Patents by Inventor Hideo Takuda

Hideo Takuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing semiconductor device having via hole
    Patent number: 5556805
    Abstract: A semiconductor device includes a first layer, a first interconnection layer formed on the first layer, at least one dummy pad formed on the first layer in a vicinity of the first interconnection layer, a second layer which is made of an insulator material and is formed on the first layer so as to cover the first interconnection layer and the dummy pad, and a second interconnection layer formed on the second layer and electrically coupled to the first interconnection layer via a via hole in the second layer. The dummy pad is provided in a vicinity of the via hole so that the second layer is approximately flat at least in the vicinity of the via hole, and the dummy pad is electrically isolated from the first and second interconnection layers.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: September 17, 1996
    Assignee: Fujitsu Limited
    Inventors: Tetsu Tanizawa, Hideo Takuda