivalent alcohol. The low-viscosity adhesive system can be microdosed, is stable in storage, is completely hardenable and is suitable for applications in which the dimensional tolerances are in the &mgr;m and sub-&mgr;m region.

Abstract: A rapid and precise cementing of components to a surface is achieved using a specially modified cement on an epoxy base in that the parts to be cemented are precisely aligned at the cemented location, are fixed with UV light and are subsequently thermally hardened.

Abstract: Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.

Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Abstract: An attenuating structure composed of an epoxy resin which cationically cures with UV initiation is proposed for a surface wave component. The solvent-free epoxy resin is based on a cycloaliphatic epoxide and is applied to the wafer by screen printing. When the wafers are sawn up, sawing through can be carried out without detaching or splintering off the attenuating material. Attenuation and corrosion behavior of the attenuating structures fulfill the requirements for surface wave filters.

Abstract: A one-component reactive resin system which is stable in storage but nevertheless can readily be cured completely comprises a mixture of commercially available epoxy resins and phosphorus-containing glycidyl esters, in particular phosphonic acid diglycidyl esters, as well as cationic photoinitiators. The low-viscosity reactive resin systems cannot be cured purely by means of heat and can be processed at high temperatures and in particular can have a high filler content. The reactive resin systems, which are stable to storage even after UV activation, can be cured to flame-resistant molded materials under moderate conditions.

Abstract: A radiation-curable reaction resin system, comprising a homogeneous solution of a thermoplastic and a reaction resin, whereby the proportion of the thermoplastic in the solution is approximately 3 to about 50% by weight. The reaction resin system has a stable shelf life. Further, the reaction resin system can be cured by radiation to form a shaped material, comprising a continuous and a discontinuous phase and which exhibits thermoplastic-like behavior.