Patents by Inventor Hideo Mizutani

Hideo Mizutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10724607
    Abstract: Provided is a speed reduction or speed increasing apparatus where the rotational stiffness can be increased, including a housing, a first crown gear, a support unit placed radially outward of the first crown gear to support the first crown gear to be capable of wave motion and incapable of rotation with respect to the housing, a second crown gear configured to be rotatable with respect to the housing, the second crown gear having a different number of teeth from the first crown gear, the second crown gear facing the first crown gear, and a cam unit configured to incline the first crown gear with respect to the second crown gear in such a manner that the first crown gear engages with the second crown gear, and to cause the first crown gear to undergo wave motion in such a manner that the location of contact moves.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: July 28, 2020
    Assignee: THK CO., LTD.
    Inventors: Hideo Saito, Yuichi Mizutani
  • Publication number: 20200118847
    Abstract: A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
    Type: Application
    Filed: December 12, 2019
    Publication date: April 16, 2020
    Applicant: NIKON CORPORATION
    Inventors: Hideo MIZUTANI, Tohru KIUCHI, Toru KAWAGUCHI, Takashi MASUKAWA
  • Patent number: 10541160
    Abstract: A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: January 21, 2020
    Assignee: Nikon Corporation
    Inventors: Hideo Mizutani, Tohru Kiuchi, Toru Kawaguchi, Takashi Masukawa
  • Patent number: 10475806
    Abstract: A semiconductor memory device includes a substrate with a first insulating film thereon, a wiring in the first insulating film, a first electrode film on the first insulating film, a stacked body on the first electrode film, made of alternating second insulating films and second electrode films, a first insulating member extending in a direction to penetrate the stacked body, a first semiconductor film around the first insulating member and connected to the first electrode film, a third insulating film around the first semiconductor film, a first conductive member extending in the direction to penetrate the stacked body and the first electrode film, and connected to the wiring, and a fourth insulating film around the first conductive member. The fourth insulating film has the same film structure as the third insulating film.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 12, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Mikiko Yagi, Hideto Takekida, Takaya Yamanaka, Masaharu Mizutani, Hideo Wada
  • Patent number: 9152062
    Abstract: Presented are methods for forming a predetermined pattern in a predetermined area of an elongated sheet material. The methods include applying a two-dimensional tension to a portion including the predetermined area of the sheet material, and allowing a flat reference surface to adsorb a rear surface portion corresponding to the predetermined area of the sheet material applied with the two-dimensional tension. The methods then illuminate an energy beam corresponding to the pattern to the predetermined area of the sheet material adsorbed to the reference surface.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: October 6, 2015
    Assignee: NIKON CORPORATION
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Patent number: 9113562
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: August 18, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Patent number: 8399263
    Abstract: An expansion/contraction measuring apparatus includes a transport section which transports a flexible substrate along a surface of the substrate; a detecting section detecting first and second marks which are formed on the substrate while being separated from each other by a predetermined spacing distance in a transport direction of the substrate and which are moved, in accordance with the transport of the substrate, to first and second detection areas disposed on a transport route for the substrate respectively; a substrate length setting section which sets a length of the substrate along the transport route between the first and second detection areas to a reference length; and a deriving section which derives information about expansion/contraction of the substrate in relation to the transport direction based on a detection result of the first and second marks. Accordingly, the expansion/contraction state of an expandable/contractible substrate is measured highly accurately.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: March 19, 2013
    Assignee: Nikon Corporation
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Patent number: 8379186
    Abstract: When a segmented region SAi of a sheet S is scan-exposed, a stage SST1 adsorbs, at a standby position at the +X end portion of a scan region AS, a rear surface portion corresponding to the segmented region SAi of the sheet S onto a holding surface of a sheet holder SH1, and moves in the X axis direction (the ?X direction) with a predetermined stroke in synchronization with a mask (a mask stage). At this time, illumination beams corresponding to the parts of a pattern of the mask are irradiated onto the sheet S via projection optical systems. Thereby, the pattern is transferred (formed). After scan-exposure on the segmented region SAi, a stage SST2 moves to a standby position within the XY plane. After the stage SST2 adsorbs a rear surface portion corresponding to the next segmented region SAi+1 of the sheet S onto a holding surface of a sheet holder SH1, an exposure is performed by the scan-exposure method similarly to the above, to thereby form the pattern.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: February 19, 2013
    Assignee: Nikon Corporation
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Publication number: 20130027684
    Abstract: An exposure apparatus that transfers a pattern provided along a predetermined cylindrical surface onto a substrate while rotating the pattern in a circumferential direction of the cylindrical surface is provided, which includes a first projection optical system that projects an image of a first partial pattern of the pattern which is disposed in a first area of the cylindrical surface onto a first projection area, a second projection optical system that projects an image of a second partial pattern of the pattern which is disposed in a second area different from the first area onto a second projection area different from the first projection area, and a guide device that guides the substrate to the first projection area and the second projection area in synchronization with a rotation of the pattern in the circumferential direction.
