Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Abstract: A multilayer board disclosed herein includes: a plurality of insulating layers made of a thermosetting resin and stacked on one another, each insulating layer being provided with a via hole; a plurality of wiring each formed between the insulating layers and including an inclined side surface; and a conductive via made of a cured product of conductive paste filled in the via hole and connecting the vertically adjacent wiring to each other. Here, orientations of the inclined side surfaces are alternately changed from the wiring to the wiring.

Abstract: A method of manufacturing a laminated substrate, the method includes: forming a first diameter hole to a first surface of a first substrate so as not to penetrate the first substrate; forming a second diameter hole to a second surface of the first substrate so as to communicate with the first diameter hole; plating the first substrate to block the second diameter hole without blocking the first diameter hole; and laminating a second substrate on the second surface of the first substrate.

Abstract: A method of manufacturing a laminated substrate, the method includes: forming a first diameter hole to a first surface of a first substrate so as not to penetrate the first substrate; forming a second diameter hole to a second surface of the first substrate so as to communicate with the first diameter hole; plating the first substrate to block the second diameter hole without blocking the first diameter hole; and laminating a second substrate on the second surface of the first substrate.

Abstract: A step of forming an insulating resin layer 31 includes a process of forming the insulating resin layer 31 made of a photo-sensitive resin on a load beam or a flexure 11 and an exposing and developing process in which a photo-mask 32 having different light transmittance between a part corresponding to a part near a slider mounting part 22 and other parts is applied to the insulating resin layer 31, exposed and developed so that the thickness of the insulating resin layer 31 of the part near the slider mounting part 22 is smaller than the thickness of the insulating resin layer 31 of other parts.

Abstract: A step of forming an insulating resin layer 31 includes a process of forming the insulating resin layer 31 made of a photo-sensitive resin on a load beam or a flexure 11 and an exposing and developing process in which a photo-mask 32 having different light transmittance between a part corresponding to a part near a slider mounting part 22 and other parts is applied to the insulating resin layer 31, exposed and developed so that the thickness of the insulating resin layer 31 of the part near the slider mounting part 22 is smaller than the thickness of the insulating resin layer 31 of other parts.

Abstract: Provided are a method for manufacturing a suspension element having a pattern of wiring lines and an equipment for the same. The method includes the steps of: preparing a roll of band-shaped sheet used as a substrate of the suspension element; sequentially performing processes to the sheet through a series of processing sections to integrally form the suspension element with the pattern of wiring lines within a predetermined region of the sheet, and transferring the sheet in a wound state like a roll from one of the processing sections to the next processing section.