Patents by Inventor Hidekazu Nakanishi
Hidekazu Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11504131Abstract: An in-vivo indwelling instrument in which a stretch resistant member or a resin tip at a distal end part of a coil does not easily stray from the coil, a delivering system for the in-vivo indwelling instrument, and a method for producing the in-vivo indwelling instrument is disclosed. An in-vivo indwelling instrument includes: a coil that is formed by winding a wire; a resin tip connected to a distal end part of the coil; and a stretch resistant member that is provided in a lumen of the coil and is connected to the resin tip. The coil includes a gap portion, and a part of the resin tip exists in the gap portion.Type: GrantFiled: April 27, 2018Date of Patent: November 22, 2022Assignee: KANEKA CORPORATIONInventor: Hidekazu Nakanishi
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Publication number: 20220337217Abstract: A packaged acoustic wave component includes a device substrate and an acoustic wave device mounted on the device substrate. A peripheral wall is attached to the device substrate and surrounds the acoustic wave device. A cap substrate is attached to the peripheral wall and spaced above the device substrate. The cap substrate has a marking layer disposed on a bottom surface of the cap substrate that is disposed above and faces the acoustic wave device. The marking layer is configured to receive one or more markings thereon.Type: ApplicationFiled: April 6, 2022Publication date: October 20, 2022Inventors: Wilfred Ryan Vidamo Habana, Hidekazu Nakanishi, XiaoJun Chew, Mitsuhiro Furukawa
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Publication number: 20220337213Abstract: A method for manufacturing a packaged acoustic wave component includes forming or providing a cap substrate, forming a metal layer on a surface of the cap substrate, marking the metal layer with one or more indicia and bonding the cap substrate to a device substrate that has an acoustic wave device on a surface thereof. The metal layer is paced from and faces the acoustic wave device.Type: ApplicationFiled: April 6, 2022Publication date: October 20, 2022Inventors: Wilfred Ryan Vidamo Habana, Hidekazu Nakanishi, XiaoJun Chew, Mitsuhiro Furukawa
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Publication number: 20200129185Abstract: An in-vivo indwelling instrument in which a stretch resistant member at a distal end part of a coil does not easily stray from the coil, and a delivering system for the in-vivo indwelling instrument is disclosed. An in-vivo indwelling instrument includes a coil formed by winding a wire, and a stretch resistant member that is placed in a lumen of the coil. In the view of the coil from a distal side, a part of the wire exists within a central region surrounded by a circle having a diameter of half a maximum outer diameter of the coil and having a center that is a middle point of the maximum outer diameter. The stretch resistant member and a connecting part which is the part of the wire are connected to each other.Type: ApplicationFiled: April 27, 2018Publication date: April 30, 2020Applicant: KANEKA CORPORATIONInventor: Hidekazu NAKANISHI
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Publication number: 20200107839Abstract: An in-vivo indwelling instrument in which a stretch resistant member or a resin tip at a distal end part of a coil does not easily stray from the coil, a delivering system for the in-vivo indwelling instrument, and a method for producing the in-vivo indwelling instrument is disclosed. An in-vivo indwelling instrument includes: a coil that is formed by winding a wire; a resin tip connected to a distal end part of the coil; and a stretch resistant member that is provided in a lumen of the coil and is connected to the resin tip. The coil includes a gap portion, and a part of the resin tip exists in the gap portion.Type: ApplicationFiled: April 27, 2018Publication date: April 9, 2020Applicant: KANEKA CORPORATIONInventor: Hidekazu NAKANISHI
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Patent number: 10389326Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.Type: GrantFiled: February 21, 2017Date of Patent: August 20, 2019Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
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Patent number: 10284171Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.Type: GrantFiled: March 3, 2017Date of Patent: May 7, 2019Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
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Patent number: 9819329Abstract: A ladder-type surface acoustic wave filter assembly includes a plurality of series resonators formed on a substrate and connected between an input terminal and an output terminal. A first series resonator has a lowest resonance frequency among the plurality of series resonator. A parallel resonator formed on the substrate and connected between the plurality of series resonators and the ground terminal. A dielectric film is coupled to at least one of the plurality of series resonators and has an inverse temperature coefficient of frequency to that of the substrate. A film thickness of the dielectric film in a region where the second series resonator is formed is smaller than a film thickness of the dielectric film in a region where the first series resonator is formed.Type: GrantFiled: October 26, 2015Date of Patent: November 14, 2017Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Tetsuya Tsurunari, Joji Fujiwara, Hiroyuki Nakamura, Hidekazu Nakanishi
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Patent number: 9748924Abstract: An elastic wave device includes an interdigital transducer (IDT) electrode in contact with a piezoelectric substrate having a bus bar electrode region including one of a first bus bar electrode and a second bus bar electrode of the IDT electrode, an alternately disposed region where first electrode fingers are alternately disposed with second electrode fingers of the IDT electrode, and an intermediate region including one of the first electrode fingers and the second electrode fingers. A dielectric film is formed in at least part of the intermediate region and in contact with an upper surface of the IDT electrode. The dielectric film includes a medium in which an acoustic velocity of a transverse wave propagating in the dielectric film is lower than an acoustic velocity of a main elastic wave of the alternately disposed region. The dielectric film is not formed in the alternately disposed region.Type: GrantFiled: July 27, 2015Date of Patent: August 29, 2017Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Tomoya Komatsu, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara, Hidekazu Nakanishi
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Publication number: 20170179921Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.Type: ApplicationFiled: March 3, 2017Publication date: June 22, 2017Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
