Patents by Inventor Hideki Nakamori

Hideki Nakamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7300712
    Abstract: In a magnetic sensor (1) including a substrate (10) having a magnetism-sensitive element (11) formed thereon, a hard membrane (14) is formed on the outermost surface, an organic film (13) to relieve the stress caused by the hard membrane (14) is formed under the hard membrane (14), and an inorganic film (12) to relieve the stress caused by the organic film (13) is formed between the organic film (13) and magnetism-sensitive element (11). Also, an intermediate film formed from an element having a large force of bonding to carbon may be formed between the organic film (13) and hard membrane (14). Thus, the magnetic sensor (MR sensor, for example) can be protected against an external shock.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: November 27, 2007
    Assignee: Sony Manufacturing Systems Corporation
    Inventors: Masaaki Kusumi, Mitsuru Ohno, Michio Okano, Hideki Nakamori, Touru Sumiya, Akitaka Tsunogae, Tomoyuki Nakada, Teruyuki Miura, Yoshihiko Ohkawara
  • Publication number: 20040157067
    Abstract: In a magnetic sensor (1) including a substrate (10) having a magnetism-sensitive element (11) formed thereon, a hard membrane (14) is formed on the outermost surface, an organic film (13) to relieve the stress caused by the hard membrane (14) is formed under the hard membrane (14), and an inorganic film (12) to relieve the stress caused by the organic film (13) is formed between the organic film (13) and magnetism-sensitive element (11). Also, an intermediate film formed from an element having a large force of bonding to carbon may be formed between the organic film (13) and hard membrane (14). Thus, the magnetic sensor (MR sensor, for example) can be protected against an external shock.
    Type: Application
    Filed: October 20, 2003
    Publication date: August 12, 2004
    Applicant: Sony Precision Technology Inc.
    Inventors: Masaaki Kusumi, Mitsuru Ohno, Michio Okano, Hideki Nakamori, Touru Sumiya, Akitaka Tsunogae, Tomoyuki Nakada, Teruyuki Miura, Yoshihiko Ohkawara
  • Patent number: 5008002
    Abstract: The present invention relates to a process for producing a mold for glass press molding which comprises adopting, in the ion plating method to form an i-carbon film, a given hydrocarbon, given voltages, given temperature conditions, etc. According to the process, there could be obtained a mold for glass press molding, having an i-carbon film superior in adhesion to mold base, hardness, lubricity, etc. In this mold for glass press molding, the i-carbon film is less susceptible to peeling and glass releasability is good even after many times of press molding. Therefore, the mold can be used for glass press molding over a long period of time.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: April 16, 1991
    Assignees: Hoya Corporation, Prometron Technics Corporation
    Inventors: Ken Uno, Takuo Fujino, Hideki Nakamori