Abstract: An inkjet recording head includes a connection-state output circuit provided on the recording element substrate of a recording head, where the connection-state output circuit externally transmits data of the connection state of each of input signal ends. An output from the connection-state output circuit is activated when the same logic as that used when signals are pulled up and/or pulled down is used.

Abstract: A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.

Abstract: A liquid ejection head substrate includes a primary conductive layer; an insulating layer; a pair of secondary conductive layers; a first connecting portion where the primary conductive layer is electrically connected to the secondary conductive layers, the first connecting portion penetrating the insulating layer; and a second connecting portion whose contact area is smaller than that of the first connecting portion. In the secondary conductive layers, a voltage is applied such that a first secondary conductive layer has a higher potential than a second secondary conductive layer.

Abstract: A manufacturing method of an ink jet recording head includes steps of forming a liquid flow path mold material of a soluble resin on a substrate on which an energy generating element is formed, the energy generating element being configured to generate energy for use in discharging ink; forming a coating resin layer of a negative photosensitive resin on the substrate on which the mold material is formed; exposing and developing the coating resin layer to form an ink discharge port in the coating resin layer; and dissolving and removing the mold material to form a liquid flow path. During the exposing of the coating resin layer, a total amount of exposure energy per unit area applied to an exposure region other than a region of the coating resin layer positioned above the mold material is greater than that of exposure energy per unit area applied to the region of the coating resin layer positioned above the mold material.

Abstract: A liquid-discharging recording head includes first and second substrates each having an energy generating element and a supply port, and a support member on which the substrates are arranged. The first substrate is provided on one side in a longitudinal direction of the support member, and the second substrate is provided on an other side in the longitudinal direction of the support member. A driving circuit configured to drive the energy generating element is provided in a larger region between an end of a supply port in the first substrate on the other side in the longitudinal direction and an end of the first substrate on the other side and in a larger region between an end of a supply port in the second substrate on the one side in the longitudinal direction and an end of the second substrate on the one side.

Abstract: When protective portions are independently provided for each energy generation element, a leakage current inspection between the protective portions and the energy generation elements cannot be performed at once. Therefore, there is a concern that the inspection in manufacturing a substrate for liquid ejection head requires time. Therefore, the substrate for liquid ejection head is manufactured by performing a leakage current inspection between a connecting portion that is electrically connected to plurality of protective portions and a terminal to which the plurality of energy generation elements are connected, and thereafter removing the connecting portion.

Abstract: A substrate has M×N heater elements divided into N blocks and time divisionally driven in units of the block, and signal lines for supplying M bits of signals for selecting elements to be driven in each block. The signal lines are divided into two groups, each extending toward the center of a heater element array from a start point at either end side of the array in the array direction, and being used to select M/2 elements closest to the end side of the array. In each groups, the M/2 bit signal lines are arranged so that the number of the signal lines is decremented as the distance from the start point increases, and that the remaining signal lines are shifted toward the array. A temperature sensor for the substrate is provided in an empty area produced at a position corresponding to the center of the array by the shift.

Abstract: A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed.

Abstract: A method of manufacturing a liquid discharge head including a plurality of passages on a substrate, the passages communicating with a plurality of discharge ports configured to discharge liquid. The method includes the step of forming first, second, third, and fourth members, the first member having a shape of one passage, the second member having a shape of another member, the third member being formed near the first member, the fourth member being formed near the second member, the first to fourth members being formed on a surface of the substrate. The method also includes coating the substrate with a cover layer covering the first to fourth members, removing the first member to form the one passage, and removing the second member to form the another passage.

Abstract: A liquid-discharging recording head includes first and second substrates each having an energy generating element and a supply port, and a support member on which the substrates are arranged. The first substrate is provided on one side in a longitudinal direction of the support member, and the second substrate is provided on an other side in the longitudinal direction of the support member. A driving circuit configured to drive the energy generating element is provided in a larger region between an end of a supply port in the first substrate on the other side in the longitudinal direction and an end of the first substrate on the other side and in a larger region between an end of a supply port in the second substrate on the one side in the longitudinal direction and an end of the second substrate on the one side.

