Abstract: A two part, curable, epoxy composition useful for potting or sealing electrical devices for use in hazardous locations. Cured reaction products of the epoxy composition meet most or all UL 674 requirements and are useful to seal apertures in electrical equipment. Equipment sealed with the disclosed compositions can meet the UL 674 requirement.

Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.

Abstract: This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60° C. and 100° C.

Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: A two component polyurethane adhesive composition having one or more polyols as a first component and one or more isocyanates as a second component. The composition also comprises a catalyst and a hydroxyalkyl-8-hydroxy quinoline blocking agent to delay the initial part of the curing reaction. The blocking agent links to the adhesive matrix during cure. The composition provides long open time, improved wet out of the substrates to be bonded, a rapid cure rate and bonding of the blocking agent to the cured adhesive matrix. The adhesive is useful to bond layers of a flexible food pouch sheet. Also a flexible food pouch made using the adhesive.

Abstract: Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided.

Abstract: Curable compositions, such as oxazine-based ones, are useful in applications within the aerospace industry, such as for example as a thermosetting resin composition for use as a matrix resin in processes, such as resin transfer molding, vacuum assisted transfer molding, resin film infusion, prepregging and towpregging, where the composites or laminates so prepared have superior surface finish and high fiber consolidation.

Abstract: Aqueous polyurethane dispersions made from aromatic polyisocyanates and mixtures of aromatic polyisocyanates and compositions thereof are provided. Advantageously, the methods disclosed herein provide aqueous polyurethane dispersions which are produced more economically with no added organic solvent in the aqueous polyurethane dispersions. Such polyurethane dispersions are environmentally friendly and are useful as adhesives, sealants and coatings for laminating or bonding substrates such as paper, wood, metals, plastics and other synthetic materials.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: Macro-photoinitiators having defined polymer chain structure are provided. The macro-photoinitiators are terminated with residues of thiol and/or hydroxyl functional photoinitiators. The macro-photoinitiators may be prepared by controlled radical polymerization methods, such as atom transfer radical polymerization and single electron transfer polymerization methods. Also provided are curable (e.g., photocurable) compositions that include the macro-photoinitiators of the present invention.