Patents by Inventor Hidenori Sato

Hidenori Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11260480
    Abstract: A fastening apparatus includes a fastening device (1, 3) that heats in a non-contacting state, and then applies pressure to, a shaft part (11b) or shaft body (111) while it is inserted through the through holes (W10, W20) of workpieces (W1, W2), thereby forming at least a second head part (11c) of a fastener (11). The fastening device (1, 3) includes: a fastening die (15) that forms the second head part (11c); and a shaft-part pressure-applying device (9) that applies the pressure to the fastening die (15). A determining device (5) determines whether the fastener (11) is defective or not by calculating a load curve defined by the time and the load during which the pressure was applied and then determining whether an amount of change per unit of time in the load curve after a reference load has been exceeded is within a range of a predetermined reference value.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: March 1, 2022
    Assignee: DAI-ICHI DENTSU LTD.
    Inventors: Takeshi Eguchi, Takayuki Kitou, Teruhiko Hirasawa, Hidenori Sato
  • Publication number: 20220019076
    Abstract: An optical scanning apparatus includes a first polarizing member and a second polarizing member between a light source and a MEMS mirror that is a deflection mirror. The first polarizing member reflects a first polarization component included in a beam light emitted from the light source so as to squarely enter the MEMS mirror and passes a second polarization component having a phase difference of a half-wavelength with respect to the first polarization component. The second polarizing member is provided between the first polarizing member and the MEMS mirror to pass the first polarization component reflected by the first polarizing member therethrough twice before and after being reflected by the MEMS mirror to change the first polarization component into the second polarization component. A rotation axis of the MEMS mirror is parallel to an optical axis of the beam light immediately before being reflected by the first polarizing member.
    Type: Application
    Filed: July 5, 2021
    Publication date: January 20, 2022
    Inventors: HIROSHI YAMAMOTO, Hidenori SATO, TAKAHARU MOTOYAMA
  • Publication number: 20210291303
    Abstract: An inspection device includes an imager and a processor. The imager acquires first image data and second image data. The first image data is of a first weld zone imaged using a first condition. The first weld zone includes a first non-weld area, a second non-weld area, and a first weld area between the first non-weld area and the second non-weld area. The second image data is of the first weld zone imaged using a second condition. The processor performs a first inspection. The first inspection is based on a result of detecting a first boundary and a result of detecting a second boundary. The first boundary is between the first non-weld area and the first weld area based on the first image data. The second boundary is between the first weld area and the second non-weld area based on the second image data.
    Type: Application
    Filed: February 2, 2021
    Publication date: September 23, 2021
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Chinatsu MORI, Hidenori SATO, Takashi OBARA
  • Patent number: 10978505
    Abstract: A hybrid-bonding-type solid-state imaging device is provided that prevents moisture from entering through the bonded interface and other areas. The solid-state imaging device includes a first interconnect structure over a sensor substrate and a second interconnect structure over a logic substrate, and the first and second interconnect structures are bonded together. At the bonded surface between the first and second interconnect structures, bonding pads formed in the first interconnect structure are bonded to bonding pads formed in the second interconnect structure. Eighth layer portions of a first seal ring formed in the first interconnect structure are bonded to eighth layer portions of a second seal ring formed in the second interconnect structure.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: April 13, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Hidenori Sato, Koji Iizuka, Takeshi Kamino
  • Publication number: 20210046593
    Abstract: A fastening apparatus includes a fastening device (1, 3) that heats in a non-contacting state, and then applies pressure to, a shaft part (11b) or shaft body (111) while it is inserted through the through holes (W10, W20) of workpieces (W1, W2), thereby forming at least a second head part (11c) of a fastener (11). The fastening device (1, 3) includes: a fastening die (15) that forms the second head part (11c); and a shaft-part pressure-applying device (9) that applies the pressure to the fastening die (15). A determining device (5) determines whether the fastener (11) is defective or not by calculating a load curve defined by the time and the load during which the pressure was applied and then determining whether an amount of change per unit of time in the load curve after a reference load has been exceeded is within a range of a predetermined reference value.
