Patents by Inventor Hideo Moriyama

Hideo Moriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7380961
    Abstract: To provide a light source assembly that does not use a printed circuit board and can be manufactured at a low cost even when produced in small quantities, a light source assembly according to the present invention comprises a plurality of light sources and a connective conductor structure extending in a direction of arrangement of the light sources to join the light sources, wherein the connective conductor structure is formed by cutting off parts of a substantially plate-like patterned conductor as required, the patterned conductor being provided with a prescribed pattern. Thus, by changing the parts to be cut off in the patterned conductor, it is possible to manufacture light source assemblies having various light source connection patterns in a single manufacturing line, allowing efficient and low cost manufacture of the light source assemblies to be achieved even when the light sources are manufactured in small quantities.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: June 3, 2008
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Munehiko Yanagita
  • Patent number: 7201511
    Abstract: The present invention provides a light emitting module, comprising: a plurality of thin plate-shaped conductors (2) spaced apart from each other in a first direction; at least one light source (4) connected between at least one pair of adjoining ones of said conductors; and at least one insulating joint member (4) for mechanically joining said plurality of conductors, wherein said at least one insulating joint member exposes both sides of at least a portion of said conductors where said light source is mounted.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: April 10, 2007
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Koichi Yanagita, legal representative, Munehiko Yanagita, deceased
  • Publication number: 20070058378
    Abstract: There is provided a socket device (1, 1a-1g), comprising a plurality of conductors (2); a socket main body (4) coupled to the conductors to hold them together and defining a cavity (5) having an opening at least in one surface to expose part of the conductors so that an electric element (3, 13, 22, 40) can be connected to the conductors exposed in the cavity; and a cap (6, 6a-6n, 6p) having a cap main body (7) for covering at least part of the one surface of the socket main body and attached to the socket main body.
    Type: Application
    Filed: March 11, 2005
    Publication date: March 15, 2007
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa
  • Publication number: 20050239342
    Abstract: The present invention provides a light emitting module, comprising: a plurality of thin plate-shaped conductors (2) spaced apart from each other in a first direction; at least one light source (4) connected between at least one pair of adjoining ones of said conductors; and at least one insulating joint member (4) for mechanically joining said plurality of conductors, wherein said at least one insulating joint member exposes both sides of at least a portion of said conductors where said light source is mounted.
    Type: Application
    Filed: October 24, 2003
    Publication date: October 27, 2005
    Inventors: Hideo Moriyama, Munehiko Yanagita, Koichi Yanagita
  • Publication number: 20040252501
    Abstract: To provide a light source assembly that does not use a printed circuit board and can be manufactured at a low cost even when produced in small quantities, a light source assembly according to the present invention comprises a plurality of light sources and a connective conductor structure extending in a direction of arrangement of the light sources to join the light sources, wherein the connective conductor structure is formed by cutting off parts of a substantially plate-like patterned conductor as required, the patterned conductor being provided with a prescribed pattern. Thus, by changing the parts to be cut off in the patterned conductor, it is possible to manufacture light source assemblies having various light source connection patterns in a single manufacturing line, allowing efficient and low cost manufacture of the light source assemblies to be achieved even when the light sources are manufactured in small quantities.
    Type: Application
    Filed: April 20, 2004
    Publication date: December 16, 2004
    Inventors: Hideo Moriyama, Munehiko Yanagita
  • Patent number: D505662
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: May 31, 2005
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima, Yutaka Hirasawa
  • Patent number: D505663
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: May 31, 2005
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima, Yutaka Hirasawa
  • Patent number: D441884
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: May 8, 2001
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi, Hiroaki Machii
  • Patent number: D441885
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: May 8, 2001
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi, Hiroaki Machii
  • Patent number: D506274
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: June 14, 2005
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima
  • Patent number: D442303
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: May 15, 2001
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi, Hiroaki Machii
  • Patent number: D508234
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: August 9, 2005
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima, Yutaka Hirasawa
  • Patent number: D444895
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: July 10, 2001
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi, Hiroaki Machii
  • Patent number: D444896
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: July 10, 2001
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi, Hiroaki Machii
  • Patent number: D450860
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: November 20, 2001
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi
  • Patent number: D457664
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: May 21, 2002
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi, Kanji Tajima
  • Patent number: D458703
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: June 11, 2002
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Masayuki Katogi
  • Patent number: D477093
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: July 8, 2003
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa
  • Patent number: D477094
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: July 8, 2003
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa
  • Patent number: D559432
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: January 8, 2008
    Assignee: Moriyama Sangyo Kabushiki Kaisha
    Inventors: Hideo Moriyama, Kiyotoshi Hoshikawa