Patents by Inventor Hideo Miyazawa
Hideo Miyazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240046061Abstract: An RFID tag includes a sheet-like substrate, an IC chip disposed on a first face of the substrate, a conductive adhesive that is positioned around the IC chip along the first face and fixes the IC chip to the substrate, an antenna pattern formed on a second face, of the substrate, that is opposite to the first face, and a through hole that penetrates the substrate toward the conductive adhesive around the IC chip and electrically connects the antenna pattern with the IC chip.Type: ApplicationFiled: July 25, 2023Publication date: February 8, 2024Inventors: Akihiko SAITO, Yasunao MIZUTANI, Yoshiyasu SUGIMURA, Tsuyoshi NIWATA, Mimpei MIURA, Hideo MIYAZAWA, Mao KIKUKAWA
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Publication number: 20190332913Abstract: An RFID tag includes an antenna extending in a longitudinal direction and a reinforcing member extending such that the center thereof projects to opposite sides in a transverse direction. The reinforcing member includes first and second crossover edge portions crossing with the antenna at one and the other side in the longitudinal direction, a first inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, a second inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction, a third inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, and a fourth inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction.Type: ApplicationFiled: March 27, 2019Publication date: October 31, 2019Applicants: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Hiroshi Onuki, Shunji Baba, Yoshiyasu Sugimura, Tsuyoshi Niwata, Hideo Miyazawa, Mimpei Miura, Akihiko Saito
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Patent number: 10390431Abstract: A flexible printed circuit board for coupling to a connector having a plurality of contacts includes a flexible film, a plurality of electrodes disposed on at least one face of the film and configured to come in contact with the contacts of the connector, and one or more slits formed in the film between adjacent electrodes among the plurality of electrodes.Type: GrantFiled: September 18, 2018Date of Patent: August 20, 2019Assignee: FUJITSU COMPONENT LIMITEDInventors: Mitsuki Kanda, Takatoshi Yagisawa, Osamu Daikuhara, Hideo Miyazawa
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Publication number: 20190098757Abstract: A flexible printed circuit board for coupling to a connector having a plurality of contacts includes a flexible film, a plurality of electrodes disposed on at least one face of the film and configured to come in contact with the contacts of the connector, and one or more slits formed in the film between adjacent electrodes among the plurality of electrodes.Type: ApplicationFiled: September 18, 2018Publication date: March 28, 2019Inventors: Mitsuki Kanda, Takatoshi Yagisawa, Osamu Daikuhara, Hideo Miyazawa
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Publication number: 20190020376Abstract: A large-capacity-data high-speed-transfer system transfers large capacity data at high speed with millimeter-wave near field communication (NFC) from a first host device to a second host device. The system includes: a large capacity data card having a millimeter-wave NFC capability, the large capacity data card being fitted with a typical large capacity data memory capable of storing the large capacity data; and a host device adapter to be connected to a host device including the first host device and the second host device, the host device adapter having the millimeter-wave NFC capability, and executing millimeter-wave NFC communications with the large capacity data card to transfer the large capacity data at high speed between the large capacity data card and a host device to be a destination.Type: ApplicationFiled: September 6, 2018Publication date: January 17, 2019Applicant: ASSET-WITS CORPORATIONInventors: Hideo MIYAZAWA, Shutaro NAMBU, Junzoh SHIMIZU, Toshio TAKADA
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Patent number: 10032104Abstract: An RFID tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an IC chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the IC chip to the substrate; and a reinforcement member that covers the IC chip and the adhesive, and that is at a position such that a central portion of the reinforcement member is offset along a length direction of the substrate with respect to the IC chip and the adhesive member.Type: GrantFiled: May 30, 2017Date of Patent: July 24, 2018Assignees: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Takayoshi Matsumura, Yoshiyasu Sugimura, Shunji Baba, Hideo Miyazawa, Mimpei Miura
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Patent number: 10020620Abstract: There is provided a connector connectable to a mating connector that includes a first jack terminal configured to be coupled to a first plug terminal of the mating connector; a second jack terminal configured to be coupled to a second plug terminal of the mating connector; and a third jack terminal configured to be coupled to the second plug terminal of the mating connector, and having a resistor and a capacitor connected in series thereto. Upon the connector being separated from the mating connector, the second jack terminal is separated from the second plug terminal after the third jack terminal is separated from the second plug terminal, and the first jack terminal is separated from the first plug terminal after the second jack terminal is separated from the second plug terminal.Type: GrantFiled: August 16, 2017Date of Patent: July 10, 2018Assignee: FUJITSU COMPONENT LIMITEDInventors: Takashi Yuba, Koichi Kiryu, Akio Nakamura, Hideo Miyazawa