    Type: Application
    Filed: June 28, 2018
    Publication date: February 18, 2021
    Inventors: Takeshi EGUCHI, Takayuki KITOU, Teruhiko HIRASAWA, Hidenori SATO
  • Patent number: 10829095
    Abstract: A washer tank according to an embodiment includes: a first container which stores a washer fluid and retains a temperature of the washer fluid; an inflow pipe through which the washer fluid flows into a storage space in the first container; an outflow pipe through which the washer fluid flows out of the first container from the storage space; and a heating portion which heats the washer fluid, in which all the inflow pipe, the outflow pipe, and the heating portion are disposed in a lower portion of the first container.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: November 10, 2020
    Assignee: MURAKAMI CORPORATION
    Inventor: Hidenori Sato
  • Patent number: 10829094
    Abstract: A washer fluid heating device according to an embodiment includes: a container which stores a washer fluid; a deflector which vertically partitions a storage space for the washer fluid into an upper space and a lower space; an inflow portion through which the washer fluid flows into a lower side of the storage space partitioned by the deflector; an outflow portion which is provided to an upper side of the storage space partitioned by the deflector to cause the washer fluid to flow out of the container; and a heating portion which is positioned in the storage space, in which, in the deflector, a plurality of holes which cause the washer fluid to pass from the lower side toward the upper side of the storage space are disposed to be substantially evenly distributed.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: November 10, 2020
    Assignee: MURAKAMI CORPORATION
    Inventors: Hidenori Sato, Futoshi Suzuki, Masayuki Sugiyama
  • Patent number: 10717416
    Abstract: A washer fluid heating device includes: a cover portion attached to one end of a container to face an accommodation space of a washer fluid; heating means that includes a case having a proximal end portion attached to the cover portion and extending toward the accommodation space, and a heating unit provided inside the case to heat the washer fluid inside the accommodation space through the case; and a detector for detecting a no-water burning state generated due to a decrease in washer fluid inside the accommodation space. The detector is provided inside the case and disposed on a side of the proximal end portion of the case from the healing unit.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: July 21, 2020
    Assignee: MURAKAMI CORPORATION
    Inventor: Hidenori Sato
  • Patent number: 10566373
    Abstract: In a solid state image sensor having two semiconductor substrates or more laminated longitudinally, electrical connection between the semiconductor substrates is made by a fine plug. An insulating film covering a first rear surface of a semiconductor substrate having a light receiving element, and an interlayer insulating film covering a second main surface of a semiconductor substrate mounting a semiconductor element are joined to each other. In its joint surface, a plug penetrating the insulating film and a lug embedded in a connection hole in an upper surface of the interlayer insulating film are joined, and the light receiving element and the semiconductor element are electrically connected through the plugs.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: February 18, 2020
    Assignee: Renesas Electronics Corporation
    Inventors: Yotaro Goto, Tatsuya Kunikiyo, Hidenori Sato
  • Publication number: 20200047718
    Abstract: A cleaning device according to an embodiment is a cleaning device that cleans a light transmission member provided on a camera. The cleaning device includes a filamentary member configured to contact the light transmission member and a rotation member configured to rotate the filamentary member such that the filamentary member moves along the surface of the light transmission member with the filamentary member in contact with the light transmission member.
    Type: Application
    Filed: January 29, 2018
    Publication date: February 13, 2020
    Applicant: MURAKAMI CORPORATION
    Inventors: Hidenori SATO, Futoshi SUZUKI
  • Patent number: 10442406
    Abstract: A washer fluid heating device includes a container that contains a washer fluid, a lid portion attached to a first end of the container to face an accommodation space for the washer fluid, heating means that has a proximal end portion attached to the lid portion and extends toward the accommodation space, and an outflow pipe having an outlet disposed in the accommodation space to allow the washer fluid in the accommodation space to flow out, and the outlet of the outflow pipe is provided such that a space formed between a horizontal plane passing through the outlet and an inner wall surface at a second end on an opposite side to the first end of the container corresponds to 10% or more of a volume of the accommodation space.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: October 15, 2019
    Assignee: MURAKAMI CORPORATION
    Inventor: Hidenori Sato
  • Publication number: 20190273108
    Abstract: A hybrid-bonding-type solid-state imaging device is provided that prevents moisture from entering through the bonded interface and other areas. The solid-state imaging device includes a first interconnect structure over a sensor substrate and a second interconnect structure over a logic substrate, and the first and second interconnect structures are bonded together. At the bonded surface between the first and second interconnect structures, bonding pads formed in the first interconnect structure are bonded to bonding pads formed in the second interconnect structure. Eighth layer portions of a first seal ring formed in the first interconnect structure are bonded to eighth layer portions of a second seal ring formed in the second interconnect structure.
    Type: Application
    Filed: February 19, 2019
    Publication date: September 5, 2019
    Inventors: Hidenori SATO, Koji IIZUKA, Takeshi KAMINO
  • Patent number: 10297624
    Abstract: A reduction is achieved in the power consumption of a solid-state imaging element including a photoelectric conversion element which converts incident light to charge and a transistor which converts the charge obtained in the photoelectric conversion element to voltage. A photodiode and a charge read transistor which are included in a pixel in the CMOS solid-state imaging element are provided in a semiconductor substrate, while an amplification transistor included in the foregoing pixel is provided in a semiconductor layer provided over the semiconductor substrate via a buried insulating layer. In the semiconductor substrate located in a buried insulating layer region, a p+-type back-gate semiconductor region for controlling a threshold voltage of the amplification transistor is provided.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 21, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Tatsuya Kunikiyo, Hidenori Sato, Yotaro Goto, Fumitoshi Takahashi
  • Publication number: 20190111894
    Abstract: A washer tank according to an embodiment includes: a first container which stores a washer fluid and retains a temperature of the washer fluid; an inflow pipe through which the washer fluid flows into a storage space in the first container; an outflow pipe through which the washer fluid flows out of the first container from the storage space; and a heating portion which heats the washer fluid, in which all the inflow pipe, the outflow pipe, and the heating portion are disposed in a lower portion of the first container.
