Patents by Inventor Hidetaka Miyake

Hidetaka Miyake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230241698
    Abstract: An apparatus includes one wire electrode wound multiple times around a plurality of guide rollers to form a parallel wire part in which a plurality of wire cutting parts are arranged in parallel, a discharge waveform control device that controls an interpolar voltage waveform based on a discharge waveform command, and a wire running control device that controls running of the wire electrode based on a wire electrode running command. Further, there is a cutting stage drive device that controls a relative position between the parallel wire part and the workpiece based on a stage command, a machining state acquisition section that acquires a cutting part electrical characteristic or electrode state information as machining state information, and a machining control device that determines the wire electrode running command, the discharge waveform command, and the stage command based on the machining state information.
    Type: Application
    Filed: September 10, 2020
    Publication date: August 3, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetaka MIYAKE, Atsushi ITOKAZU
  • Patent number: 10300542
    Abstract: A controller controls cutting of simultaneously cutting wafers by performing electrical discharge machining while moving a workpiece relative to cutting wire sections in a direction at right angles to the cutting wire sections in a plane perpendicular to the axial direction of main guide rollers and leaving a connection at which a part of each wafer that has been incompletely cut is still connected to the workpiece, and shape correction of causing the cutting wire sections to perform scanning while performing electrical discharge machining along a path of the cutting wire sections in a cutting direction at the time of the cutting to simultaneously correct the shape of a plurality of cut surfaces that are cut at the time of the cutting.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: May 28, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Takashi Hashimoto, Takashi Yuzawa
  • Patent number: 10220459
    Abstract: To perform highly accurate cutting according to stable power feed from a machining power supply, a wire electric discharge machining apparatus includes a wire wound over main guide rollers a plurality of times to simultaneously perform a plurality of kinds of cutting. Wire laying work for a plurality of the wires on power feed elements is reduced, uniform power is fed to cutting wire sections, stable machining is intended, and according to alignment positions, for each of units, a plurality of the power feed elements are aligned to correspond to a wire parallel arrangement interval of the cutting wire sections set as power feed targets and are disposed to feed power to the cutting wire sections with an interval of at least every other cutting wire section.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: March 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Atsushi Itokazu, Takashi Hashimoto
  • Publication number: 20180229320
    Abstract: A controller controls cutting of simultaneously cutting wafers by performing electrical discharge machining while moving a workpiece relative to cutting wire sections in a direction at right angles to the cutting wire sections in a plane perpendicular to the axial direction of main guide rollers and leaving a connection at which a part of each wafer that has been incompletely cut is still connected to the workpiece, and shape correction of causing the cutting wire sections to perform scanning while performing electrical discharge machining along a path of the cutting wire sections in a cutting direction at the time of the cutting to simultaneously correct the shape of a plurality of cut surfaces that are cut at the time of the cutting.
    Type: Application
    Filed: September 24, 2014
    Publication date: August 16, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetaka MIYAKE, Takashi HASHIMOTO, Takashi YUZAWA
  • Patent number: 9950379
    Abstract: A wire electric discharge machining apparatus is constructed in such a manner as to include: a wire electrode having a plurality of cutting wire portions that are separated from one another in parallel and are opposed to a workpiece; a machining power supply that generates a pulsed machining voltage; a plurality of power feed contact units that are electrically connected to the cutting wire portions and apply the machining voltage between the cutting wire portions and the workpiece; and a nozzle that ejects machining liquid from an ejection opening toward an electrode gap along the cutting wire portions.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: April 24, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Tatsushi Sato, Kazuhiko Fukushima
  • Patent number: 9833854
    Abstract: A workpiece retainer retains a workpiece at a time of a cutting process by a wire electric discharge machining device that cuts a workpiece by electric discharge from wire electrodes that are spaced from each other and are arranged in parallel. The workpiece retainer is formed with a fitting portion, into which the workpiece is fitted substantially without any gap, and has an external shape such that at a time of cutting the workpiece retainer together with the workpiece fitted in the fitting portion, a length along the wire electrodes of a portion where the workpiece retainer and the workpiece face the wire electrodes becomes substantially constant during the cutting process of the workpiece.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: December 5, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takashi Yuzawa, Hidetaka Miyake, Tatsushi Sato, Atsushi Itokazu
  • Patent number: 9707638
    Abstract: A wire electric-discharge machining device includes a control unit that selects a cutting wire to which a pulse voltage is applied by a pulse-voltage generation unit on a basis of an angle formed between an end face of a workpiece and a plane including a plurality of cutting wires, which are not parallel to the end face, an interval between parallel cutting wires, and a relative distance between the cutting wires and the workpiece. A drive unit drives a workpiece in a direction not vertical to the plane including the cutting wires, and the workpiece is cut by electric-discharge machining by applying a pulse voltage.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: July 18, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Atsushi Itokazu, Hidetaka Miyake