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Patent number: 9972884Abstract: A disclosed RFID tag includes a substrate; a chip bonded to the substrate with an adhesive, and including a first connection terminal on a first surface, the first surface being on a side bonded to the substrate; a first antenna wiring formed on the substrate, and electrically coupled to the first connection terminal; and an adhesive layer formed of the adhesive, and including a base portion and a filet portion, the base portion being in an area of the substrate opposed to the first surface of the chip, the filet portion being in an area of the substrate surrounding the chip. The first antenna wiring is electrically coupled to the first connection terminal via a plurality of paths at an outer edge of the filet portion of the adhesive layer.Type: GrantFiled: July 28, 2016Date of Patent: May 15, 2018Assignees: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Takayoshi Matsumura, Yoshiyasu Sugimura, Hideo Miyazawa, Tatsuro Tsuneno
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Publication number: 20170365958Abstract: There is provided a connector connectable to a mating connector that includes a first jack terminal configured to be coupled to a first plug terminal of the mating connector; a second jack terminal configured to be coupled to a second plug terminal of the mating connector; and a third jack terminal configured to be coupled to the second plug terminal of the mating connector, and having a resistor and a capacitor connected in series thereto. Upon the connector being separated from the mating connector, the second jack terminal is separated from the second plug terminal after the third jack terminal is separated from the second plug terminal, and the first jack terminal is separated from the first plug terminal after the second jack terminal is separated from the second plug terminal.Type: ApplicationFiled: August 16, 2017Publication date: December 21, 2017Inventors: Takashi YUBA, Koichi KIRYU, Akio NAKAMURA, Hideo MIYAZAWA
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Publication number: 20170351945Abstract: An RFID tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an IC chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the IC chip to the substrate; and a reinforcement member that covers the IC chip and the adhesive, and that is at a position such that a central portion of the reinforcement member is offset along a length direction of the substrate with respect to the IC chip and the adhesive member.Type: ApplicationFiled: May 30, 2017Publication date: December 7, 2017Applicants: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Takayoshi Matsumura, Yoshiyasu Sugimura, Shunji Baba, Hideo Miyazawa, Mimpei Miura
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Patent number: 9774145Abstract: There is provided a connector comprising: a given-polarity electrode jack terminal coupled to a given-polarity electrode of a power supply; a first other-polarity electrode jack terminal coupled to an other-polarity electrode of the power supply through a resistor and a capacitor; and a second other-polarity electrode jack terminal coupled to the other-polarity electrode of the power supply; wherein the first other-polarity electrode jack terminal and the second other-polarity electrode jack terminal are respectively in contact with a plug terminal of the other-polarity electrode included in another connector, the first other-polarity electrode jack terminal and the second other-polarity electrode jack terminal are disposed on a line extended in a length direction of the plug terminal of the other-polarity electrode, and the first other-polarity electrode jack terminal is disposed at a position closer to the other connector than a position of the second other-polarity electrode jack terminal.Type: GrantFiled: February 8, 2016Date of Patent: September 26, 2017Assignee: FUJITSU COMPONENT LIMITEDInventors: Takashi Yuba, Koichi Kiryu, Akio Nakamura, Hideo Miyazawa
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Publication number: 20170062904Abstract: A disclosed RFID tag includes a substrate; a chip bonded to the substrate with an adhesive, and including a first connection terminal on a first surface, the first surface being on a side bonded to the substrate; a first antenna wiring formed on the substrate, and electrically coupled to the first connection terminal; and an adhesive layer formed of the adhesive, and including a base portion and a filet portion, the base portion being in an area of the substrate opposed to the first surface of the chip, the filet portion being in an area of the substrate surrounding the chip. The first antenna wiring is electrically coupled to the first connection terminal via a plurality of paths at an outer edge of the filet portion of the adhesive layer.Type: ApplicationFiled: July 28, 2016Publication date: March 2, 2017Applicants: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Takayoshi Matsumura, Yoshiyasu SUGIMURA, Hideo MIYAZAWA, Tatsuro TSUNENO
