Patents by Inventor Heng JIANG

Heng JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097191
    Abstract: An isocyanate electrolyte solution additive containing a sulfamide structural group has a structure of formula I: where R1 and R2 are identical or different, R1 and R2 are each independently selected from methyl, ethyl, butyl, methoxy, methanesulfonyl, ethanesulfonyl, fluorosulfonyl, trifluoromethanesulfonyl, perfluoroethylsulfonyl, benzenesulfonyl, alkyl-containing benzenesulfonyl, cyano/fluorobenzenesulfonyl and alkoxy-containing benzenesulfonyl, and R1 and R2 can be linked to form one of five-membered ring or six-membered ring. In the electrolyte solution additive, sulfonyl and the isocyanate structural group are organically linked, so the electrolyte solution additive has good thermostability, can function as an electrolyte solution stabilizing agent and avoids high temperature discoloration and acid value increase of the electrolyte solution.
    Type: Application
    Filed: October 16, 2023
    Publication date: March 21, 2024
    Applicant: Valiant Co., Ltd
    Inventors: Huanjie WANG, Yu SHI, Cunsheng LIN, Shanguo ZHANG, Liqi XUAN, Heng JIANG
  • Patent number: 11934030
    Abstract: The present disclosure provides an optical lens, which includes a first lens member, a second lens member and a first adhesive. The first lens member includes at least one first lens. The second lens member includes a second lens barrel and at least one second lens mounted in the second lens barrel. The at least one second lens and the at least one first lens together forms an imaging optical system. The second lens member has a second optical region and a second structural region surrounding the second optical region. The second structural region has a second top surface and the second top surface has a groove. The first adhesive locates in a first gap between the first lens member and the second lens member, and the first adhesive is accommodated in the groove. The first adhesive is adapted to flow in the groove when uncured.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: March 19, 2024
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Takehiko Tanaka, Heng Jiang
  • Publication number: 20240088443
    Abstract: The present disclosure relates to an isocyanate electrolyte solution additive based on an imidazole structural group, belonging to the technical field of non-aqueous electrolyte solution additives of lithium batteries. The structural formula of the electrolyte solution additive is represented by formula I: R1, R2 and R3 are identical or different, the R1, R2 and R3 are each independently selected from one of hydrogen, methyl, ethyl, propyl, tert-butyl, trifluoromethyl, trifluoroethyl, perfluoroethyl, perfluoropropyl, cyanoethyl, phenyl, fluorophenyl, cyano-containing fluorophenyl, alkoxy-containing phenyl and alkyl-containing phenyl. The electrolyte solution additive is used for lithium ion batteries, which effectively inhibits the reduction in battery capacity, restricts the production of a gas caused by decomposition of an electrolyte solution and significant improvement in the service life of the battery during the high temperature cycle and high temperature storage.
    Type: Application
    Filed: October 16, 2023
    Publication date: March 14, 2024
    Applicant: Valiant Co., Ltd
    Inventors: Shaobang FU, Cunsheng LIN, Yu SHI, Shanguo ZHANG, Liqi XUAN, Heng JIANG
  • Patent number: 11899268
    Abstract: An optical lens, comprising: a first lens component (100) comprising a first lens barrel (101) and at least one first lens sheet (102) mounted in the first lens barrel; a second lens component (200) comprising a second lens barrel (201) and at least one second lens sheet (202) mounted in the second lens barrel, the at least one second lens sheet and the at least one first lens sheet together constituting an imageable optical system; and an adhesive bonding the first lens component and the second lens component together, at least a part of the adhesive being interposed between a lens barrel and a lens sheet, wherein the statement of between the lens barrel and the lens sheet specifically means between the second lens barrel and the first lens sheet or between the first lens barrel and the second lens sheet. A corresponding assembly method for optical lens, a camera module, an optical lens and assembly method for camera module are further provided.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: February 13, 2024
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Shuijia Chu, Heng Jiang, Lin Liu, Enlai Xiang, Kailun Zhou
  • Patent number: 11874518
    Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: January 16, 2024
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Bojie Zhao, Nan Guo, Liang Ding
  • Patent number: 11874584
    Abstract: A split lens assembly module, comprising: a focusing mechanism; and a lens assembly, wherein the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the fixing lens assembly, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: January 16, 2024
    Inventors: Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Nan Guo, Hong Li, Bojie Zhao, Liang Ding
  • Patent number: 11867965
    Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: January 9, 2024
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen, Nan Guo, Heng Jiang
  • Publication number: 20230387150
    Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.
