Patents by Inventor Hendrikus J.T.M. VAN DEN BERSSELAAR

Hendrikus J.T.M. VAN DEN BERSSELAAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a multi-layer printed circuit board
    Patent number: 9357640
    Abstract: A method of manufacturing a multi-layer printed circuit board by bonding together a plurality of circuit board layers, each of which includes a substrate and a conductive circuit pattern on at least one surface of the substrate, includes the steps of: coating the surface of the substrate with a continuous layer of conductive material, masking the layer with a resist, etching away a part of the conductive material so as to obtain the circuit pattern with conductive parts separated by gaps, and filling the gaps with an electrically insulating adhesive material to a level that is at least equal to the thickness of the layer of conductive material. The resist is left on the conductive parts and the adhesive material is selected to be chemically compatible with the resist.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: May 31, 2016
    Assignee: OCE'-TECHNOLOGIES B.V.
    Inventor: Hendrikus J. T. M. Van den Bersselaar
  • METHOD OF MANUFACTURING A MULTI-LAYER PRINTED CIRCUIT BOARD
    Publication number: 20160088741
    Abstract: A method of manufacturing a multi-layer printed circuit board by bonding together a plurality of circuit board layers, each of which includes a substrate and a conductive circuit pattern on at least one surface of the substrate, includes the steps of: coating the surface of the substrate with a continuous layer of conductive material, masking the layer with a resist, etching away a part of the conductive material so as to obtain the circuit pattern with conductive parts separated by gaps, and filling the gaps with an electrically insulating adhesive material to a level that is at least equal to the thickness of the layer of conductive material. The resist is left on the conductive parts and the adhesive material is selected to be chemically compatible with the resist.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 24, 2016
    Applicant: Océ-Technologies B.V.
    Inventor: Hendrikus J.T.M. VAN DEN BERSSELAAR