Abstract: The present invention provide a semiconductor device having a first insulating layer provided in contact with a side of an active layer in the direction of thickness thereof, a second insulating layer provided in contact with the other side of the active layer in the direction of the thickness thereof, a first gate electrode for applying a predetermined voltage to the active layer through the first insulating layer, and a second gate electrode for applying a predetermined voltage to the active layer through the second insulating layer. In the semiconductor device, a leak current between the drain and the source is suppressed, thereby obtaining a large driving current.

Abstract: A single crystal silicon thin film having a high electron/hole mobility is uniformly formed at a relatively low temperature, so that production of an active matrix substrate having a built-in high performance driver and an electrooptical apparatus, such as a thin film semiconductor apparatus for display, becomes possible. A single crystal silicon layer is formed by hetero-epitaxial growth from a molten liquid layer of a low melting point metal having silicon dissolved therein by using a crystalline sapphire film formed on a substrate as a seed, and the single crystal silicon layer is used in a top gate type MOS TFT of an electrooptical apparatus, such as an LCD, in which a display part and a peripheral driving circuit are integrated.

Abstract: A plastic lid having a cavity portion is put to cover a pedestal from its front-surface side to its side-surface side, the pedestal having a semiconductor chip mounted thereon. An adhesive agent is charged into a space between the plastic lid and the pedestal so as to bond the plastic lid with the pedestal. Accordingly, a window frame is not necessary, corona discharge treatment or the like is not necessary, and it is therefore not necessary to use a B-stage thermosetting adhesive agent to thereby reduce the manufacturing cost of a semiconductor device of a hollow package structure having such a plastic lid. If a UV radiation setting adhesive agent or a visible radiation setting adhesive agent is used as the adhesive agent, cure time in bonding can be reduced.

Abstract: The present invention provide a semiconductor device having a first insulating layer provided in contact with a side of an active layer in the direction of thickness thereof, a second insulating layer provided in contact with the other side of the active layer in the direction of the thickness thereof, a first gate electrode for applying a predetermined voltage to the active layer through the first insulating layer, and a second gate electrode for applying a predetermined voltage to the active layer through the second insulating layer. In the semiconductor device, a leak current between the drain and the source is suppressed, thereby obtaining a large driving current.

Abstract: A manufacturing method for a semiconductor unit which is capable of reducing the generation of a camber of a base member and enhancing reliability in operation.

Abstract: A photonic device according to the present inventions obtained by resin molding a photonic element mounted on a base using a light-transmitting resin wherein the cured hardness of the light-transmitting resin is set at a value for optimally minimizing the adhesion of dust particles on the surface of the light-transmitting resin and the generation rate of internal cracks of the light-transmitting resin for a predetermined temperature change on the basis of the correlation between the two. A process for fabricating a photonic device according to the present invention comprises resin molding a photonic element by potting a light-transmitting resin having a predetermined viscosity, and applying a predetermined heat treatment for curing the resin to a final hardness after driving out the bubbles from the inside of the light-transmitting resin and for relaxing the curing shrinkage stress.

Abstract: A photonic device according to the present inventions obtained by resin molding a photonic element mounted on a base using a light-transmitting resin wherein the cured hardness of the light-transmitting resin is set at a value for optimally minimizing the adhesion of dust particles on the surface of the light-transmitting resin and the generation rate of internal cracks of the light-transmitting resin for a predetermined temperature change on the basis of the correlation between the two. A process for fabricating a photonic device according to the present invention comprises resin molding a photonic element by potting a light-transmitting resin having a predetermined viscosity, and applying a predetermined heat treatment for curing the resin to a final hardness after driving out the bubbles from the inside of the light-transmitting resin and for relaxing the curing shrinkage stress.

Abstract: A liquid crystal display for a projector, including a pair of substrates, a liquid crystal sealed in a space defined between the pair of substrates, and a translucent radiating plate mounted on at least one of the pair of substrates through a translucent adhesive. With this configuration, heat generated in the liquid crystal display can be efficiently dissipated to the outside with a simple structure. Further, degradation of a displayed image quality due to variations in cell gap can be prevented.

Abstract: The present invention provide a semiconductor device having a first insulating layer provided in contact with a side of an active layer in the direction of thickness thereof, a second insulating layer provided in contact with the other side of the active layer in the direction of the thickness thereof, a first gate electrode for applying a predetermined voltage to the active layer through the first insulating layer, and a second gate electrode for applying a predetermined voltage to the active layer through the second insulating layer. In the semiconductor device, a leak current between the drain and the source is suppressed, thereby obtaining a large driving current.

