Patents by Inventor Henkel Corporation

Henkel Corporation has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140061240
    Abstract: The present invention is a two-component fluid dispensing system. In particular, the present invention relates to a two-component fluid dispensing system that uses a dual rotor pump for precision ratio metering and precision fluid flow shut off of a mixed fluid.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 6, 2014
    Inventors: HENKEL CORPORATION, HENKEL AG & CO. KGaA
  • Publication number: 20140024781
    Abstract: Disclosed is a moisture-curable hot melt adhesive which has a high initial adhesive strength and is also excellent in adhesion to a slightly adhesive material. This adhesive comprises an urethane prepolymer having an isocyanate group at its end, and (A) an acrylic polymer, wherein the acrylic polymer has a polymer (A1) containing a moiety derived from a (meth)acrylic acid derivative (a1) having an alkyl group with 6 or more carbon atoms. In some embodiments the acrylic polymer (A) has an alicyclic structure.
    Type: Application
    Filed: February 19, 2013
    Publication date: January 23, 2014
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • Publication number: 20130287980
    Abstract: Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more additives. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer.
    Type: Application
    Filed: March 12, 2013
    Publication date: October 31, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • Publication number: 20130207005
    Abstract: An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 15, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130210239
    Abstract: A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 15, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130202787
    Abstract: The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130202902
    Abstract: The invention provides stretch film laminant adhesives, methods of using the adhesives to bond substrates together, and to articles of manufacture comprising the adhesives. It has been discovered that a stretch film lamination adhesive, which comprises a metallocene catalyzed polyolefin copolymer with a density greater or equal to 0.870 g/cm3 and a peak melting point greater than 100° C., a plasticizer having a number average molecular weight greater than 1,000 g/mol, and a tackifier with a softening point greater than 110° C., has high creep resistance and low plasticizer migration and bleed-through making them particularly well suited for disposable personal care garments.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130203900
    Abstract: The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicants: HENKEL CORPORATION, HENKEL AG & CO. KGAA
    Inventors: HENKEL AG & CO. KGAA, HENKEL CORPORATION
  • Publication number: 20130197130
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130197158
    Abstract: Highly-oriented graphene polymer nanocomposites are produced from an aqueous dispersion of graphene oxide in polyurethane latex followed by chemical reduction to form graphene sheets.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130196472
    Abstract: A method for preparing a semiconductor with preapplied underfill comprises (a) providing a thinned silicon semiconductor wafer having a plurality of metallic bumps on its active face and, optionally, through-silica-vias vertically through the silicon semiconductor wafer; (b) providing an underfill material on a dicing support tape, in which the underfill material is precut to the shape of the semiconductor wafer; (c) aligning the underfill material on the dicing support tape with the semiconductor wafer and laminating the underfill material to the semiconductor wafer.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130189532
    Abstract: Moisture curable poly(acrylate) compositions having more environmentally acceptable catalysts and/or faster skin over time. The compositions demonstrate resistance to hydrocarbon fluids, such as transmission fluids, oils and fuels and are useful as gasketing materials.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Applicants: Henkel AG & Co. KGaA, Henkel Corporation
    Inventors: Henkel Corporation, Henkel AG & Co. KGaA
  • Publication number: 20130187102
    Abstract: A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
    Type: Application
    Filed: March 13, 2013
    Publication date: July 25, 2013
    Applicants: HENKEL CORPORATION, HENKEL AG & CO. KGAA
    Inventors: HENKEL AG & CO. KGAA, HENKEL CORPORATION
  • Publication number: 20130184384
    Abstract: The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 18, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130178585
    Abstract: A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 11, 2013
    Applicant: HENKEL CORPORATION
    Inventor: Henkel Corporation
  • Publication number: 20130171651
    Abstract: The present invention is directed to methods of measuring the degree of cure or solidification of a composition. Desirably, such methods are quantitative and ascertain the degree of cure or solidification in a non-destructive manner such that they are adaptable for on-line, real-time monitoring.
    Type: Application
    Filed: February 26, 2013
    Publication date: July 4, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • Publication number: 20130165600
    Abstract: Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 27, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • Publication number: 20130160945
    Abstract: An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.
    Type: Application
    Filed: February 25, 2013
    Publication date: June 27, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130158176
    Abstract: It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
    Type: Application
    Filed: February 20, 2013
    Publication date: June 20, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Publication number: 20130146223
    Abstract: The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one ?,?-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins.
    Type: Application
    Filed: February 1, 2013
    Publication date: June 13, 2013
    Applicants: Henkel Corporation, Henkel AG Co., KGaA
    Inventors: Henkel AG & Co. KGaA, Henkel Corporation