Abstract: An input device includes a housing, an operation unit, a vibrating body, a piezoelectric element, a picker, and a signal processing unit. The operation unit is movable relative to the housing. The vibrating body has elasticity. The vibrating body includes a first end partially fixed to the housing, and a second end provided so as to be vibratable. The piezoelectric element is provided to the vibrating body. The piezoelectric element is configured to convert vibration energy of the vibrating body into electrical energy as the vibrating body vibrates. The picker flicks the vibrating body to allow the vibrating body to vibrate in conjunction with the operation unit. The signal processing unit is configured to receive power generated by the piezoelectric element to operate and transmit, through wireless communications, detection information to be generated as the operation unit moves.

Abstract: A power supply device includes an oscillator configured to output an alternating-current (AC) signal in accordance with strength of an external force, a rectifying output unit configured to convert the AC signal to a first signal which is a pulsating current, a rectifying-smoothing output unit configured to convert the AC signal to a second signal which is closer to a direct current than the first signal is, a starter unit configured to output a start-up signal, and a controller starting up in response to the start-up signal. The starter unit includes a first terminal electrically connected to the rectifying output unit, and a second terminal electrically connected to the rectifying-smoothing output unit. The starter unit outputs the start-up signal when a voltage applied to the first terminal is equal to or higher than a voltage applied to the second terminal. The power supply device reliably starts up the controller.

Abstract: Provided is a power generation device that restrains interference between a plurality of flows of alternating current power if the flows of alternating current power are generated in the power generation device. The power generation device includes a housing, a first power generator held in the housing so as to be allowed to vibrate, and a second power generator held in the housing so as to be allowed to vibrate. The second power generator is electrically isolated from the first power generator.

Abstract: A power generation device includes a holder with a natural frequency of fA, and two or more vibration energy harvesting elements held by the holder and having natural frequencies different from each other. Out of the vibration energy harvesting elements, one has the lowest natural frequency fBmin satisfying the following Expression 1, and another one has the highest natural frequency fBmax satisfying the following Expression 2: fBmin?(0.925?2.5 N/100)fA??(1), and fBmax?(1.075+2.5 N/100)fA??(2), where N is the number of the vibration energy harvesting elements.

Abstract: An input device includes a housing, an operation unit, a vibrating body, a piezoelectric element, a picker, and a signal processing unit. The operation unit is movable relative to the housing. The vibrating body has elasticity. The vibrating body includes a first end partially fixed to the housing, and a second end provided so as to be vibratable. The piezoelectric element is provided to the vibrating body. The piezoelectric element is configured to convert vibration energy of the vibrating body into electrical energy as the vibrating body vibrates. The picker flicks the vibrating body to allow the vibrating body to vibrate in conjunction with the operation unit. The signal processing unit is configured to receive power generated by the piezoelectric element to operate and transmit, through wireless communications, detection information to be generated as the operation unit moves.

Abstract: A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.

Abstract: Disclosed herein is a bridge abnormality sensing device including: a pair of vibration sensors installed in an upper structure of a railroad bridge supported with a plurality of bearings, the pair of vibration sensors being provided for two of the bearings arranged in a width direction; a detector circuit configured to output a damage detection signal based on a difference between output signals of the pair of vibration sensors; and an output circuit configured to receive the damage detection signal and notify an external device of any structural damage detected from the railroad bridge. The vibration sensors are vibration power generators that generate power in a frequency range of abnormal vibration resulting from the damage. Power to drive the detector circuit is supplied from the vibration power generators.

Abstract: A vibration power generation device including a multiple-degree-of-freedom vibration system comprising a first vibration system and a second vibration system, wherein a natural frequency of the first vibration system is different from a natural frequency of the second vibration system. A first mass member of the first vibration system has a hollow structure including a housing space inside, where the second vibration system is housed. A power generating element is mounted on a plate spring of the second vibration system. A support part projects within the housing space, and one end side of the plate spring is attached to the support part and supported within the housing space at a position inward from a peripheral wall of the first mass member. A second mass member of the second vibration system is attached to another end side of the plate spring.

Abstract: Jitter that becomes a problem in a semiconductor part which performs high-speed signal processing is reduced. A semiconductor device includes a heat-resistant metal plate, a capacitor part having a lower electrode, a sintered dielectric part, and an upper electrode that are formed on one or more surfaces of the heat-resistant metal plate, a semiconductor chip fixed on the capacitor part, a wire for electrically connecting a lead frame to the semiconductor chip and the upper electrode, and a mold part in which at least the capacitor part and the semiconductor chip are buried. The semiconductor chip, the electrode, the metal plate, and the like are electrically connected with each other via first, second, and third wires.

Abstract: A power generator including: a first vibration system in which a first mass member is elastically supported by a first spring member; and a second vibration system in which a second mass member is elastically supported by a second spring member, the first and second vibration systems providing a multiple-degree-of-freedom vibration system. A power generating element disposed between the first and second mass members is configured to convert vibration energy input to the first vibration system and the second vibration system from a vibrating member to electrical energy. A resonance frequency of the first vibration system is a frequency lower than 1/?2 times a frequency of a vibration input to the first vibration system from the vibrating member. A loss factor of the first spring member of the first vibration system is at least 0.01 but not greater than 0.2.