Abstract: According to the present invention, a method of manufacturing members, with a plurality of members being formed together on a single substrate and the substrate being cut in such a manner as to be divided into individual members after a characteristic evaluation of the members is carried out, comprises the steps of, carrying out the evaluation of the characteristics and applying ink marks of a prescribed height to surfaces of members deemed to have been defective, affixing a protective tape having an adhesive layer of a thickness equal to or greater than the height of the ink marks, to the surface of the substrate and cutting the substrate in such a manner as to be divided into individual members after a lower surface of the substrate has been ground or polished.

Abstract: A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding wires, and a cover of resin joined to the upper surface of the base and having a downwardly open recess housing the charge-coupled device chip and the bonding wires. The leads include respective inner leads having respective joints connected to the bonding wires, the inner leads having portions, except the joints, embedded in the base, and respective outer leads extending from the inner leads.

Abstract: A film manufacturing apparatus includes a circular die having a lip-shaped circular outlet for extruding a molten plastic in an annular form and an air passage for blowing air into the annular molten plastic to form a bubble. A water containing cooling ring cools the bubble and restrains the bubble so as to form a tubular plastic film below the cooling ring. An ultrasonic sensor is arranged near the circular die and extends substantially downwardly obliquely toward the center of the bubble for detecting the distance between the surface of the bubble and the ultrasonic sensor, and a controller controls an air supply regulating valve arranged in a line leading to the air passage to control the size of the bubble. Also, an ambient temperature sensor is arranged for correcting the speed of the ultrasonic signal, and a receiving time selecting device is arranged for correcting the time period during which an ultrasonic signal reflected from the bubble can be received.

Abstract: A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding wires, and a cover of resin joined to the upper surface of the base and having a downwardly open recess housing the charge-coupled device chip and the bonding wires. The leads include respective inner leads having respective joints connected to the bonding wires, the inner leads having portions, except the joints, embedded in the base, and respective outer leads extending from the inner leads.

Abstract: A method of manufacturing a plurality of individual element arrays, including the steps of forming a wafer including a substrate and a plurality of elements formed on the substrate; bonding a transparent protective tape to an upper surface of the wafer to protect the wafer; bonding a supporting tape to a lower surface of the wafer to support the wafer; and cutting the transparent protective tape, the wafer and an upper portion of the supporting tape to form the individual element arrays separated from each other. Accordingly, attachment of dust onto the upper surface of the wafer can be surely prevented by the protective tape in cutting the wafer. Further, accurate cutting of the wafer into a desired shape can be ensured owing to the transparency of the protective tape.

Abstract: A penis erection assisting device contains a sealing member for sealingly accommodating a penis therein, the sealing member having an opening at one end thereof to insert the penis, an extracting hose connected to the sealing member and a pump for extracting air within the sealing member, an expandable circular bag member provided at the opening of the sealing member, and an exhaling hose for supplying air extracted by the pump into the circular bag member to expand the circular bag member.

Abstract: A deflection current from a vertical deflection output circuit is supplied to a series circuit of a vertical deflection coil and a capacitor. A pair of transistors are coupled to a DC voltage source in a complementary arrangement. The bases of these transistors are coupled to a slidable end of a variable resistor coupled to the DC voltage source, respectively through constant voltage elements, which are coupled to each other in the opposite directions. The node of these two transistors is coupled to the node of the deflection coil and the capacitor. As the position of the slidable end of the variable resistor is moved away from the center, one transistor of the pair becomes conductive. With this arrangement, a deflection current free of ripple components can be supplied to the deflection coil in order to adjust the vertical position of an image on the screen of a CRT.

Abstract: A target structure for use with an image pick-up tube is disclosed which has a transparent conductive layer coated on a transparent substrate, a photo-conductive layer on the conductive layer whose main substance is selenium Se, and a semi-insulating oxide layer interposed between the transparent conductive layer and the photo-conductive layer. The semi-insulating oxide layer includes at least one of zinc Zn and cadmium Cd, and at least one of tin Sn and germanium Ge.

Abstract: An artificial corpus cavernosum device which is designed to be implanted into the impaired penis of a patient for the remedy of his impotence and which comprises an at least one artificial corpus cavernosum penis of elongated tubular pouch made of an artificial thin membrane to be implanted into the penis and for selectively receiving and being filled with a fluid therein for erecting the penis, a container means made of an artificial thin membrane for storing said fluid under the normal condition when the penis is not inflated and hence not erected, the container means being implantable into the scrotum, a slenderized conduit means for connecting said at least one artificial corpus cavernosum penis to said container means in fluid communication with one another, and a check valve interposed in fluid communication with said container means and having a valve member provided with a through-hole(s) for allowing said fluid once forcibly delivered from said container means to pass to said artificial corpus cavern