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Publication number: 20160156138Abstract: There is provided a connector comprising: a given-polarity electrode jack terminal coupled to a given-polarity electrode of a power supply; a first other-polarity electrode jack terminal coupled to an other-polarity electrode of the power supply through a resistor and a capacitor; and a second other-polarity electrode jack terminal coupled to the other-polarity electrode of the power supply; wherein the first other-polarity electrode jack terminal and the second other-polarity electrode jack terminal are respectively in contact with a plug terminal of the other-polarity electrode included in another connector, the first other-polarity electrode jack terminal and the second other-polarity electrode jack terminal are disposed on a line extended in a length direction of the plug terminal of the other-polarity electrode, and the first other-polarity electrode jack terminal is disposed at a position closer to the other connector than a position of the second other-polarity electrode jack terminal.Type: ApplicationFiled: February 8, 2016Publication date: June 2, 2016Inventors: Takashi YUBA, Koichi KIRYU, Akio NAKAMURA, Hideo MIYAZAWA
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Patent number: 8753130Abstract: A joint terminal usable in an interposer. The joint terminal includes a first terminal member; and a second terminal member detachably attached to the first terminal member and electrically conductible to the first terminal member. The second terminal member includes a contact part capable of contacting with and separating from a conductor portion of a counterpart of the interposer; a spring part adapted to generate a contact pressure for pushing the contact part against the conductor portion; and an attachment part abutting on and detachably attached by a frictional force to the first terminal member. The contact part, the spring part and the attachment part are formed integrally with each other as a unitary member.Type: GrantFiled: March 6, 2012Date of Patent: June 17, 2014Assignee: Fujitsu Component LimitedInventors: Koki Sato, Mitsuru Kobayashi, Hideo Miyazawa, Koutarou Yamasita
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Patent number: 8674716Abstract: A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a metal sheet which is bent multiple times, the metal sheet having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together.Type: GrantFiled: May 24, 2013Date of Patent: March 18, 2014Assignee: Fujitsu Component LimitedInventors: Koki Sato, Yasuyuki Miki, Keita Harada, Mitsuru Kobayashi, Hideo Miyazawa, Koki Takahashi
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Publication number: 20130247375Abstract: A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a metal sheet which is bent multiple times, the metal sheet having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together.Type: ApplicationFiled: May 24, 2013Publication date: September 26, 2013Applicant: FUJITSU COMPONENT LIMITEDInventors: Koki Sato, Yasuyuki Miki, Keita Harada, Mitsuru Kobayashi, Hideo Miyazawa, Koki Takahashi
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Patent number: 8506185Abstract: A camera module includes a camera unit, a board, and a driving unit mounted on the board and configured to drive the camera unit. The camera module also includes an elastic camera-side connecting part configured to connect a terminal of the camera unit with wiring on a first surface of the board.Type: GrantFiled: December 12, 2012Date of Patent: August 13, 2013Assignee: Fujitsu Component LimitedInventors: Koki Sato, Mitsuru Kobayashi, Tetsugaku Tanaka, Hideo Miyazawa
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Patent number: 8471578Abstract: A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a sheet-metal plate which is bent multiple times, the sheet-metal plate having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together.Type: GrantFiled: August 30, 2010Date of Patent: June 25, 2013Assignee: Fujitsu Component LimitedInventors: Koki Sato, Yasuyuki Miki, Keita Harada, Mitsuru Kobayashi, Hideo Miyazawa, Koki Takahashi
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Patent number: 8356950Abstract: A camera module includes a camera unit, a board, and a driving unit mounted on the board and configured to drive the camera unit. The camera module also includes an elastic camera-side connecting part configured to connect a terminal of the camera unit with wiring on a first surface of the board.Type: GrantFiled: May 26, 2011Date of Patent: January 22, 2013Assignee: Fujitsu Component LimitedInventors: Koki Sato, Mitsuru Kobayashi, Tetsugaku Tanaka, Hideo Miyazawa
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Publication number: 20120231667Abstract: A joint terminal usable in an interposer. The joint terminal includes a first terminal member; and a second terminal member detachably attached to the first terminal member and electrically conductible to the first terminal member. The second terminal member includes a contact part capable of contacting with and separating from a conductor portion of a counterpart of the interposer; a spring part adapted to generate a contact pressure for pushing the contact part against the conductor portion; and an attachment part abutting on and detachably attached by a frictional force to the first terminal member. The contact part, the spring part and the attachment part are formed integrally with each other as a unitary member.Type: ApplicationFiled: March 6, 2012Publication date: September 13, 2012Applicant: FUJITSU COMPONENT LIMITEDInventors: Koki Sato, Mitsuru Kobayashi, Hideo Miyazawa, Koutarou Yamasita