  • Patent number: 9643270
    Abstract: A wire machining method includes: a wire electrode set as cutting wires provided in parallel with a distance between the cutting wires of which a predetermined regional part faces a workpiece; a machining power source that generates a pulse-shaped machining voltage; and plural feeder units that are electrically connected to the plural cutting wires respectively of the wire electrode and supply the machining voltage between the cutting wires and the workpiece respectively. In the parallel cutting wires, the feeder units are arranged such that a direction of a current passed to at least a part of the cutting wires becomes a direction different from a direction of a current passed to other cutting wires.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: May 9, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetaka Miyake, Tatsushi Sato
  • Patent number: 9387548
    Abstract: In wire-cut electrical discharge machining apparatuses that simultaneously perform a plurality of cutting processes by engaging a wire between main guide rollers at a plurality of times, a wire-cut electrical discharge machining apparatus is provided that suppresses vibrations at cutting wire sections, to enable the cutting processes under steady-state accuracy. In addition to the main guide rollers, vibration-damping driven guide rollers or vibration-damping guides are included which form a plurality of cutting wire sections where the vibrations are suppressed by guiding the wire into place, and the positions of the cutting wire sections are thereby defined with respect to nozzles.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: July 12, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Tatsushi Sato, Kazuhiko Fukushima
  • Publication number: 20160059338
    Abstract: To perform highly accurate cutting according to stable power feed from a machining power supply, a wire electric discharge machining apparatus includes a wire wound over main guide rollers a plurality of times to simultaneously perform a plurality of kinds of cutting. Wire laying work for a plurality of the wires on power feed elements is reduced, uniform power is fed to cutting wire sections, stable machining is intended, and according to alignment positions, for each of units, a plurality of the power feed elements are aligned to correspond to a wire parallel arrangement interval of the cutting wire sections set as power feed targets and are disposed to feed power to the cutting wire sections with an interval of at least every other cutting wire section.
    Type: Application
    Filed: February 28, 2014
    Publication date: March 3, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetaka MIYAKE, Atsushi ITOKAZU, Takashi HASHIMOTO
  • Publication number: 20150231719
    Abstract: A wire machining method includes: a wire electrode set as cutting wires provided in parallel with a distance between the cutting wires of which a predetermined regional part faces a workpiece; a machining power source that generates a pulse-shaped machining voltage; and plural feeder units that are electrically connected to the plural cutting wires respectively of the wire electrode and supply the machining voltage between the cutting wires and the workpiece respectively. In the parallel cutting wires, the feeder units are arranged such that a direction of a current passed to at least a part of the cutting wires becomes a direction different from a direction of a current passed to other cutting wires.
    Type: Application
    Filed: May 1, 2015
    Publication date: August 20, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetaka MIYAKE, Tatsushi Sato
  • Patent number: 9089916
    Abstract: A wire electric discharge machining apparatus includes a wire electrode, a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound, a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively, and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, in which the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: July 28, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Atsushi Itokazu, Hidetaka Miyake, Tatsushi Sato, Takashi Yuzawa, Kazuhiko Fukushima
  • Patent number: 9050672
    Abstract: A wire machining method includes: a wire electrode set as cutting wires provided in parallel with a distance between the cutting wires of which a predetermined regional part faces a workpiece; a machining power source that generates a pulse-shaped machining voltage; and plural feeder units that are electrically connected to the plural cutting wires respectively of the wire electrode and supply the machining voltage between the cutting wires and the workpiece respectively. The feeder units are arranged such that a direction of a current passed to at least a part of the cutting wires becomes a direction different from a direction of a current passed to other cutting wires.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: June 9, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Tatsushi Sato
  • Publication number: 20150053650
    Abstract: A wire discharge machining apparatus including a plurality of main guide rollers disposed in parallel at intervals, one wire that is wound between the guide rollers while being spaced apart from one another at a fixed pitch to form cutting wire sections between a pair of guide rollers and travels according to the rotation of the main guide rollers, and power feed terminal units that feed electric power to wires of the cutting wire sections. The wire discharge machining apparatus performs cutting of a work piece with the cutting wire sections, suspends cut-out of semiconductor wafers from the work piece in a state in which a part of the semiconductor wafers is connected to the work piece, brings the wires of the cutting wire sections close to one cut surfaces, and scans the cut surfaces in a discharge-machined state.
