Patents by Inventor Hideaki Saitoh

Hideaki Saitoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10381793
    Abstract: A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: August 13, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Yukinari Naganishi, Akira Baba, Takashi Odajima, Hirohito Habara, Hideaki Saitoh, Takao Ota, Akihiro Koyama, Atsushi Nakata
  • Publication number: 20140327303
    Abstract: A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Yukinari NAGANISHI, Akira BABA, Takashi ODAJIMA, Hirohito HABARA, Hideaki SAITOH, Takao OTA, Akihiro KOYAMA, Atsushi NAKATA
  • Publication number: 20140325837
    Abstract: A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Yukinari NAGANISHI, Akira BABA, Takashi ODAJIMA, Hirohito HABARA, Hideaki SAITOH, Takao OTA, Akihiro KOYAMA, Atsushi NAKATA
  • Patent number: 6014196
    Abstract: A transparent electrically conductive film is attached to a transparent substrate of a display element. This laminated structure comprises a transparent substrate and has successively laminated on one surface thereof an ITO layer as a first reflection preventing layer, a silver layer, and an ITO layer as a second reflection preventing layer, from the substrate side, wherein the silver layer contains from 0.2 to less than 3.0% by weight of palladium, from 0.2 to less than 5.0% by weight of gold, or from 0.2 to less than 5.0% by weight of platinum. The transparent electrically conductive film formed on the transparent substrate has a low resistance, a high visible light transmittance, and high moisture and heat resistances, and the substrate having the transparent electrically conductive film is particularly suitable for use in a liquid crystal display.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: January 11, 2000
    Assignee: Nippon Sheet Glass Co., Ltd.
    Inventors: Toshiaki Anzaki, Hideaki Saitoh