Patents by Inventor Heribert Rester

Heribert Rester has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6081048
    Abstract: A modular peripheral unit, which monitoring a technical process, includes a base module to which at least one expansion module can be attached in series, the modules each having a module upper part and a module lower part, as well as having at least one profile permitting serial attachments. The module lower parts have a multiplicity of essentially U-shaped contact elements in the region of the profile with which they can be attached in series. One limb of the contact elements extends into the interior of the module lower part, such that the multiplicity of these limbs form an internal male contact strip and the multiplicity of remaining limbs of the contact elements form an external male contact strip. When an expansion module is attached in series, the external male contact strip engages in the expansion module such that the external male contact strip is opposite the internal male contact strip of the expansion module which is attached in series.
    Type: Grant
    Filed: October 22, 1998
    Date of Patent: June 27, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Martin Bergmann, Heribert Rester, Reinhard Schirbl
  • Patent number: 6019627
    Abstract: A plug connector having a two-part housing formed of a lower part and a cover. The cover is used as a pressure clamping plate during connection of the two housing parts by screws and presses insulated individual conductors of a connecting cable, which have previously been inserted into guides disposed in the lower part of the housing into insulation displacement connection (IDC) contacts. The IDC contacts that are fixed in the lower part between the guides, and firmly clamps the connecting cable in a cable entry of the housing.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: February 1, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Georges Embo, Heribert Rester, Tom Debrouwere, Christophe Vermaete
  • Patent number: 4969066
    Abstract: An electronic module includes two printed-circuit boards which are equipped with hybrid assemblies. The electronic module takes up only a small amount of space and, at the same time, efficiently dissipates the heat loss caused by the hybrid assemblies. The hybrid assemblies are arranged in such a manner that they can be interspersed with one another, similar to a sandwich-type construction. The interspersing provides duct-type, perpendicularly aligned interspaces between the hybrid assemblies, allowing the heat loss to be dissipated in a chimney-like fashion.
    Type: Grant
    Filed: June 30, 1989
    Date of Patent: November 6, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventors: Erwin Eibl, Heinz Schmidt, Heribert Rester
  • Patent number: D573098
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: July 15, 2008
    Assignee: Siemens Aktiengesellschaft
    Inventors: Martin Bergmann, Markus Donderer, Hermann Kasowski, Stefan Preischl, Heribert Rester