Abstract: Provided is an electronically controlled throttle device configured to reduce size of a motor and concurrently to enhance reduction of a noise of the motor. The electronically controlled throttle device includes: a body including a throttle valve; a motor provided with a brush, the motor configured to drive the throttle valve; a bracket (20F) configured to attach the motor to the body; a pigtail connected electrically to the brush, and arranged on a surface of the bracket (20F), the surface facing the motor; and a filter circuit (an inductor (31), a capacitor (32), and a resistor (33)) connected electrically to the pigtail and configured to reduce the noise of the motor. The filter circuit is arranged on a surface of the bracket (20F), the surface opposite the motor.

Abstract: A vacuum pump comprises: a rolling bearing configured to support a rotor shaft provided at a pump rotor; a lubrication fluid storage section configured to store lubrication fluid to be supplied to the rolling bearing; a MEMS element including, at a rotor-shaft-side lubrication fluid circulation path in a lubrication fluid circulation path between the rolling bearing and the lubrication fluid storage section, an infinitesimal flow rate pump configured to discharge a liquid droplet of the lubrication fluid; and a first flow path of a capillary structure configured to move the lubrication fluid of the lubrication fluid storage section to the infinitesimal flow rate pump by capillary force.

Abstract: A vacuum pump comprises: a rolling bearing configured to support a rotor shaft provided at a pump rotor; a lubrication fluid storage section configured to store lubrication fluid supplied to the rolling bearing; a MEMS element including an infinitesimal flow rate pump configured to transfer the lubrication fluid of the lubrication fluid storage section to the rolling bearing; and a first flow path of a capillary structure configured to move the lubrication fluid of the lubrication fluid storage section to the infinitesimal flow rate pump by capillary force.

Abstract: An oil-lubricated bearing device comprises: a rolling bearing including an inner ring, an outer ring, rolling bodies, and a holder; a tapered member; a lubricant storage disposed on a side provided with the tapered member with respect to the inner ring; and a contact portion. The holder includes pockets each formed with outer and inner ring side openings and configured to hold a corresponding one of the rolling bodies, a lubricant scraping portion formed at an inner peripheral surface of each of the pockets and configured to scrape lubricant adhering to a surface of each of the rolling body, and a second inclined surface formed at an outer peripheral surface portion of the holder adjacent to the outer ring side opening and rising with a slope toward the lubricant storage.

Abstract: An oil-lubricated bearing device comprises: a rolling bearing including an inner ring, an outer ring, rolling bodies, and a holder; a tapered member; a lubricant storage disposed on a side provided with the tapered member with respect to the inner ring; and a contact portion. The holder includes pockets each formed with outer and inner ring side openings and configured to hold a corresponding one of the rolling bodies, a lubricant scraping portion formed at an inner peripheral surface of each of the pockets and configured to scrape lubricant adhering to a surface of each of the rolling body, and a second inclined surface formed at an outer peripheral surface portion of the holder adjacent to the outer ring side opening and rising with a slope toward the lubricant storage.

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).

Abstract: A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate (22) is disposed on the top surface of a circuit board (12) comprising a metal, and a transistor (34) such as an IGBT is mounted to the top surface of the ceramic substrate (22). As a result, the transistor (34) and the circuit board (12) are insulated from each other by the ceramic substrate (22). The ceramic substrate (22), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (34), short circuiting between the transistor (34) and the circuit board (12) is prevented.

Abstract: When conditioned air is supplied in an aircraft, the conditioned air in which at least one of oxygen concentration and humidity is adjusted is generated in the aircraft. The generated conditioned air is blown via a plurality of air blow-off ports 40a disposed inside the aircraft cabin so that the conditioned air reaches face disposition regions of passengers H in a plurality of seat locations inside the cabin.

Abstract: A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate (22) is disposed on the top surface of a circuit board (12) comprising a metal, and a transistor (34) such as an IGBT is mounted to the top surface of the ceramic substrate (22). As a result, the transistor (34) and the circuit board (12) are insulated from each other by the ceramic substrate (22). The ceramic substrate (22), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (34), short circuiting between the transistor (34) and the circuit board (12) is prevented.

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.

Abstract: In a body mounting type display system, at least a signal corresponding to display data is outputted to a computer side output transmission circuit through a bus line of a computer, and the data corresponding to the signal is written in a buffer memory of the computer side output transmission circuit by the computer. The data written in the buffer memory is read and sent, and the data is received at a body side output transmission circuit, which is restored to a signal corresponding to the signal outputted through the bus line. An image output interface connected to the body side output transmission circuit produces a signal for actuating a display device worn by a user based on the display data of the restored signal. Thus, there is provided the body mounting type display system suitable for providing information to the user who can work with hand free condition.

Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.

Abstract: Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.