Abstract: The fluid philicity/phobicity adjustable surface structure is provided to hold a liquid. The surface structure includes a base and many small bumps located on the base. The small bumps are boxy in shape. Every small bump has at least one corner boundary, and the corner boundary is defined as a sudden change of the surface orientation. The gap between every two adjacent small bumps is smaller than the shortest cohesion diameter of the liquid. Additionally, the contact angle between the liquid and the hydrophilic hydrophobic adjustable surface structure is ? which satisfies the condition: ?*???(180??)+?*, where ?* is the contact angle between the base and the liquid, ? is the boundary edge angle of the small bump.

Abstract: The fluid philicity/phobicity adjustable surface structure is provided to hold a liquid. The surface structure includes a base and many small bumps located on the base. The small bumps are boxy in shape. Every small bump has at least one corner boundary, and the corner boundary is defined as a sudden change of the surface orientation. The gap between every two adjacent small bumps is smaller than the shortest cohesion diameter of the liquid. Additionally, the contact angle between the liquid and the hydrophilic/hydrophobic adjustable surface structure is ? which satisfies the condition: ?*???(180??)+?*, where ?* is the contact angle between the base and the liquid, ? is the boundary edge angle of the small bump. In detail, the boundary edge angle ? is the solid edge angle subtended by the two surfaces forming the edge, and ? is smaller than 180 degrees.

Abstract: A cutting fluid for processing is revealed. The cutting fluid for wafer processing includes a cutting solvent, a plurality of cutting particles and a surfactant that induces hydrogen bonding. The surfactant that induces hydrogen bonding contains amine functional groups or acid functional groups. The hydrogen-bonding-inducing surfactant is used to form intermolecular hydrogen bonding so as to improve the suspension stability of the cutting particles in the cutting fluid. The surfactant that induces hydrogen bonding will not change the properties of the cutting fluid so that the following processes will not be affected.