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Publication number: 20170170797Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.Type: ApplicationFiled: February 21, 2017Publication date: June 15, 2017Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
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Patent number: 9640750Abstract: In an acoustic wave device, an unnecessary high-order transverse mode wave is suppressed. The acoustic wave device includes a piezoelectric substrate, at least one pair of interdigital transducer (IDT) electrodes formed on the piezoelectric substrate, and a dielectric film which covers at least a part of the piezoelectric substrate and the IDT electrodes. The IDT electrodes each have a plurality of electrode fingers interleaved with each other. An acoustic velocity of an acoustic wave in the area in which the electrode fingers are interleaved with each other is greater than an acoustic velocity of an acoustic wave in an edge area including end portions of the electrode fingers.Type: GrantFiled: May 11, 2015Date of Patent: May 2, 2017Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Hidekazu Nakanishi, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara
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Patent number: 9628047Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.Type: GrantFiled: July 1, 2015Date of Patent: April 18, 2017Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
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Patent number: 9614495Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example, the elastic wave element includes a piezoelectric body having a upper surface, an interdigital transducer (IDT) electrode disposed on the piezoelectric body, a connection wiring disposed on the piezoelectric body and electrically connected to the IDT electrode, the connection wiring having a lower connection wiring and an upper connection wiring provided above the lower connection wiring, and a reinforcement electrode provided above the connection wiring, the reinforcement electrode being in contact with and electrically connected to the lower connection wiring.Type: GrantFiled: February 18, 2015Date of Patent: April 4, 2017Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
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Patent number: 9425766Abstract: An acoustic wave device includes a piezoelectric substrate made of a lithium niobate material having the Euler angles (?, ?, ?), an electrode disposed on the piezoelectric substrate for exciting a major acoustic wave of a wavelength ?, and a protective layer disposed on the piezoelectric substrate to cover the electrode. The protective layer has a thickness greater than 0.27?. The Euler angles satisfy ?100°????60°; 1.193??2°???1.193?+2°; and either ???2??3° or ?2?+3°??.Type: GrantFiled: October 29, 2010Date of Patent: August 23, 2016Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Joji Fujiwara, Yosuke Hamaoka, Tetsuya Tsurunari, Hidekazu Nakanishi, Hiroyuki Nakamura
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Publication number: 20160226464Abstract: An acoustic wave element that includes a piezoelectric body, an aluminum oxide layer disposed on the piezoelectric body, an electrode disposed on the aluminum oxide layer, and a protection film disposed on the aluminum oxide layer to cover the electrode. The piezoelectric body is formed of a piezoelectric material based on lithium niobate having Euler angles (?, ?, ?). The aluminum oxide layer is formed of Al2O3. The electrode is configured to excite a main acoustic wave having a wavelength ?. The protection film has a film thickness greater than 0.27?. The Euler angles satisfy either ???2??3° or ?2?+3°?? and both of ?100°????60° and 2??2°???2?+2°.Type: ApplicationFiled: April 8, 2016Publication date: August 4, 2016Inventors: Joji Fujiwara, Yosuke Hamaoka, Tetsuya Tsurunari, Hidekazu Nakanishi, Hiroyuki Nakamura, Rei Goto, Hidehito Shimizu
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Publication number: 20160056793Abstract: A ladder-type surface acoustic wave filter assembly includes a plurality of series resonators formed on a substrate and connected between an input terminal and an output terminal. A first series resonator has a lowest resonance frequency among the plurality of series resonator. A parallel resonator formed on the substrate and connected between the plurality of series resonators and the ground terminal. A dielectric film is coupled to at least one of the plurality of series resonators and has an inverse temperature coefficient of frequency to that of the substrate. A film thickness of the dielectric film in a region where the second series resonator is formed is smaller than a film thickness of the dielectric film in a region where the first series resonator is formed.Type: ApplicationFiled: October 26, 2015Publication date: February 25, 2016Inventors: Tetsuya Tsurunari, Joji Fujiwara, Hiroyuki Nakamura, Hidekazu Nakanishi
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Publication number: 20160006410Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.Type: ApplicationFiled: July 1, 2015Publication date: January 7, 2016Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
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Patent number: 9203376Abstract: A ladder-type surface acoustic wave filter includes a first series resonator having the lowest resonance frequency among a plurality of series resonators; and a second series resonator having a resonance frequency higher than the first series resonator. The film thickness of a dielectric film in the region where the first series resonator is formed is larger than that of a dielectric film in the region where the second series resonator is formed.Type: GrantFiled: February 22, 2013Date of Patent: December 1, 2015Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.Inventors: Tetsuya Tsurunari, Joji Fujiwara, Hiroyuki Nakamura, Hidekazu Nakanishi
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Publication number: 20150333731Abstract: An elastic wave device includes an interdigital transducer (IDT) electrode in contact with a piezoelectric substrate having a bus bar electrode region including one of a first bus bar electrode and a second bus bar electrode of the IDT electrode, an alternately disposed region where first electrode fingers are alternately disposed with second electrode fingers of the IDT electrode, and an intermediate region including one of the first electrode fingers and the second electrode fingers. A dielectric film is formed in at least part of the intermediate region and in contact with an upper surface of the IDT electrode. The dielectric film includes a medium in which an acoustic velocity of a transverse wave propagating in the dielectric film is lower than an acoustic velocity of a main elastic wave of the alternately disposed region. The dielectric film is not formed in the alternately disposed region.Type: ApplicationFiled: July 27, 2015Publication date: November 19, 2015Inventors: Tomoya Komatsu, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara, Hidekazu Nakanishi