Abstract: The arrangement focuses a combined laser beam (33) composed of individual laser beams produced by laser diodes (2) on a common spot. Prismatic reflecting bodies (7,8) are arranged in depressions (11,12) provided in a common substrate (1) between parallel rows (R1,R2; R3,R4) of the laser diodes (2). Each reflecting body (7,8) has oppositely inclined reflecting surfaces arranged on opposite sides thereof for deflection of the individual laser beams from the two adjacent rows of laser diodes. Two cylindrical lenses (9) are arranged on opposite sides of each reflecting body (7,8) between the laser diodes and the reflective surfaces to convert elliptical remote fields of the laser beams into circularly symmetric remote fields. Laterally movable focusing lenses (14) for each individual laser beam are arranged on the reflecting bodies (7,8) between the common spot and the reflecting surfaces for individual adjustment of the laser beams, whereby the combined laser beam (33) is focussed on the common spot.

Abstract: The invention is directed to a high-frequency semiconductor laser module with a silicon substrate, especially made of low-impedance silicon, a laser diode arranged thereon, and at least two lines for the H-F feed, one of which is insulated from the silicon substrate by a dielectric layer. According to the invention, the laser diode is arranged on the silicon substrate via a metallic mounting layer, and the H-F line is guided close to the laser diode on the dielectric layer.

Abstract: In the method of bonding two parts (1,2) together a positioning device (3) accurately positions the two parts (1,2) relative to each other and a comparatively slower hardening adhesive layer (4) is applied between the two parts (1,2) to bond the two parts (1,2) together. After the adhesive layer (4) is applied and the parts positioned, a faster hardening UV adhesive (5) is applied on adjacent edge regions of the two parts (1,2) over an edge of the slower hardening adhesive layer (4), so that the faster hardening UV adhesive (5) is accessible for UV irradiation. Subsequently the faster hardening UV adhesive (5) is hardened with the UV radiation and the positioning device (3) is removed from the parts (1,2) which are held fixed in a provisional manner. Then the slower hardening adhesive layer (4) is hardened preferably in an oven that can be used for a large number of similar pairs of parts.

Abstract: The circuit board (1) has a component (101) mounted on it by means of a soldering process which causes an automatic, passive alignment of the component (101) due to the surface tension in a melted piece of solder which electrically connects two pads (2, 102), one (102) of which is on the component and the other (2) of which is on the circuit board. Stand-offs (20) are used to provide a suitable spacing or distance between the component (101) and the circuit board (1). The other pad (2) has a surface that is divided into a central part (3) and an edge part (4), both wettable by the solder. The second or edge part (4) is shaped like a ring and surrounds the central part and is composed so that it is more slowly wettable by the solder than the central part. The spacing established by the stand-offs is dimensioned so that a melted piece of the solder between the pads produces a force drawing the component (101) toward the circuit board (1) because of surface tension in the melted solder.

Abstract: An optical, beam-splitting component has a prism carrier plate which supports a prism member upon which a deflecting layer is applied. At the same time, the prism member juts into a groove between two optical waveguides carrying the light signals.

Abstract: In the case of the above devices, accurate adjustment is very important; the devices ought, however, to be very compact. It is not sufficient to utilize the silicon etching technique for accuracy. The optical transmitting element (LD) is located on a first holder (T1), and the optical receiving element (PD) and the transmission fiber (Fa) are located on a third holder. Provided there between is a second holder (T2) which is transparent to the wavelength of the light emitted by the transmitting element (LD). The holders are structured by means of anisotropic etching in order to render it possible to receive the individual components. Furthermore, the holders lie flat on one another and can be so adjusted. A monitor diode (MD) is provided.

Abstract: The arrangement for coupling optoelectronic components and optical waveguides to one another includes a carrier substrate (11); at least one optoelectronic component (9) or one optical waveguide (1) secured on the carrier substrate (11) and at least one lens (8) provided with an essentially planar surface and a spherical surface located opposite the essentially planar surface. The carrier substrate is provided with a depression (5) for a lens (8) having walls and the lens (8) is inserted into the depression (5) so that the lens (8) rests with its spherical surface contacting the walls of the depression (5) at at least 3 points and is rotatable about its spherical curvature center point. An adjustment device for rotatably positioning the lens (8) in the depression and a method of securing the lens in position after an adjustment are described.

Abstract: The invention relates to an optical fiber amplifier having an amplification waveguide, having a pump source and having a wavelength-selective coupler. The pump light from the pump source is coupled into the amplification waveguide via the coupler. A carrier substrate (GS) is provided, on which passive (eg. couplers, dividers) and active components (eg. amplification waveguides) of the fiber amplifier are integrated. In addition, a silicon carrier (ST1) is provided, which is fitted to one end of the carrier substrate (GS). The silicon carrier (ST1) has anisotropically etched grooves with optical components. The pump source is fixed on the silicon carrier (ST1).The optical components on silicon carrier (ST1) and carrier substrate (GS) are adjusted in relation to one another.

Abstract: In the case of the above devices, exact adjustment is very important; however, the devices ought to be very compact. It is not sufficient to utilize the silicon etching technique for the precision. The optical transmitting element (LD) is situated on a first carrier (T1), the optical receiving element (PD) and the transmission fiber (Fa) are situated on a third carrier. Provided in between them is a second carrier (T2) which is transparent to the wavelength of the light emitted by the transmitting element (LD). The carriers are structured by means of anisotropic etching in order to make possible the accommodation of the individual components. In addition, the carriers lie flat on one another and can thus be adjusted. A monitor diode (MD) is provided. Application of the arrangement in all transmission systems having optical waveguides.