Patents by Inventor Hideto Kato

Hideto Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140011126
    Abstract: Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300° C. following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method.
    Type: Application
    Filed: September 6, 2013
    Publication date: January 9, 2014
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shohei Tagami, Takato Sakurai, Hideto Kato
  • Publication number: 20130323631
    Abstract: A photo-curable resin composition comprising an epoxy-containing polymer, a photoacid generator in the form of an onium salt having tetrakis(pentafluorophenyl)borate anion, a solvent, and optionally an epoxy resin crosslinker forms a coating which serves as a protective film for the protection of electric/electronic parts.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 5, 2013
    Inventors: Satoshi ASAI, Kyoko SOGA, Hideto KATO
  • Publication number: 20130302983
    Abstract: The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R21R22R23SiO1/2, and a SiO4/2 unit in a molar ratio of R21R22R23SiO1/2 unit/SiO4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support.
    Type: Application
    Filed: April 23, 2013
    Publication date: November 14, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahito TANABE, Michihiro SUGO, Shohei TAGAMI, Hiroyuki YASUDA, Hideto KATO
  • Publication number: 20130280886
    Abstract: A wafer processing laminate is provided comprising a support (3), a temporary adhesive layer (2), and a wafer (1). The temporary adhesive layer (2) has a trilayer structure consisting of a first temporary bond layer (A) of thermoplastic siloxane bond-free polymer, a second temporary bond layer (B) of thermoplastic siloxane polymer, and a third temporary bond layer (C) of thermosetting modified siloxane polymer. In a peripheral region, the second layer (B) is removed so that the first layer (A) is in close contact with the third layer (C).
    Type: Application
    Filed: April 23, 2013
    Publication date: October 24, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideto Kato, Michihiro Sugo, Shohei Tagami, Hiroyuki Yasuda
  • Patent number: 8501879
    Abstract: A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of l and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)?1.0; and each of X and Y is a bivalent organic group.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: August 6, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori Kondo, Michihiro Sugo, Hideto Kato
  • Patent number: 8487062
    Abstract: The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): in which k and m are each a positive integer where k and m satisfy a relation of 0.01?k/(k+m)<1; and X, Y and W are as those defined in the specification.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: July 16, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Michihiro Sugo, Shohei Tagami, Hideto Kato
  • Patent number: 8481244
    Abstract: A photo-curable resin composition comprising an epoxy-containing silphenylene or silicone polymer with a Mw of 3,000-500,000 forms a coating which is useful as a protective film for electric/electronic parts.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: July 9, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takanobu Takeda, Hideto Kato
  • Patent number: 8476379
    Abstract: There is disclosed a silphenylene skeleton-containing silicone type polymer comprising a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 5,000 to 40,000. There can be a novel silphenylene skeleton-containing silicone type polymer which enables to satisfy both chemical resistance and adhesiveness to a substrate and can be used as a material for a thermosetting resin for forming coatings for protecting substrates, circuits, and interconnections; and a method for manufacturing the same.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: July 2, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroyuki Yasuda, Takato Sakurai, Takanobu Takeda, Hideto Kato
  • Patent number: 8466041
    Abstract: Provided is a method for manufacturing a lamination type semiconductor integrated device that can simultaneously attain grinding force resistance during back side grinding of a semiconductor wafer, heat resistance during anisotropic dry etching and the like, chemical resistance during plating and etching, smooth debonding of a support substrate for processing at the end, and low adherend staining; the method comprises at least a step of back side grinding of a first semiconductor wafer having a device formed on its surface and a step of laminating by electrical bonding the first semiconductor wafer with a second semiconductor wafer having a device formed on its surface, wherein, at the time of back side grinding of the first semiconductor wafer, back of the first semiconductor wafer is ground after surface of formed device on the first semiconductor wafer is bonded to a support substrate for processing by using a pressure-sensitive silicone adhesive.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: June 18, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuyoshi Kuroda, Kazunori Kondo, Hideto Kato
  • Patent number: 8378148
    Abstract: Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: February 19, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takato Sakurai, Michihiro Sugo, Takanobu Takeda, Hideto Kato
  • Publication number: 20130029145
    Abstract: A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.
