Patents by Inventor Hidekazu Nakanishi

Hidekazu Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10389326
    Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: August 20, 2019
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Publication number: 20190199006
    Abstract: A terminal fitting (T) includes an inner conductor (11) and an outer conductor (12). The inner conductor (11) has a mating connecting portion (15) to be connected to a mating terminal fitting and a center conductor crimping portion (16) to be crimped to a center conductor of a shielded cable. The outer conductor (12) has a tubular portion (19) configured to surround the mating connecting portion (15). A coupling (21) is behind the tubular portion (19). The center conductor crimping portion is inside the coupling (21). A shield crimping portion (22) is behind the coupling (21) and is to be crimped to a shield layer of the shielded cable. A conductive member (60) extends in a front-rear direction and includes a bridge (61) to electrically contact the tubular portion (19) and the shield crimping portion (22) across the coupling (21).
    Type: Application
    Filed: December 24, 2018
    Publication date: June 27, 2019
    Inventors: Keisuke Kanemura, Shohei Mitsui, Hidekazu Matsuda, Yuichi Nakanishi, Ai Hirano
  • Publication number: 20190199008
    Abstract: A connector (C) includes a housing (60), a terminal fitting (10) and a retainer (80). The housing (60) includes a cavity (64) extending in a front-rear direction and a retainer insertion hole (72) intersecting and communicating with the cavity and open in an outer surface. The terminal fitting (10) is inserted into the cavity (64) from behind, and a stabilizer configured to guide an inserting operation into the cavity (64) and restrict the inserting operation in an erroneous posture projects on an outer side. The retainer (80) is inserted into the retainer insertion hole (72) and include a retaining portion (85) configured to face the stabilizer from behind.
    Type: Application
    Filed: December 24, 2018
    Publication date: June 27, 2019
    Inventors: Keisuke Kanemura, Shohei Mitsui, Hidekazu Matsuda, Yuichi Nakanishi, Ai Hirano
  • Publication number: 20190199036
    Abstract: A connector housing (20) includes a housing body (21) to which a mating connector housing is to be fit from front. A lock arm (40) has front and rear ends fixed to the housing body (21). A lock (42) is provided in a central part of the lock arm (40) in the front-rear direction and is configured to lock the mating connector housing. A pressing surface (43) is on a rear end part of the lock arm (40) and is configured to displace the lock (42) in an unlocking direction by being pressed. A coupling portion (44) couples the pressing surface (43) to the central part of the lock arm (40) in the front-rear direction.
    Type: Application
    Filed: December 24, 2018
    Publication date: June 27, 2019
    Inventors: Keisuke Kanemura, Teruo Hara, Hidekazu Matsuda, Ai Hirano, Yuichi Nakanishi, Shohei Mitsui
  • Patent number: 10284171
    Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: May 7, 2019
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
  • Patent number: 9819329
    Abstract: A ladder-type surface acoustic wave filter assembly includes a plurality of series resonators formed on a substrate and connected between an input terminal and an output terminal. A first series resonator has a lowest resonance frequency among the plurality of series resonator. A parallel resonator formed on the substrate and connected between the plurality of series resonators and the ground terminal. A dielectric film is coupled to at least one of the plurality of series resonators and has an inverse temperature coefficient of frequency to that of the substrate. A film thickness of the dielectric film in a region where the second series resonator is formed is smaller than a film thickness of the dielectric film in a region where the first series resonator is formed.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: November 14, 2017
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Tetsuya Tsurunari, Joji Fujiwara, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Patent number: 9748924
    Abstract: An elastic wave device includes an interdigital transducer (IDT) electrode in contact with a piezoelectric substrate having a bus bar electrode region including one of a first bus bar electrode and a second bus bar electrode of the IDT electrode, an alternately disposed region where first electrode fingers are alternately disposed with second electrode fingers of the IDT electrode, and an intermediate region including one of the first electrode fingers and the second electrode fingers. A dielectric film is formed in at least part of the intermediate region and in contact with an upper surface of the IDT electrode. The dielectric film includes a medium in which an acoustic velocity of a transverse wave propagating in the dielectric film is lower than an acoustic velocity of a main elastic wave of the alternately disposed region. The dielectric film is not formed in the alternately disposed region.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: August 29, 2017
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Tomoya Komatsu, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara, Hidekazu Nakanishi
  • Publication number: 20170179921
    Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
    Type: Application
    Filed: March 3, 2017
    Publication date: June 22, 2017
    Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
  • Publication number: 20170170797
    Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.
