Patents by Inventor Hideo Aoba
Hideo Aoba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6727792Abstract: A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.Type: GrantFiled: August 28, 2002Date of Patent: April 27, 2004Assignee: Taiyo Yuden Co., Ltd.Inventors: Yoshihiro Amada, Hideo Aoba, Kazuhiko Otsuka, Nobuhiro Umeyama, Katsuo Koizumi, Nobuo Mamada, Iwao Fujikawa, Nobuyasu Shiba, Takayuki Uehara
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Publication number: 20020190832Abstract: A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.Type: ApplicationFiled: August 28, 2002Publication date: December 19, 2002Applicant: TAIYO YUDEN CO., LTD.Inventors: Yoshihiro Amada, Hideo Aoba, Kazuhiko Otsuka, Nobuhiro Umeyama, Katsuo Koizumi, Nobuo Mamada, Iwao Fujikawa, Nobuyasu Shiba, Takayuki Uehara
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Patent number: 6449830Abstract: A wire wound electronic component includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.Type: GrantFiled: September 19, 2000Date of Patent: September 17, 2002Assignee: Taiyo Yuden Co., Ltd.Inventors: Yoshihiro Amada, Hideo Aoba, Kazuhiko Otsuka, Nobuhiro Umeyama, Katsuo Koizumi, Nobuo Mamada, Iwao Fujikawa, Nobuyasu Shiba, Takayuki Uehara
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Patent number: 6393691Abstract: The present invention provides an electronic chip component (e.g., a chip inductor) small in size, and a manufacturing method thereof capable of shaping of the outer dimensions of the component into a desirable shape. The method involves press-fitting a chip inductor element into a component storage section of a mold plate comprised of a heat resistant rubber elastic member including the component storage section, while a resin coating material is coated on the element and dried to a dry-to-touch state, thereby hardening the resin coating material and automatically shaping the chip inductor element into a desired outer shape.Type: GrantFiled: January 27, 2000Date of Patent: May 28, 2002Assignee: Taiyo Yuden Co., Ltd.Inventors: Hideki Ogawa, Nobuhiro Umeyama, Hideo Aoba
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Patent number: 6198373Abstract: The present invention is to provide a wire wound electronic component with stable quality, as well as raising reliability thereof by improving heat radiation, water-proofness, resistance against static electricity, resistance against stresses, magnetic characteristic thereof. Powder of one or both of an inorganic material and a metallic material having higher thermal conductivity than a resin is added as a filler in the above resin, or a mixture of one or both of powders of the said inorganic material or the said metallic material and powders of a ferrite material for magnetic shielding is added as a filler in the above resin. When a sealing resin comprising a high thermal conductive material added thereto is used, heat generated inside a wire wound electronic component by passing a current through a coil conductor is effectively released outside the component, and the component can have a good heat radiation.Type: GrantFiled: August 7, 1998Date of Patent: March 6, 2001Assignee: Taiyo Yuden Co., Ltd.Inventors: Hideki Ogawa, Hideo Aoba, Yoshihiro Amada, Takayuki Uehara, Kazuhiko Otsuka, Hideyuki Karasawa, Nobuyasu Shiba
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Patent number: 6154112Abstract: A winding-type chip inductor having an approximately rectangular parallelepiped shape and improved appearance is provided having external electrodes installed directly on a core which is adaptable to a bulk mounting of one-by-one system by a chip mounter. This chip inductor comprises a core consisting of a winding core and rectangular flanges, a first conductive film layer installed directly on the flanges, a winding wound around the winding core with both ends of the winding conductively fixed to the first conductive film layer, and an external covering material covering the outer periphery of the winding and shaped in a rectangular fashion.Type: GrantFiled: July 9, 1999Date of Patent: November 28, 2000Assignee: Taiyo Yuden Co., Ltd.Inventors: Hideo Aoba, Kazuhiko Otsuka, Kei Chigira
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Patent number: 6144280Abstract: A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.Type: GrantFiled: November 10, 1997Date of Patent: November 7, 2000Assignee: Taiyo Yuden Co., Ltd.Inventors: Yoshihiro Amada, Hideo Aoba, Kazuhiko Otsuka, Nobuhiro Umeyama, Katsuo Koizumi, Nobuo Mamada, Iwao Fujikawa, Nobuyasu Shiba, Takayuki Uehara