    Type: Application
    Filed: March 1, 2017
    Publication date: April 18, 2019
    Applicant: MURAKAMI CORPORATION
    Inventor: Hidenori SATO
  • Publication number: 20190084529
    Abstract: A washer fluid heating device according to an embodiment includes: a container which stores a washer fluid; a deflector which vertically partitions a storage space for the washer fluid into an upper space and a lower space; an inflow portion through which the washer fluid flows into a lower side of the storage space partitioned by the deflector; an outflow portion which is provided to an upper side of the storage space partitioned by the deflector to cause the washer fluid to flow out of the container; and a heating portion which is positioned in the storage space, in which, in the deflector, a plurality of holes which cause the washer fluid to pass from the lower side toward the upper side of the storage space are disposed to be substantially evenly distributed.
    Type: Application
    Filed: March 1, 2017
    Publication date: March 21, 2019
    Applicant: MURAKAMI CORPORATION
    Inventors: Hidenori SATO, Futoshi SUZUKI, Masayuki SUGIYAMA
  • Patent number: 10212317
    Abstract: The present invention is a rearward imaging device attached to a moving body such as a vehicle, and is provided with an imaging device for capturing images rearward of the moving body, and a housing for accommodating the imaging device. The imaging device has a barrel for holding a transparent member, and a concave part is formed in the rear part of the housing. The barrel penetrates a bottom part of the concave part and protrudes further rearward than a bottom surface of the concave part.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: February 19, 2019
    Assignee: MURAKAMI CORPORATION
    Inventors: Hidenori Sato, Kenji Ichikawa
  • Publication number: 20180366508
    Abstract: In a solid state image sensor having two semiconductor substrates or more laminated longitudinally, electrical connection between the semiconductor substrates is made by a fine plug. An insulating film covering a first rear surface of a semiconductor substrate having a light receiving element, and an interlayer insulating film covering a second main surface of a semiconductor substrate mounting a semiconductor element are joined to each other. In its joint surface, a plug penetrating the insulating film and a lug embedded in a connection hole in an upper surface of the interlayer insulating film are joined, and the light receiving element and the semiconductor element are electrically connected through the plugs.
    Type: Application
    Filed: May 17, 2018
    Publication date: December 20, 2018
    Inventors: Yotaro GOTO, Tatsuya KUNIKIYO, Hidenori SATO
  • Publication number: 20180358393
    Abstract: In a solid-state imaging element having two or more photodiodes stacked in a vertical direction in each of pixels, electrons are prevented from moving between the respective photodiodes of the pixels adjacent to each other. The solid-state imaging element is formed by joining together a back surface of a first semiconductor wafer including one of the photodiodes and a wiring layer and a back surface of a second semiconductor wafer including another of the photodiodes and a wiring layer. By forming a first isolation region extending through a first semiconductor substrate forming the first semiconductor wafer and a second isolation region extending through a second semiconductor substrate forming the second semiconductor wafer, the photodiodes of one of the pixels are isolated from another of the pixels.
    Type: Application
    Filed: March 27, 2018
    Publication date: December 13, 2018
    Inventors: Hidenori SATO, Tatsuya KUNIKIYO, Yotaro GOTO
  • Publication number: 20180350861
    Abstract: A reduction is achieved in the power consumption of a solid-state imaging element including a photoelectric conversion element which converts incident light to charge and a transistor which converts the charge obtained in the photoelectric conversion element to voltage. A photodiode and a charge read transistor which are included in a pixel in the CMOS solid-state imaging element are provided in a semiconductor substrate, while an amplification transistor included in the foregoing pixel is provided in a semiconductor layer provided over the semiconductor substrate via a buried insulating layer. In the semiconductor substrate located in a buried insulating layer region, a p+-type back-gate semiconductor region for controlling a threshold voltage of the amplification transistor is provided.
    Type: Application
    Filed: March 23, 2018
    Publication date: December 6, 2018
    Inventors: Tatsuya KUNIKIYO, Hidenori SATO, Yotaro GOTO, Fumitoshi TAKAHASHI
  • Patent number: 10137835
    Abstract: A rear imaging device is provided. The rear imaging device is attached to a mobile object such as a vehicle, and is provided with an imaging device for imaging an area rearward of the mobile object, and a housing for housing the imaging device. At a rear end portion of the housing, drainer pieces are formed extending rearward. A plurality of the drainer pieces are formed in a circumferential direction of the housing. Tip end portions of the drainer pieces are formed narrower toward tip points thereof, with base portions of the adjacent drainer pieces being adjacent to each other.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: November 27, 2018
    Assignee: MURAKAMI CORPORATION
    Inventors: Hidenori Sato, Kenji Ichikawa