Abstract: A heat exchanger, in particular for fluid cooling devices, has a package of plane-parallel plates (1) with flow regions (3, 5) for a hot medium and for a cooling medium alternatively between pairs of plates (1) lying on top of one another. Each region is laterally bordered by profile strips (7, 11) keeping the plates (1) at a distance and forming solder surfaces (25) adjoining the plates (1). The profile strips (7, 11) on the flow regions (3, 5) extend along edges of the plates (1) and abut one another at an angle. The profile strips (11) of the flow regions (5) of the cooling medium having a base body (13), two legs (17) extending from the base body along the solder surfaces (25), and a recess (15) between the legs open toward the adjacent flow region (5). The recess (15) at least in the region adjacent to its inner end segment (23) is bordered by planar wall parts (29).

Abstract: A heat exchanger, in particular for fluid cooling devices, having a package of plane-parallel plates (1), with flow regions (3, 5) for a hot medium and for a cooling medium being formed in alternation between pairs of plates (1) lying on top of one another, said regions each being laterally bordered by profile strips (7, 11) which keep the plates (1) at a distance and which form solder surfaces (25) which adjoin the plates (1), the profile strips (7, 11) on the flow regions (3, 5) of one medium and the other medium extending along edges of the plates (1) abutting one another at an angle and at least the profile strips (11) of the flow regions (5) of the cooling medium having a base body (13), two legs (17) extending from the base body along the solder surfaces (25), and between the legs a recess (15) which is open toward the adjacent flow region (5), is characterized in that the recess (15) at least in the region adjacent to its inner end segment (23) is bordered by planar wall parts (29).