Patents by Inventor Henry L. Pfizenmayer

Henry L. Pfizenmayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6163063
    Abstract: A semiconductor device (10) is formed to have multiple external connection pads (17, 18) for an active element (12). The multiple external connection pads (17, 18) are electrically connected together with a electrical link (19). After testing, the electrical link (19) is removed to disconnect the multiple external connection pads (17, 18) from each other.
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: December 19, 2000
    Assignee: Motorola, Inc.
    Inventor: Henry L. Pfizenmayer
  • Patent number: 6140212
    Abstract: A semiconductor device (10) is formed to have multiple external connection pads (17, 18) for an active element (12). The multiple external connection pads (17, 18) are electrically connected together with a electrical link (19). After testing, the electrical link (19) is removed to disconnect the multiple external connection pads (17, 18) from each other.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: October 31, 2000
    Assignee: Motorola, Inc.
    Inventor: Henry L. Pfizenmayer
  • Patent number: 5751555
    Abstract: An electronic component with reduced capacitance includes a substrate (12) with an interconnect line (14), an additional substrate (11) with an interconnect line (13) wherein the substrate (12) overlies the additional substrate (11), an electronic device (15) overlying the substrate (12) and electrically coupled to the interconnect line (14) of the substrate (12), and an additional electronic device (17) having a lead (23) and an additional lead (26) wherein the lead (23) overlies the substrate (12) and is electrically coupled to the interconnect line (14) of the substrate (12) and wherein the additional lead (26) overlies the additional substrate (11) and is electrically coupled to the interconnect line (13) of the additional substrate (11).
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: May 12, 1998
    Assignee: Motorola, Inc.
    Inventors: Henry L. Pfizenmayer, Frederick C. Wernett, III
  • Patent number: 5650920
    Abstract: A transformer mount (11) supports a transformer (12) over a component (22) on a substrate (23) of a hybrid module (10). The transformer mount (11) conserves space in the hybrid module (10), improves high frequency performance by minimizing parasitic capacitances and inductances of the transformer mount (11), is compatible with subsequent high temperature and batch processing for faster assembly, permits the flow of defluxing materials beneath the transformer mount (11), is inexpensive, and provides appropriate access to fine tune the transformer (12) during assembly.
    Type: Grant
    Filed: July 27, 1995
    Date of Patent: July 22, 1997
    Assignee: Motorola, Inc.
    Inventor: Henry L. Pfizenmayer
  • Patent number: 4965526
    Abstract: Hybrid RF amplifiers of improved performance are obtained by arranging film resistors, metallization and other components on a circuit board so that symmetrical parts of the electrical circuit are arranged in a mirror symmetrical fashion about a line extending along the circuit board and by aligning symmetrical resistors either parallel or orthogonal to this line and by utilizing common ground metal regions to terminate resistors that are aligned and orthogonal to the mirror line and spaced apart but joined to a common ground at a single location.
    Type: Grant
    Filed: July 14, 1989
    Date of Patent: October 23, 1990
    Assignee: Motorola Inc.
    Inventors: Scott Craft, Henry L. Pfizenmayer, Frederick C. Wernett