    Type: Application
    Filed: August 3, 2023
    Publication date: November 30, 2023
    Inventors: Chien-Chang Huang, Chien Nan Tu, Ming-Chi Wu, Yu-Lung Yeh, Ji Heng Jiang
  • Patent number: 11830892
    Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: November 28, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Huang, Chien Nan Tu, Ming-Chi Wu, Yu-Lung Yeh, Ji Heng Jiang
  • Patent number: 11824071
    Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: November 21, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Zhongyu Luan, Heng Jiang
  • Patent number: 11822099
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: November 21, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Publication number: 20230300442
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Applicant: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
  • Patent number: 11743569
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: August 29, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
  • Patent number: 11728368
    Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 15, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang, Nan Guo
  • Patent number: 11729483
    Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: August 15, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi, Takehiko Tanaka, Bojie Zhao, Heng Jiang, Ye Wu, Zilong Deng
  • Publication number: 20230225380
    Abstract: A frozen stuffed fish ball with low soup loss and the method of preparing the same. By combining hydrocolloid and oil pre-emulsification technology, the problems of taste of powder, soup loss of fish balls after freeze-thaw cooking and the taste of frozen stuffed fish balls after freeze-thaw cooking are solved. The use of konjac gum and carrageenan or curdlan respectively, combined with oil pre-emulsification technology, also effectively improves the texture and brightness of the outer skin of fish balls. Compared with a single addition of conventional technology, the hardness, elasticity and brightness are increased, solving loosen structure, brightness and other problems due to freeze-thaw cycle. Further, it may be used in the fish ball processing line for preparing fish ball with fillings and other stuffed surimi products.
    Type: Application
    Filed: December 23, 2022
    Publication date: July 20, 2023
    Inventors: Yanshun XU, Heng JIANG, Lixin FAN, Jianlian HUANG, Dongna RUAN, Cikun LIU, Xu CHEN, Wenshui XIA, Yuan YAO, Dawei YU
  • Patent number: 11706516
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: July 18, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
  • Patent number: 11627239
    Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: April 11, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang, Nan Guo, Fengsheng Xi, Heng Jiang, Zilong Deng
  • Patent number: 11570336
    Abstract: A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: January 31, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Feifan Chen, Liang Ding, Nan Guo, Ye Wu, Heng Jiang
  • Publication number: 20230018070
    Abstract: A rechargeable zinc metal battery cell includes a zinc metal anode, a cathode, a porous separator between them, and an electrolyte composition absorbed by the porous separator and in contact with both anode and cathode. The electrolyte composition includes (i) an aqueous solution of zinc chloride at a concentration greater than 15 molal, and (ii) dimethyl carbonate present at a mass ratio between 0.1:1.0 and 1.0:1.0 with respect to water in the aqueous solution. In some examples: the anode includes zinc metal foil stacked on titanium metal foil; the cathode includes vanadium(V) phosphate; the porous separator includes glass fibers and is less than 200 ?m thick; or the electrolyte composition includes (i) an aqueous solution of 30 molal zinc chloride, 5 molal lithium chloride, and 10 molal trimethyl ammonium chloride, and (ii) dimethyl carbonate present at a mass ratio of 1.0:1.0 with respect to water in the aqueous solution.
    Type: Application
    Filed: July 18, 2022
    Publication date: January 19, 2023
    Inventors: Xiulei Ji, Heng Jiang