Abstract: The embodiments relate to a polyamide-based film excellent in optical properties such as transmittance, haze, and yellow index and mechanical properties such as modulus and thickness uniformity, to a process for preparing the same, and to a cover window and a display device comprising the same. The polyamide-based film comprises a polyamide-based polymer and has an XRD pattern comprising a first peak whose highest point is located in a section where 2? is 14° to 16°.

Abstract: A resin film for laminated glass, laminated glass including the resin film, and a process for manufacturing the laminated glass are disclosed. The resin film for laminated glass comprises a resin layer comprising a polyvinyl acetal resin and a contact surface in direct contact with glass, wherein the contact surface has an Rz roughness of 25 to 90 ?m and a maximum static friction coefficient at 20° C. of 0.85 to 1.60, and the compressive elastic deformation index measured in the perpendicular direction from the contact surface at 35° C. is 40 to 310 ?m/N.

Abstract: The polymer film according to an embodiment comprises at least one polymer resin selected from the group consisting of a polyamide-based resin, a polyimide-based resin, and a polyamide-imide-based resin, and has a haze of 0.6% or less and an in-plane retardation within a specific range for each wavelength band in the visible light region. The polymer film, which has an in-plane retardation within a specific range for each wavelength band in the visible light region, is excellent in transparency and optical properties, and it can remarkably reduce the rainbow phenomenon and improve the reflection appearance.

Abstract: Embodiments relate to a polyamide-based film that is colorless and transparent, is excellent in mechanical properties and optical properties, has a wide angle of view by securing at least a certain level of luminance at various angles, and, in particular, has gloss characteristics similar to those of glass, a process for preparing the same, and a cover window comprising the same. The polyamide-based film comprises a polyamide-based polymer, wherein when the polyamide-based film is placed on a surface light source, light is irradiated from the surface light source, and the luminance value (L0) measured in the normal direction of the surface light source is 100%, the luminance value (L50) measured in the direction of 50° from the normal direction of the surface light source is 25% or more.

Abstract: A resin film for laminated glass, laminated glass including the resin film, and a process for manufacturing the laminated glass are disclosed. The resin film for laminated glass comprises a resin layer comprising a polyvinyl acetal resin and a contact surface in direct contact with glass, wherein the contact surface has an Rz roughness of 25 to 90 ?m and a maximum static friction coefficient at 20° C. of 0.85 to 1.60, and the compressive elastic deformation index measured in the perpendicular direction from the contact surface at 35° C. is 40 to 310 ?m/N.

Abstract: Embodiments relate to a resin film for laminated glass, laminated glass comprising the resin film, and a process for manufacturing the laminated glass. The resin film for laminated glass comprises a resin layer comprising a polyvinyl acetal resin and a contact surface in direct contact with glass, wherein the contact surface has an Rz roughness of 25 to 90 ?m and a maximum static friction coefficient at 20° C. of 0.85 to 1.60, and the compressive elastic deformation index measured in the perpendicular direction from the contact surface at 35° C. is 40 to 310 ?m/N.

Abstract: Embodiments relate to a resin film for laminated glass, laminated glass comprising the resin film, and a process for manufacturing the laminated glass. The resin film for laminated glass comprises a resin layer comprising a polyvinyl acetal resin and a contact surface in direct contact with glass, wherein the contact surface has an Rz roughness of 25 to 90 ?m and a maximum static friction coefficient at 20° C. of 0.85 to 1.60, and the compressive elastic deformation index measured in the perpendicular direction from the contact surface at 35° C. is 40 to 310 ?m/N.

Abstract: An image sensor with a high dynamic range is provided. The image sensor includes a semiconductor substrate, a plurality of light-receiving elements formed on the semiconductor substrate, and light-shield films formed on upper ends of some of the light-receiving elements to partially block light incident upon each of the some light-receiving elements. Hence, an image sensing device including the image sensor can detect an accurate image regardless of whether the environment is bright or dark.