Patents by Inventor Hideaki TAKASAKI

Hideaki TAKASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12165855
    Abstract: A ceramic heater includes an AlN ceramic substrate having a wafer placement surface in which, from a position closer to the wafer placement surface, a plasma-generation RF electrode and a heater electrode are embedded in this order so as to be separated from each other. The AlN ceramic substrate includes an AlN ceramic high-resistivity layer disposed between the RF electrode and the heater electrode, and an AlN ceramic low-resistivity layer other than the high-resistivity layer. The high-resistivity layer and the low-resistivity layer each contain Si, Mg, and Ti. The high-resistivity layer has higher Mg and Ti contents and a higher volume resistivity than the low-resistivity layer.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: December 10, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventor: Hideaki Takasaki
  • Patent number: 11424150
    Abstract: A semiconductor manufacturing apparatus member in which an insulating electrostatic chuck having a wafer placement surface and provided with a narrow hole and a conductive cooling plate provided with a gas supply hole are bonded together, the member includes a plug chamber composed of at least one of an electrostatic chuck side recess and a cooling plate side recess, a porous insulating air permeable plug disposed in the plug chamber, an annular dense layer provided on the surface of the air permeable plug so as to separate the surface of the air permeable plug into a narrow hole side surface and a gas supply hole side surface and an adhesive layer filled between the dense layer and the wall surface of the plug chamber.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 23, 2022
    Assignee: NGK Insulators, Ltd.
    Inventor: Hideaki Takasaki
  • Publication number: 20210384014
    Abstract: A ceramic heater includes an AlN ceramic substrate having a wafer placement surface in which, from a position closer to the wafer placement surface, a plasma-generation RF electrode and a heater electrode are embedded in this order so as to be separated from each other. The AlN ceramic substrate includes an AlN ceramic high-resistivity layer disposed between the RF electrode and the heater electrode, and an AlN ceramic low-resistivity layer other than the high-resistivity layer. The high-resistivity layer and the low-resistivity layer each contain Si, Mg, and Ti. The high-resistivity layer has higher Mg and Ti contents and a higher volume resistivity than the low-resistivity layer.
    Type: Application
    Filed: August 18, 2021
    Publication date: December 9, 2021
    Applicant: NGK INSULATORS, LTD.
    Inventor: Hideaki TAKASAKI
  • Publication number: 20190252231
    Abstract: A semiconductor manufacturing apparatus member in which an insulating electrostatic chuck having a wafer placement surface and provided with a narrow hole and a conductive cooling plate provided with a gas supply hole are bonded together, the member includes a plug chamber composed of at least one of an electrostatic chuck side recess and a cooling plate side recess, a porous insulating air permeable plug disposed in the plug chamber, an annular dense layer provided on the surface of the air permeable plug so as to separate the surface of the air permeable plug into a narrow hole side surface and a gas supply hole side surface and an adhesive layer filled between the dense layer and the wall surface of the plug chamber.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Applicant: NGK INSULATORS, LTD.
    Inventor: Hideaki TAKASAKI
  • Patent number: 9438140
    Abstract: A member for a semiconductor manufacturing apparatus includes an electrostatic chuck, a cooling unit, a spacer (an O-ring, an outer periphery spacer, or the like) for securing a gap placed between the electrostatic chuck and the cooling unit, and a clamp ring placed on the upper surface of the outer periphery of the electrostatic chuck. The clamp ring is fastened to the cooling unit with screws. The screws are inserted into coil springs that prevent loosening, and are fastened to nuts. The coil springs are attached not to the clamp ring side but to the cooling unit side.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: September 6, 2016
    Assignee: NGK Insulators, Ltd.
    Inventors: Hideaki Takasaki, Takashi Kataigi
  • Publication number: 20130286533
    Abstract: A member 10 for a semiconductor manufacturing apparatus includes an electrostatic chuck 20, a cooling unit 40, a spacer (an O-ring 44, an outer periphery spacer 58, or the like) for securing a gap 48 placed between the electrostatic chuck 20 and the cooling unit 40, and a clamp ring 50 placed on the upper surface of the outer periphery of the electrostatic chuck 20. The clamp ring 50 is fastened to the cooling unit 40 with screws 60. The screws 60 are inserted into coil springs 66 that prevent loosening, and are fastened to nuts 68. The coil springs 66 are attached not to the clamp ring side but to the cooling unit side.
    Type: Application
    Filed: April 25, 2013
    Publication date: October 31, 2013
    Applicant: NGK INSULATORS, LTD.
    Inventors: Hideaki TAKASAKI, Takashi KATAIGI