Patents by Inventor Hideharu Matsuoka
Hideharu Matsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10253181Abstract: The present invention provides a reflector for an LED, including a polyamide composition and configure to keep high reflectance and high degree of whiteness even after being irradiated with LED light for a long period of time. The present invention is a reflector for an LED, including a polyamide composition containing polyamide (A) that has dicarboxylic acid units including 50 to 100 mol % of 1,4-cyclohexanedicarboxylic acid units and diamine units including 50 to 100 mol % of aliphatic diamine units having 4 to 18 carbon atoms.Type: GrantFiled: September 2, 2010Date of Patent: April 9, 2019Assignee: KURARAY CO., LTD.Inventors: Kozo Tamura, Hideharu Matsuoka, Ryu Kohase
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Publication number: 20120170277Abstract: The present invention provides a reflector for an LED, including a polyamide composition and configure to keep high reflectance and high degree of whiteness even after being irradiated with LED light for a long period of time. The present invention is a reflector for an LED, including a polyamide composition containing polyamide (A) that has dicarboxylic acid units including 50 to 100 mol % of 1,4-cyclohexanedicarboxylic acid units and diamine units including 50 to 100 mol % of aliphatic diamine units having 4 to 18 carbon atoms.Type: ApplicationFiled: September 2, 2010Publication date: July 5, 2012Applicant: Kuraray Co., Ltd.Inventors: Kozo Tamura, Hideharu Matsuoka, Ryu Kohase
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Publication number: 20110196080Abstract: A polyamide composition comprising: 100 parts by mass of polyamide (A) with a melting point of 270° C. to 340° C., 1 to 100 parts by mass of flame retardant (B), and 1 to 10 parts by mass of anti-dripping agent (C), wherein the anti-dripping agent (C) comprises a fluorine resin (C1) and at least one polymer (C2) selected from the group consisting of an ionomer and a modified aromatic vinyl-based polymer containing less than 15 mass % of halogen atom, in which a mass ratio of the fluorine resin (C1)/the polymer (C2) is 1/4 to 4/1.Type: ApplicationFiled: July 25, 2008Publication date: August 11, 2011Applicant: Kuraray Co., Ltd.Inventors: Hideharu Matsuoka, Takaharu Shigematsu, Kozo Tamura, Shigeru Kawahara
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Patent number: 7009029Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 ?m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.Type: GrantFiled: June 19, 2003Date of Patent: March 7, 2006Assignee: Kuraray Co., Ltd.Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
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Patent number: 6818731Abstract: A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.Type: GrantFiled: April 15, 2003Date of Patent: November 16, 2004Assignees: Kuraray Co., Ltd., Asahi Denka Co., Ltd.Inventors: Hideharu Matsuoka, Hideaki Oka, Koichi Uchida, Masahide Tsuzuki, Koji Beppu
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Publication number: 20040034152Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 &mgr;m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.Type: ApplicationFiled: June 19, 2003Publication date: February 19, 2004Applicant: Kuraray Co., Ltd.Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
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Publication number: 20030229162Abstract: A polyamide resin composition containsType: ApplicationFiled: April 15, 2003Publication date: December 11, 2003Applicants: KURARAY CO. LTD., ASAHI DENKA CO., LTD.Inventors: Hideharu Matsuoka, Hideaki Oka, Koichi Uchida, Masahide Tsuzuki, Koji Beppu
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Patent number: 6414064Abstract: The polyamide resin composition of the present invention comprises 100 parts by weight of a polyamide resin (A) having dicarboxylic acid units (a) comprising from 60 to 100 mol % of terephthalic acid repeat units and diamine units (b) comprising from 60 to 100 mol % of C6-18 aliphatic alkylenediamine repeat units, and from 1 to 100 parts by weight of a polybromostyrene (B), comprising from 0.5 to 100% by weight of a polybromostyrene having an epoxy group. Molded articles prepared from the polyamide resin composition of the present invention have good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.Type: GrantFiled: September 12, 2001Date of Patent: July 2, 2002Assignee: Kuraray Co., Ltd.Inventors: Hideharu Matsuoka, Hideaki Oka, Shigeru Sasaki
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Publication number: 20020055589Abstract: The polyamide resin composition of the present invention comprises 100 parts by weight of a polyamide resin (A) having dicarboxylic acid units (a) comprising from 60 to 100 mol% of terephthalic acid repeat units and diamine units (b) comprising from 60 to 100 mol% of C6-18 aliphatic alkylenediamine repeat units, and from 1 to 100 parts by weight of a polybromostyrene (B), comprising from 0.5 to 100% by weight of a polybromostyrene having an epoxy group. Molded articles prepared from the polyamide resin composition of the present invention have good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.Type: ApplicationFiled: September 12, 2001Publication date: May 9, 2002Applicant: KURARAY CO., LTD.Inventors: Hideharu Matsuoka, Hideaki Oka, Shigeru Sasaki