Abstract: Provided is a method for producing a positive electrode active material for an alkali ion secondary battery, the positive electrode active material containing a large amount of a transition metal and enabling operation of the battery. In the method for producing a positive electrode active material for an alkali ion secondary battery, in which the positive electrode active material contains 34 mol % or more of CrO+FeO+MnO+CoO+NiO, the method includes: a step of preparing a positive electrode active material precursor containing crystals; and a step of irradiating the positive electrode active material precursor with light to melt the crystals and amorphize at least a portion of the positive electrode active material precursor.

Abstract: The present invention provides an electrolytic solution capable of providing an electrochemical device, such as a lithium ion secondary battery, or a module that has excellent high-temperature storage performance. The electrolytic solution contains: a homocyclic compound other than aromatic compounds; and a cyclic dicarbonyl compound. The homocyclic compound contains at least one group selected from the group consisting of a nitrile group and an isocyanate group.

Abstract: The invention relates to mixtures, comprising (a) an oligomeric compound, comprising repeat units of the general formula (I) or acid-addition salts thereof and/or (b) a compound of the general formula (II) or acid-addition salts thereof and (c) at least one compound of the general formula (III) and (d) optionally further additives, and also to the use of these mixtures for the stabilization of non-living organic materials with respect to exposure to light, oxygen, and/or heat. The invention further relates to non-living organic materials, comprising at least one of these mixtures, and to articles produced therefrom. The invention further relates to a process for the stabilization of non-living organic materials, with respect to exposure to light, oxygen, and/or heat.

Abstract: The invention relates to mixtures, comprising (a) an oligomeric compound, comprising repeat units of the general formula (I) or acid-addition salts thereof and/or (b) a compound of the general formula (II) or acid-addition salts thereof and (c) at least one compound of the general formula (III) and (d) optionally further additives, and also to the use of these mixtures for the stabilization of non-living organic materials with respect to exposure to light, oxygen, and/or heat. The invention further relates to non-living organic materials, comprising at least one of these mixtures, and to articles produced therefrom. The invention further relates to a process for the stabilization of non-living organic materials, with respect to exposure to light, oxygen, and/or heat.

Abstract: The invention relates to mixtures, comprising (a) an oligomeric compound, comprising repeat units of the general formula (I) or acid-addition salts thereof and/or (b) a compound of the general formula (II) or acid-addition salts thereof and (c) at least one compound of the general formula (III) and (d) optionally further additives, and also to the use of these mixtures for the stabilization of non-living organic materials with respect to exposure to light, oxygen, and/or heat. The invention further relates to non-living organic materials, comprising at least one of these mixtures, and to articles produced therefrom. The invention further relates to a process for the stabilization of non-living organic materials, with respect to exposure to light, oxygen, and/or heat.

Abstract: Provided are patterned circuits with accurately aligned raised features. Also provided are methods for making the circuits using photoresist-on-photoresist patterning.

Abstract: There is provided a method for forming a via hole (2) in a substrate (10) for a flexible printed circuit board, the method being capable of simply forming a via hole having an excellent circularness of an opening portion and high reliability. In a method for forming a via hole in a substrate for a flexible printed circuit board, the method includes the steps: forming a first thin film layer (11) containing metal or alloy and having a thickness of less than 2 ?m on one surface (15) of a substrate, disposing a second thin film layer (12) over the first thin film layer (11), selectively removing a portion, corresponding to a region where the via hole (2) is formed, of the second thin film layer (12), etching the first thin film layer (11), and subjecting the substrate (10) to chemical milling to form the via hole (2).

Abstract: There is provided a means for laminating and bonding a flexible printed circuit and a stiffener film with an adhesive layer therebetween by using a laminator without creating air bubbles at the lamination surface and without using large-scale manufacturing equipment. A method comprising: providing a laminate in which liners are on upper and lower surfaces of a half-cured reactive adhesive layer (3), removing one of the liners from the laminate, and bonding a surface of a first adherend (2) to the first exposed surface of the adhesive layer; removing the other liner from the laminate, pressure bonding a minute embossing pattern (4) surface of an embossed liner to the second exposed surface of the adhesive layer to form a minute embossing pattern on the surface of the adhesive layer; and removing the embossed liner from the surface of the adhesive layer, and thermocompression bonding a second adherend to the surface of the adhesive layer having the minute embossing pattern.

Abstract: To provide a PCB that does not generate a short-circuit problem even at a very small pitch and has high connection reliability a method is provided for connecting a printed circuit board (PCB) to a second circuit board comprising: providing a printed circuit board (PCB) having a connection portion; providing a second circuit board having a connection portion, the second circuit board to be connected to the PCB, wherein the connection portion of one or both of the PCB and second circuit board has at least one conductive bump, positioning the connection portion of the PCB opposite the connection portion of the second circuit board with a thermosetting adhesive film between the connection portions of the PCB and second circuit board, and applying heat and pressure to the connection portions and the thermosetting adhesive film such that the adhesive film is displaced sufficiently to allow electrical contact between the at least one bump and the connection portion of the opposing circuit board and such that the he

Abstract: Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.

Abstract: The present invention provides a wiring board capable of realizing electrical connectivity even with connection leads having a fine pitch of 100 ?m or less. The present invention relates to a wiring board with adhesive film comprising: a wiring board, in which the surface of a connection terminal portion on the end of a connection lead on the wiring board has a non-flat shape formed by a plating method; and, an adhesive film that covers the surface of the connection terminal portion and contains either a thermoplastic resin or a thermoplastic, thermosetting resin.

Abstract: To provide a chip on flex (COF) tape having an improved precision of cumulative pitches while retaining bending properties. [Means to Solve the Problems] A chip on flex (COF) tape having a wiring pattern comprising a plurality of wirings arranged in parallel formed on the surface of a flexible insulating film, wherein a dimension retention pattern is formed on said surface of said flexible insulating film and/or the surface of the side of the film opposite thereto so as to cross the width direction of at least two of said wirings arranged in parallel in the vicinity of the connecting portion of said wiring pattern with a semiconductor chip and/or the connecting portion with an external device.

Abstract: The present invention includes an electronic-circuit article that has a substrate, a plasma deposited layer disposed on the substrate, where the plasma deposited layer comprises at least about 10.0 atomic percent, and a patterned conductive layer disposed above the plasma deposited layer.

Abstract: Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: The present invention provides an ink composition for an ink jet recording process, which exhibits excellent print quality with good water fastness and light fastness and without flying in deflected directions from the ink head or nozzle fill-in even after a prolonged ink jet printing. The ink comprises (1) a carbon black, (2) an organic pigment, (3) a dispersant incorporated in an aqueous medium and (4) a saccharide.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: The present invention provides an ink composition for an ink jet recording process, which exhibits excellent print quality with good water fastness and light fastness and without flying in deflected directions from the ink head or nozzle fill-in even after a prolonged ink jet printing. The ink comprises (1) a carbon black, (2) an organic pigment, (3) a dispersant incorporated in an aqueous medium and (4) a saccharide.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.