Abstract: A power generator including: a vibration system configured to be attached to a vibrating member; and a power generating element attached to the vibration system. The vibration system is a multiple-degree-of-freedom vibration system that includes a first vibration system having a first mass member elastically supported by a first spring member, and a second vibration system having a second mass member elastically connected to the first mass member by a second spring member. The power generating element is arranged between the first and second mass members, and vibration applied from the vibrating member causes relative displacement of the first and second mass members so that vibration energy of the vibrating member is input to the power generating element. A natural frequency of the first vibration system is different from that of the second vibration system.

Abstract: A vibration power generator includes a vibration system attached to a vibrating member. The vibration system includes a first vibration subsystem, and a second vibration subsystem attached to the first vibration subsystem. The first vibration subsystem includes an elastic member attached to the vibrating member, and a first mass member attached to the elastic member. The second vibration subsystem includes a plate spring integral with a piezoelectric element, and a second mass member attached to the plate spring. The first vibration subsystem has a resonant frequency that is substantially equal to a resonant frequency of the second vibration subsystem.

Abstract: A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.

Abstract: Jitter that becomes a problem in a semiconductor part which performs high-speed signal processing is reduced. A semiconductor device includes a heat-resistant metal plate, a capacitor part having a lower electrode, a sintered dielectric part, and an upper electrode that are formed on one or more surfaces of the heat-resistant metal plate, a semiconductor chip fixed on the capacitor part, a wire for electrically connecting a lead frame to the semiconductor chip and the upper electrode, and a mold part in which at least the capacitor part and the semiconductor chip are buried. The semiconductor chip, the electrode, the metal plate, and the like are electrically connected with each other via first, second, and third wires.

Abstract: A power-generating device includes a vibration plate, a lower electrode on the vibration plate, a piezoelectric layer made of piezoelectric material on the lower electrode, and an upper electrode on the piezoelectric layer, a fixing member for supporting a fixed end of the vibration plate. The vibration plate applies compressive stress to the piezoelectric layer when the vibration plate does not vibrate. The power generating device is excellent in long-term reliability.

Abstract: A piezoelectric resonator including a base part, a first support part fixed to the base part, a beam part fixed to the first support part, a weight part fixed to the beam part, a drive unit provided on the beam part, and an adjusting magnet movable on a main surface of the base part. Furthermore, the weight part is formed of a magnet or a magnetic body, and the beam part extends in a direction along the main surface of the base part. With this configuration, displacement of the resonance frequency generated due to variation in a manufacturing process can be adjusted easily. Even when the resonance frequency is displaced from desired resonance frequency due to variation in the manufacturing process of a power generating element, the displacement can be easily adjusted and maximum efficiency can be obtained.

Abstract: A piezoelectric element includes a metal substrate, an alumina layer, a lower electrode, a piezoelectric layer, and an upper electrode. The metal substrate includes iron as a main component and includes at least aluminum and chromium. The alumina layer is formed on the metal substrate, and the lower electrode is formed on the alumina layer. The piezoelectric layer is formed on the lower electrode, and the upper electrode is formed on the piezoelectric layer. The alumina layer is mainly formed of particles in a ?-alumina phase.

Abstract: An energy-harvesting device includes a power generating element configured to generate electric power, a storage capacitor configured to store the electric power generated by the power generating element, a DC/DC converter configured to convert, into a predetermined voltage, a voltage obtained from the electric power generated by the power generating element and the electric power stored in the storage capacitor, a delay section for delaying a voltage corresponding to a voltage across the storage capacitor, and a controller configured to output an activating signal that activates the DC/DC converter when the delayed voltage is higher than a reference voltage. The energy-harvesting device thus can produce a necessary voltage and power.

Abstract: A vibration power generation device including a multiple-degree-of-freedom vibration system comprising a first vibration system and a second vibration system, wherein a natural frequency of the first vibration system is different from a natural frequency of the second vibration system. A first mass member of the first vibration system has a hollow structure including a housing space inside, where the second vibration system is housed. A power generating element is mounted on a plate spring of the second vibration system. A support part projects within the housing space, and one end side of the plate spring is attached to the support part and supported within the housing space at a position inward from a peripheral wall of the first mass member. A second mass member of the second vibration system is attached to another end side of the plate spring.

Abstract: A vibration power generator includes a vibration system attached to a vibrating member. The vibration system includes a first vibration subsystem, and a second vibration subsystem attached to the first vibration subsystem. The first vibration subsystem includes an elastic member attached to the vibrating member, and a first mass member attached to the elastic member. The second vibration subsystem includes a plate spring integral with a piezoelectric element, and a second mass member attached to the plate spring. The first vibration subsystem has a resonant frequency that is substantially equal to a resonant frequency of the second vibration subsystem.