Abstract: A projector includes an input unit configured to receive an image signal, a display configured to display an image based on the image signal received by the input unit, an image displacement unit configured to change a position of the image to be displayed by the display, and a control unit configured to control a driving signal to drive the image displacement unit. An output timing of the driving signal is changed based on a frequency of the image signal.

Abstract: A projector includes an input unit configured to receive an image signal, a display configured to display an image based on the image signal received by the input unit, an image displacement unit configured to change a position of the image to be displayed by the display, and a control unit configured to control a driving signal to drive the image displacement unit. An output timing of the driving signal is changed based on a frequency of the image signal.

Abstract: A projector includes: an I/F unit to which an image signal is input; a display unit that displays an image based on the image signal input to the I/F unit; a shift device that changes a position of an image to be displayed by the display unit; a signal processing unit that outputs a driving signal to the shift device and drives the shift device; and a shift control unit that controls the driving signal output by the signal processing unit. The shift control unit changes an output timing of the driving signal to correspond to a change in a frequency of the image signal.

Abstract: A projector includes: an I/F unit to which an image signal is input; a display unit that displays an image based on the image signal input to the I/F unit; a shift device that changes a position of an image to be displayed by the display unit; a signal processing unit that outputs a driving signal to the shift device and drives the shift device; and a shift control unit that controls the driving signal output by the signal processing unit. The shift control unit changes an output timing of the driving signal to correspond to a change in a frequency of the image signal.

Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.

Abstract: Difference between light intake quantities just from a front and from an upper direction is reduced in an illuminance sensor. A light-guiding member includes a light-guiding member base part, a compound light-guiding part and an infrared light receiving light-guiding part. Side surface parts each extending backward are formed at right and left ends of the light-guiding member base part. The compound light-guiding part includes a front square column part extending frontward from the light-guiding member base part, a back square column part extending backward therefrom, and a round column part extending frontward from the front square column part. A plurality of slits are formed in the light-guiding member base part such that boundaries of base portions of the front square column part and the back square column part communicate with each other.

Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.

Abstract: Provided is technology that stably fixes a plurality of harnesses all at once, without using a wire holder. A line-shaping section 30 for routing harnesses 99 is created in a front cabinet forming section 20. The line-shaping section 30 comprises two ribs 40 separated by a prescribed distance and a hook 50 positioned in the center thereof and created so as to cover from the top, when viewed from the side surface. The harnesses 99 held by the ribs 40 and the hook are prevented from being displaced outside, by a hook locking section 54. In addition, routing work for the harnesses 99 is able to be performed smoothly since a sloping surface (a guide section 56) is created in a tip part of the hook locking section 54.

Abstract: The present invention relates to a method of measuring junction temperature of a diode junction within a semiconductor device. The method has the steps of measuring current/voltage characteristics for various diodes at room temperature, determining an ideal factor for each diode, changing the temperature of the diodes to a selected temperature, remeasuring current/voltage characteristics for each diode, and comparing the measurements that have been made so as to obtain a temperature coefficients.

Abstract: Disclosed are a distributed Bragg reflector type semiconductor laser and a method of manufacturing such a laser a high yields, in which the upper surface of an active waveguide is covered by an external waveguide, the external waveguide at side portions thereof, the external waveguide is coupled with the edge surfaces of the active waveguide without any gap remaining, and the coupling ratio of the active waveguide and external waveguide is high.

Abstract: Disclosed are a distributed Bragg reflector type semiconductor laser and a method of manufacturing such a laser a high yields, in which the upper surface of an active waveguide is covered by an external waveguide, the external waveguide is disposed on the same surface as the active waveguide at side portions thereof, the external waveguide is coupled with the edge surfaces of the active waveguide without any gap remaining, and the coupling ratio of the active waveguide and external waveguide is high.

Abstract: In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.

Abstract: In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.

Abstract: A package for an optical element which receives or emits light thereinto or therefrom and is bonded on a substrate is disclosed. The substrate is a transparent one. An electrode pad including a window therein is formed on the top of the substrate and the optical element is bonded on the top of the electrode pad. By this structure, light is received into or emitted from the optical element through the transparent substrate and the window formed in the electrode pad.

Abstract: The present invention provides monolithic-structure type photodiodes in which the first photodiode is sensitive to an optical signal having one wavelength and the second photodiode is sensitive to another optical signal having a different wavelength, and in which the first and second photodiodes are superimposed together with an optical filter layer interposed between them which separates a multiplex optical signal into the first and second wavelength signals. Owing to their monolithic structure, the photodiodes of the present invention are extremely useful for receiving multiplex optical signals having a plurality of different wavelengths.