    Type: Application
    Filed: October 19, 2012
    Publication date: February 26, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Atsushi Itokazu, Yosuke Nakanishi
  • Publication number: 20140332503
    Abstract: A wire electric-discharge machining device includes a control unit that selects a cutting wire to which a pulse voltage is applied by a pulse-voltage generation unit on a basis of an angle formed between an end face of a workpiece and a plane including a plurality of cutting wires, which are not parallel to the end face, an interval between parallel cutting wires, and a relative distance between the cutting wires and the workpiece. A drive unit drives a workpiece in a direction not vertical to the plane including the cutting wires, and the workpiece is cut by electric-discharge machining by applying a pulse voltage.
    Type: Application
    Filed: December 17, 2012
    Publication date: November 13, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Atsushi Itokazu, Hidetaka Miyake
  • Patent number: 8829383
    Abstract: Based on a discharging gap value and machining allowance value stored in a corner-control-information storing means 20, a speed-ratio calculating means 23 being a machining-volume calculating means calculates machining volumes of a straight line portion and a corner portion to calculate a volume ratio therebetween. A corner-portion-speed calculating means 24 calculates a machining feed speed at the corner portion based on a volume ratio calculated by the speed-ratio calculating means 23, and then outputs to a servo amplifier 8 on the basis of the length of a pre-corner section outputted by a pre-corner-section calculating means 21 and the length of a post-corner section outputted by a post-corner-section calculating means 22, instructions about machining feed speeds from entering the pre-corner section till getting out of the post-corner section.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: September 9, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasuo Onodera, Tamayo Ohata, Tatsushi Sato, Hidetaka Miyake, Takashi Yuzawa, Atsushi Taneda
  • Patent number: 8664559
    Abstract: An electrical discharge machine feeds an electrode wire received within a guide tube to a process region of a machined article. The electrical discharge machine includes a cylindrical hollow driving shaft arranged in a vertical direction, which has a space for receiving the guide tube with the electrode wire along a vertical central axis. A head assembly includes a first holding member for holding the guide tube, and a second holding member for holding the electrode wire extending from a bottom opening of the guide tube. The head assembly is detachably coupled with a bottom portion of the driving shaft. Therefore, the electrode wire can be replaced by replacing the head assembly.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: March 4, 2014
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hidetaka Miyake, Takayuki Nakagawa, Yoshihito Imai
  • Publication number: 20130240487
    Abstract: In wire-cut electrical discharge machining apparatuses that simultaneously perform a plurality of cutting processes by engaging a wire between main guide rollers at a plurality of times, a wire-cut electrical discharge machining apparatus is provided that suppresses vibrations at cutting wire sections, to enable the cutting processes under steady-state accuracy. In addition to the main guide rollers, vibration-damping driven guide rollers or vibration-damping guides are included which form a plurality of cutting wire sections where the vibrations are suppressed by guiding the wire into place, and the positions of the cutting wire sections are thereby defined with respect to nozzles.
    Type: Application
    Filed: May 18, 2011
    Publication date: September 19, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetaka Miyake, Tatsushi Sato, Kazuhiko Fukushima
  • Publication number: 20130140277
    Abstract: A wire electric discharge machining apparatus includes a wire electrode, a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound, a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively, and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, in which the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors.
    Type: Application
    Filed: June 14, 2011
    Publication date: June 6, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Atsushi Itokazu, Hidetaka Miyake, Tatsushi Sato, Takashi Yuzawa, Kazuhiko Fukushima
  • Publication number: 20130043217
    Abstract: A workpiece retainer retains a workpiece at a time of a cutting process by a wire electric discharge machining device that cuts a workpiece by electric discharge from wire electrodes that are spaced from each other and are arranged in parallel. The workpiece retainer is formed with a fitting portion, into which the workpiece is fitted substantially without any gap, and has an external shape such that at a time of cutting the workpiece retainer together with the workpiece fitted in the fitting portion, a length along the wire electrodes of a portion where the workpiece retainer and the workpiece face the wire electrodes becomes substantially constant during the cutting process of the workpiece.
    Type: Application
    Filed: March 23, 2011
    Publication date: February 21, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takashi Yuzawa, Hidetaka Miyake, Tatsushi Sato, Atsushi Itokazu