    Type: Application
    Filed: April 13, 2011
    Publication date: January 31, 2013
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Publication number: 20120270144
    Abstract: Presented are methods for forming a predetermined pattern in a predetermined area of an elongated sheet material. The methods include applying a two-dimensional tension to a portion including the predetermined area of the sheet material, and allowing a flat reference surface to adsorb a rear surface portion corresponding to the predetermined area of the sheet material applied with the two-dimensional tension. The methods then illuminate an energy beam corresponding to the pattern to the predetermined area of the sheet material adsorbed to the reference surface.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 25, 2012
    Inventors: Tohru KIUCHI, Hideo MIZUTANI
  • Patent number: 8264666
    Abstract: An exposure apparatus of one aspect of the present invention is provided with a moving mechanism that moves a first portion of a belt-shaped substrate that has photosensitivity in a first heading along a first direction and moves a second portion of the substrate in a second heading along the first direction, a stage mechanism that holds a mask and moves it in a third heading along a second direction in synchronization with the movement of the substrate, and a projection optical system. The projection optical system forms a first projection image of the pattern on the first portion so that the third heading on the mask and the first heading on the first portion optically correspond, and forms a second projection image of the pattern on the second portion so that the third heading on the mask and the second heading on the second portion optically correspond.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: September 11, 2012
    Assignee: Nikon Corporation
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Patent number: 8235695
    Abstract: Six auxiliary sheet holders SH2 and SH3 temporarily holding a sheet S are minutely driven in the ?Z-axis direction by a control device so that holding surfaces thereof are positioned on the slightly lower side (?Z side) of the holding surface of the sheet holder SH1. Accordingly, an appropriate tension is applied to the sheet S in the width direction (Y-axis direction) and the longitudinal direction, so that the center portion of the sheet S is fixed onto the holding surface of the sheet holder SH1. That is, in the state where an XY two-dimensional tension is applied to a separate area SAi of the sheet S, a rear surface portion corresponding to the separate area SAi of the sheet S is changed in accordance with the flat shape of the holding surface of the sheet holder SH1.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: August 7, 2012
    Assignee: Nikon Corporation
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Publication number: 20120180313
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Application
    Filed: March 22, 2012
    Publication date: July 19, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Hideo MIZUTANI, Toshiyuki MATSUI, Atsushi DEGUCHI
  • Patent number: 8161637
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: April 24, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Publication number: 20110155838
    Abstract: A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Inventors: Hideo MIZUTANI, Tohru KIUCHI, Toru KAWAGUCHI, Takashi MASUKAWA
  • Publication number: 20110016709
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Application
    Filed: April 30, 2010
    Publication date: January 27, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Publication number: 20110013162
    Abstract: When a segmented region SAi of a sheet S is scan-exposed, a stage SST1 adsorbs, at a standby position at the +X end portion of a scan region AS, a rear surface portion corresponding to the segmented region SAi of the sheet S onto a holding surface of a sheet holder SH1, and moves in the X axis direction (the ?X direction) with a predetermined stroke in synchronization with a mask (a mask stage). At this time, illumination beams corresponding to the parts of a pattern of the mask are irradiated onto the sheet S via projection optical systems. Thereby, the pattern is transferred (formed). After scan-exposure on the segmented region SAi, a stage SST2 moves to a standby position within the XY plane. After the stage SST2 adsorbs a rear surface portion corresponding to the next segmented region SAi+1 of the sheet S onto a holding surface of a sheet holder SH1, an exposure is performed by the scan-exposure method similarly to the above, to thereby form the pattern.
    Type: Application
    Filed: July 9, 2010
    Publication date: January 20, 2011
    Inventors: Tohru KIUCHI, Hideo MIZUTANI
  • Publication number: 20110012294
    Abstract: Six auxiliary sheet holders SH2 and SH3 temporarily holding a sheet S are minutely driven in the ?Z-axis direction by a control device so that holding surfaces thereof are positioned on the slightly lower side (?Z side) of the holding surface of the sheet holder SH1. Accordingly, an appropriate tension is applied to the sheet S in the width direction (Y-axis direction) and the longitudinal direction, so that the center portion of the sheet S is fixed onto the holding surface of the sheet holder SH1. That is, in the state where an XY two-dimensional tension is applied to a separate area SAi of the sheet S, a rear surface portion corresponding to the separate area SAi of the sheet S is changed in accordance with the flat shape of the holding surface of the sheet holder SH1.
    Type: Application
    Filed: June 24, 2010
    Publication date: January 20, 2011
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Publication number: 20100265483
    Abstract: An exposure apparatus of one aspect of the present invention is provided with a moving mechanism that moves a first portion of a belt-shaped substrate that has photosensitivity in a first heading along a first direction and moves a second portion of the substrate in a second heading along the first direction, a stage mechanism that holds a mask and moves it in a third heading along a second direction in synchronization with the movement of the substrate, and a projection optical system. The projection optical system forms a first projection image of the pattern on the first portion so that the third heading on the mask and the first heading on the first portion optically correspond, and forms a second projection image of the pattern on the second portion so that the third heading on the mask and the second heading on the second portion optically correspond.
    Type: Application
    Filed: January 22, 2010
    Publication date: October 21, 2010
    Inventors: Tohru Kiuchi, Hideo Mizutani
  • Publication number: 20100105153
    Abstract: An expansion/contraction measuring apparatus includes a transport section which transports a flexible substrate along a surface of the substrate; a detecting section detecting first and second marks which are formed on the substrate while being separated from each other by a predetermined spacing distance in a transport direction of the substrate and which are moved, in accordance with the transport of the substrate, to first and second detection areas disposed on a transport route for the substrate respectively; a substrate length setting section which sets a length of the substrate along the transport route between the first and second detection areas to a reference length; and a deriving section which derives information about expansion/contraction of the substrate in relation to the transport direction based on a detection result of the first and second marks. Accordingly, the expansion/contraction state of an expandable/contractible substrate is measured highly accurately.
    Type: Application
    Filed: August 31, 2009
    Publication date: April 29, 2010
    Inventors: Tohru Kiuchi, Hideo Mizutani