    Type: Application
    Filed: July 24, 2012
    Publication date: January 31, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideto Kato, Michihiro Sugo, Shohei Tagami
  • Publication number: 20120276717
    Abstract: The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.
    Type: Application
    Filed: February 27, 2012
    Publication date: November 1, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahiro FURUYA, Hiroyuki YASUDA, Shohei TAGAMI, Michihiro SUGO, Hideto KATO
  • Patent number: 8263308
    Abstract: A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): wherein X is a tetravalent group at least a part of which is a tetravalent organic group represented by the formula (2): wherein R1 is a monovalent hydrocarbon group, R2 is a trivalent group, and n is an integer of 1 to 120 on average; and Y is a divalent organic group at least a part of which is a divalent organic group having a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group represented by the formula (3): wherein R3 and R4 are a hydrogen atom or an alkyl group, and R5 is an alkyl group, an aryl group, or an aralkyl group.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: September 11, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shohei Tagami, Takanobu Takeda, Michihiro Sugo, Hideto Kato
  • Publication number: 20120175045
    Abstract: A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.
    Type: Application
    Filed: January 5, 2012
    Publication date: July 12, 2012
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masahiro Furuya, Shohei Tagami, Hideto Kato, Hideyuki Ito, Masahiro Yoshizawa
  • Publication number: 20120139131
    Abstract: The invention provides a wafer mold material for collectively subjecting a wafer having semiconductor devices on a surface thereof to resin molding, wherein the wafer mold material has a resin layer containing a filler and at least any one of an acrylic resin, a silicone resin having an epoxy group, an urethane resin, and a polyimide silicone resin, and the wafer mold material is formed into a film-like shape. There can be a wafer mold material that enables collective molding (wafer molding) with respect to a wafer having semiconductor devices formed thereon, has excellent transference performance with respect to a large-diameter thin-film wafer, can provide a flexible hardened material with low-stress properties, and can be preferably used as a mold material in a wafer level package with less warp of a formed (molded) wafer.
    Type: Application
    Filed: November 15, 2011
    Publication date: June 7, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Michihiro SUGO, Kazunori KONDO, Hideto KATO
  • Publication number: 20120108762
    Abstract: A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of 1 and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)?1.0; and each of X and Y is a bivalent organic group.
    Type: Application
    Filed: August 30, 2011
    Publication date: May 3, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazunori KONDO, Michihiro SUGO, Hideto KATO
  • Publication number: 20120094222
    Abstract: A photocurable composition includes: (A) an epoxy group-containing polymer compound having repeating units represented by the following formula (1), where R1 to R4 are each a hydrocarbon group, m is an integer of 1 to 100, a, b, c and d are each 0 or a positive number, such that 0<(c+d)/(a+b+c+d)?1.0, and X and Y are each the formula (2) or (3), provided that at least one group of the formula (3) is present, (B) a photoacid generator represented by the formula (8) and (C) a solvent.
    Type: Application
    Filed: October 12, 2011
    Publication date: April 19, 2012
    Inventors: Kyoko SOGA, Takanobu Takeda, Hideto Kato
  • Publication number: 20110311788
    Abstract: Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300° C. following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 22, 2011
    Applicant: Shin -Etsu Chemical Co., Ltd.
    Inventors: Shohei TAGAMI, Takato Sakurai, Hideto Kato
  • Publication number: 20110305990
    Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.
    Type: Application
    Filed: June 10, 2011
    Publication date: December 15, 2011
    Inventors: Hideto KATO, Hiroshi Kanbara, Tomoyoshi Furihata, Yoshinori Hirano
  • Publication number: 20110275768
    Abstract: There is disclosed a silphenylene skeleton-containing silicone type polymer comprising a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 5,000 to 40,000. There can be a novel silphenylene skeleton-containing silicone type polymer which enables to satisfy both chemical resistance and adhesiveness to a substrate and can be used as a material for a thermosetting resin for forming coatings for protecting substrates, circuits, and interconnections; and a method for manufacturing the same.
    Type: Application
    Filed: April 27, 2011
    Publication date: November 10, 2011
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki YASUDA, Takato SAKURAI, Takanobu TAKEDA, Hideto KATO