Patents by Inventor Hideaki Korai

Hideaki Korai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8715451
    Abstract: [Problem to be Solved] When a wood raw material is heat-pressed in order to produce a woody material or woody board, steam is generated in an interior of the wood raw material. The heat-pressed wood raw material is then decompressed with the steam staying in the interior of the wood raw material. This causes a puncture or a rupture of the woody material. The puncture occurs in the last phase of the production process, thus spoiling the entire production process. In order to avoid the puncture, the wood raw material needs to be dried completely. This requires a large amount of energy.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: May 6, 2014
    Assignees: Forestry and Forest Products Research Institute, Swood Company Limited
    Inventors: Hideaki Korai, Atsushi Sumida, Takayoshi Osada, Osamu Yasuda, Keishi Tanaka
  • Publication number: 20100326583
    Abstract: Improved adhesives with significantly-enhanced bond strength is provided in accordance with the present invention, in particular by adding a bond-strength enhancing agent comprising particles to a binder. Such adhesives can be used in a process of producing a woody board, which results in a substantial reduction in amount of the adhesive used, thus leading to a reduction in overall woody board production costs. Methods for producing a woody board are also provided. The method includes the steps of: coating or spraying an adhesive composition on a wood raw material that is an aggregate composed of wood chips; forming the wood raw material coated or sprayed with the adhesive composition into a specified shape; and heat-pressing the wood raw material formed into the specified shape and again forming the heat-pressed wood raw material into the specified shape. The adhesive composition is obtained by adding a bond-strength enhancing agent composed of particles to an adhesive.
    Type: Application
    Filed: June 9, 2010
    Publication date: December 30, 2010
    Applicant: Forestry and Forest Products Research Institute
    Inventor: Hideaki Korai
  • Publication number: 20100101721
    Abstract: [Problem to be Solved] When a wood raw material is heat-pressed in order to produce a woody material or woody board, steam is generated in an interior of the wood raw material. The heat-pressed wood raw material is then decompressed with the steam staying in the interior of the wood raw material. This causes a puncture or a rupture of the woody material. The puncture occurs in the last phase of the production process, thus spoiling the entire production process. In order to avoid the puncture, the wood raw material needs to be dried completely. This requires a large amount of energy.
    Type: Application
    Filed: October 19, 2009
    Publication date: April 29, 2010
    Applicants: Forestry and Forest Products Research Institute, Shinwa Wood Industrial Co. Ltd.
    Inventors: Hideaki Korai, Atsushi Sumida, Takayoshi Osada, Osamu Yasuda, Keishi Tanaka
  • Patent number: 6602451
    Abstract: A wooden material is made by bonding together with a binder resin, ozonized wood elements obtained by acetylating wood elements and then ozonizing the acetylated wood elements.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: August 5, 2003
    Assignees: Forestry and Forest Product Research Institute, Yamaha Corporation
    Inventors: Hideaki Korai, Makoto Kiguchi, Ritsuo Iwata, Yoshihiro Hirano, Satoshi Suzuki
  • Patent number: 5814170
    Abstract: A multi-layered composite building material is provided which allows effective utilization of forest resources by using so-called low quality materials such as small-diameter wood, old wood, pieces of wood produced as byproducts of lumbering, and/or bamboo. The material can meet various requirements and properties, and can be produced at a low cost. In a structural layer, an adhesive agent is applied to a plurality of finely split pieces which are formed by finely splitting a raw material such as wood or bamboo. The finely split pieces are arranging in parallel to a fiber direction. A shock/vibration-absorbing layer is formed by applying an adhesive agent to small pieces of wood and bamboo and the like. Structural layers and shock/vibration-absorbing layers are alternately arranged to provide a multi-layered structure. The structure is press-molded to a predetermined thickness and optionally heated such that the layers are adhered together to produce the composite multi-layered material.
    Type: Grant
    Filed: February 24, 1997
    Date of Patent: September 29, 1998
    Assignee: The Forestry and Forest Research Institute
    Inventors: Tatsuya Shibusawa, Sumire Kawamoto, Hideaki Korai, Tsuyoshi Fujii
  • Patent number: 5786063
    Abstract: A multi-layered composite building material is provided which allows effective utilization of forest resources by using so-called low quality materials such as small-diameter wood, old wood, pieces of wood produced as byproducts of lumbering, and/or bamboo. The material can meet various requirements and properties, and can be produced at a low cost. In a structural layer, an adhesive agent is applied to a plurality of finely split pieces which are formed by finely splitting a raw material such as wood or bamboo. The finely split pieces are arranging in parallel to a fiber direction. A shock/vibration-absorbing layer is formed by applying an adhesive agent to small pieces of wood and bamboo and the like. Structural layers and shock/vibration-absorbing layers are alternately arranged to provide a multi-layered structure. The structure is press-molded to a predetermined thickness and optionally heated such that the layers are adhered together to produce the composite multilayered material.
    Type: Grant
    Filed: December 2, 1996
    Date of Patent: July 28, 1998
    Assignee: The Forestry and Forest Products Research Institute
    Inventors: Tatsuya Shibusawa, Sumire Kawamoto, Hideaki Korai, Tsuyoshi Fujii