    Type: Application
    Filed: February 21, 2017
    Publication date: June 15, 2017
    Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Patent number: 9640750
    Abstract: In an acoustic wave device, an unnecessary high-order transverse mode wave is suppressed. The acoustic wave device includes a piezoelectric substrate, at least one pair of interdigital transducer (IDT) electrodes formed on the piezoelectric substrate, and a dielectric film which covers at least a part of the piezoelectric substrate and the IDT electrodes. The IDT electrodes each have a plurality of electrode fingers interleaved with each other. An acoustic velocity of an acoustic wave in the area in which the electrode fingers are interleaved with each other is greater than an acoustic velocity of an acoustic wave in an edge area including end portions of the electrode fingers.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: May 2, 2017
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Hidekazu Nakanishi, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara
  • Patent number: 9628047
    Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: April 18, 2017
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
  • Patent number: 9614495
    Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example, the elastic wave element includes a piezoelectric body having a upper surface, an interdigital transducer (IDT) electrode disposed on the piezoelectric body, a connection wiring disposed on the piezoelectric body and electrically connected to the IDT electrode, the connection wiring having a lower connection wiring and an upper connection wiring provided above the lower connection wiring, and a reinforcement electrode provided above the connection wiring, the reinforcement electrode being in contact with and electrically connected to the lower connection wiring.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: April 4, 2017
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Patent number: 9425766
    Abstract: An acoustic wave device includes a piezoelectric substrate made of a lithium niobate material having the Euler angles (?, ?, ?), an electrode disposed on the piezoelectric substrate for exciting a major acoustic wave of a wavelength ?, and a protective layer disposed on the piezoelectric substrate to cover the electrode. The protective layer has a thickness greater than 0.27?. The Euler angles satisfy ?100°????60°; 1.193??2°???1.193?+2°; and either ???2??3° or ?2?+3°??.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: August 23, 2016
    Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Joji Fujiwara, Yosuke Hamaoka, Tetsuya Tsurunari, Hidekazu Nakanishi, Hiroyuki Nakamura
  • Publication number: 20160226464
    Abstract: An acoustic wave element that includes a piezoelectric body, an aluminum oxide layer disposed on the piezoelectric body, an electrode disposed on the aluminum oxide layer, and a protection film disposed on the aluminum oxide layer to cover the electrode. The piezoelectric body is formed of a piezoelectric material based on lithium niobate having Euler angles (?, ?, ?). The aluminum oxide layer is formed of Al2O3. The electrode is configured to excite a main acoustic wave having a wavelength ?. The protection film has a film thickness greater than 0.27?. The Euler angles satisfy either ???2??3° or ?2?+3°?? and both of ?100°????60° and 2??2°???2?+2°.
    Type: Application
    Filed: April 8, 2016
    Publication date: August 4, 2016
    Inventors: Joji Fujiwara, Yosuke Hamaoka, Tetsuya Tsurunari, Hidekazu Nakanishi, Hiroyuki Nakamura, Rei Goto, Hidehito Shimizu
  • Publication number: 20160056793
    Abstract: A ladder-type surface acoustic wave filter assembly includes a plurality of series resonators formed on a substrate and connected between an input terminal and an output terminal. A first series resonator has a lowest resonance frequency among the plurality of series resonator. A parallel resonator formed on the substrate and connected between the plurality of series resonators and the ground terminal. A dielectric film is coupled to at least one of the plurality of series resonators and has an inverse temperature coefficient of frequency to that of the substrate. A film thickness of the dielectric film in a region where the second series resonator is formed is smaller than a film thickness of the dielectric film in a region where the first series resonator is formed.
    Type: Application
    Filed: October 26, 2015
    Publication date: February 25, 2016
    Inventors: Tetsuya Tsurunari, Joji Fujiwara, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Publication number: 20160006410
    Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
    Type: Application
    Filed: July 1, 2015
    Publication date: January 7, 2016
    Inventors: Mitsunori Miyanari, Yosuke Hamaoka, Toru Yamaji, Hidekazu Nakanishi, Hiroyuki Nakamura
  • Patent number: 9203376
    Abstract: A ladder-type surface acoustic wave filter includes a first series resonator having the lowest resonance frequency among a plurality of series resonators; and a second series resonator having a resonance frequency higher than the first series resonator. The film thickness of a dielectric film in the region where the first series resonator is formed is larger than that of a dielectric film in the region where the second series resonator is formed.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: December 1, 2015
    Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Tetsuya Tsurunari, Joji Fujiwara, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Publication number: 20150333731
    Abstract: An elastic wave device includes an interdigital transducer (IDT) electrode in contact with a piezoelectric substrate having a bus bar electrode region including one of a first bus bar electrode and a second bus bar electrode of the IDT electrode, an alternately disposed region where first electrode fingers are alternately disposed with second electrode fingers of the IDT electrode, and an intermediate region including one of the first electrode fingers and the second electrode fingers. A dielectric film is formed in at least part of the intermediate region and in contact with an upper surface of the IDT electrode. The dielectric film includes a medium in which an acoustic velocity of a transverse wave propagating in the dielectric film is lower than an acoustic velocity of a main elastic wave of the alternately disposed region. The dielectric film is not formed in the alternately disposed region.
    Type: Application
    Filed: July 27, 2015
    Publication date: November 19, 2015
    Inventors: Tomoya Komatsu, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara, Hidekazu Nakanishi
  • Patent number: 9160299
    Abstract: An acoustic wave element includes a piezoelectric body, an input IDT electrode, an output IDT electrode, a propagation path provided between the input IDT electrode and the output IDT electrode, a first dielectric layer provided on the piezoelectric body so as to cover the input IDT electrode and the output IDT electrode, and a reactive portion provided on the propagation path and configured to react to a substance to be detected or a binding substance configured to bind with the substance to be detected. The main acoustic wave becomes, in the input IDT electrode and the output IDT electrode, a boundary acoustic wave that propagates between the piezoelectric body and the first dielectric layer, and becomes, in the propagation path, a surface acoustic wave that propagates on an upper surface of the propagation path.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: October 13, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Rei Goto, Hidekazu Nakanishi, Hiroyuki Nakamura
  • Patent number: 9136458
    Abstract: An elastic wave element includes a piezoelectric substrate, an IDT electrode, and a first dielectric film. The IDT electrode includes a first bus bar electrode, a second bus bar electrode, first electrode fingers, and second electrode fingers. The piezoelectric substrate includes a bus bar electrode region, an alternately disposed region, and an intermediate region. The first dielectric film is formed in at least a part of the intermediate region, and formed of a medium in which acoustic velocity of a transverse wave propagating in the first dielectric film is lower than acoustic velocity of a main elastic wave in the alternately disposed region.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: September 15, 2015
    Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Tomoya Komatsu, Hiroyuki Nakamura, Tetsuya Tsurunari, Joji Fujiwara, Hidekazu Nakanishi