Abstract: A liquid discharge head includes a heat accumulation layer provided on a board, an energy generation element configured to generate energy to discharge liquid from a discharge port and including a heat generation resistor layer provided on the heat accumulation layer and formed of a material configured to generate heat through supply of electricity and a pair of electrodes connected to the heat generation resistor layer, and an insulation layer including a silicon compound and provided so as to cover the energy generation element, and a line formed of a metal material provided between the heat accumulation layer and the insulation layer, and in at least a portion at a position closer to a flow path than the energy generation element.

Abstract: According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.

Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.

Abstract: There are provided a printing head substrate, an ink jet printing head and an ink jet printing apparatus, which accurately detect a temperature state in the central part of a heater array on the substrate and restrict an area of the substrate to a minimum. A printing head substrate has a plurality of heating elements, a plurality of ink supply openings, a logic circuit for driving the heating elements; a substrate temperature detecting element for detecting a temperature of the printing head substrate, and input and output pads for carrying out reception and supply of a signal between a printing apparatus, and the logic circuit and the substrate temperature detecting element, wherein a beam integral with the substrate is provided between the plurality of ink supply openings, and the substrate temperature detecting element is arranged on the beam.

Abstract: According to one embodiment, a light emitting device includes a light emitting chip, an external terminal made of a metal material, and a circuit board. The light emitting chip is mounted on the circuit board via the external terminal. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer. The circuit board includes an interconnection bonded to the first metal pillar and the second metal pillar via the external terminal, and a heat radiation material provided on an opposite side of the interconnection and connected to the interconnection.

Abstract: Measurement accuracy in temperature of a substrate for an ink jet head is improved. A substrate for an ink jet head includes diode sensors and aluminum sensors and as plural kinds of substrate temperature sensing elements, each of which has an output voltage property different from each other. The diode sensors and have a property that the output voltage thereof decreases as temperature increases when a constant current is applied to the corresponding sensor. The aluminum sensors and have a property that the output voltage thereof increases as temperature increases when the constant current is applied to the corresponding sensor.

Abstract: An ink jet head producing method includes forming a first flow path forming member in a portion constituting a flow path side wall, which constitutes at least a partitioning portion between flow paths on a substrate; forming a pattern as a mold for the flow path, the pattern being formed over the substrate and a portion of the first flow path forming member; forming a second flow path forming member on the first flow path forming member and the pattern, the second flow path forming member being formed of a material corresponding to the first flow path forming member; forming the discharge port in the second flow path forming member; and forming the flow path by removing the pattern.

Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating film, a first interconnection, a second interconnection, a first metal pillar, a second metal pillar, a resin, and a fluorescent layer. The semiconductor layer has a first major surface, a second major surface formed on an opposite side to the first major surface, and a light emitting layer. The first electrode and the second electrode are provided on the second major surface of the semiconductor layer. The fluorescent layer faces to the first major surface of the semiconductor layer and includes a plurality of kinds of fluorescent materials having different peak wavelengths of emission light.

Abstract: According to one embodiment, a light emitting device includes a stacked body, a p-side and n-side electrodes, an insulating film, a p-side extraction electrode, an n-side extraction electrode, a resin layer and a phosphor layer. The stacked body has a first and a second surface opposite to each other and includes a light emitting layer. A p-side and an n-side electrode are provided on the second surface. An insulating film has openings to which the p-side and n-side electrodes are exposed. A p-side extraction electrode includes a p-side seed metal and a p-side metal wiring layer. An n-side extraction electrode includes an n-side seed metal and an n-side metal wiring layer. A resin layer is filled around the p-side and n-side extraction electrodes, and a phosphor layer is provided on a side of the first surface. Emission light from the light emitting layer is emitted through the first surface.

Abstract: Performing a high-speed recording operation using a slender liquid discharge head substrate causes an uneven temperature distribution for each energy generating element because the center portion of the liquid discharge head substrate is more liable to accumulate heat than the end portion thereof, which may affect the quality of a recorded image. For this reason, the surface of the energy generating element which contacts liquid is separated into a first region and a second region in which a protection film is thicker than the one in the first region, and the area in the first region for the element positioned at the end portion of the array of the elements is made greater than that in the first region at the center portion thereof.