Patents by Inventor Hideto Ogasawara
Hideto Ogasawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10696816Abstract: The present invention addresses the problem of providing a polyester resin composition for reflective materials which gives a reflective material having a high reflectance. The polyester resin composition for reflective materials comprises: a polyester resin (A) comprising an alicyclic dicarboxylic acid ingredient unit (a1) and an aliphatic diol ingredient unit (b1); and a white pigment (B). The amount of the alicyclic dicarboxylic acid ingredient unit (a1) is 50 mol % or more of the amount of all the dicarboxylic acid ingredient units (a) in the polyester resin (A), and the amount of the aliphatic diol ingredient unit (b1) is 50 mol % or more of the amount of all the diol ingredient units (b) in the polyester resin (A). The alicyclic dicarboxylic acid ingredient unit (a1) comprises the cis and trans forms of cis-trans isomers, the proportion of the cis form determined by NMR being 20 mol % or higher.Type: GrantFiled: March 26, 2015Date of Patent: June 30, 2020Assignee: MITSUI CHEMICALS, INC.Inventors: Kaoru Ohshimizu, Hideto Ogasawara, Hiroki Ebata, Takashi Hama, Fumio Kageyama, Shintaro Mitsunaga, Nobuhiro Takizawa, Akinori Amano
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Patent number: 10011715Abstract: The purpose of the present invention is to provide a polyester resin with improved mechanical properties, molding performance, and, preferably, fire retardancy. This polyester resin composition contains the following: a polyester resin (A) that has a melting point or glass transition temperature of at least 250° C.; a thermoplastic resin (B) that has an olefin-derived constitutional unit and an aromatic hydrocarbon structure and has an intrinsic viscosity ([?]), as measured in decalin at 135° C., of 0.04 to 1.0 dl/g; and a copolymer (C) that has an olefin-derived constitutional unit, an ?,?-unsaturated-carboxylic-ester-derived constitutional unit, and a cyclic oxy-hydrocarbon structure.Type: GrantFiled: November 19, 2013Date of Patent: July 3, 2018Assignee: MITSUI CHEMICALS, INC.Inventors: Isao Washio, Hideto Ogasawara, Hiroki Ebata, Fumio Kageyama, Nobuhiro Takizawa, Akinori Amano
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Patent number: 9932444Abstract: To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.Type: GrantFiled: November 12, 2013Date of Patent: April 3, 2018Assignee: MITSUI CHEMICALS, INC.Inventors: Isao Washio, Hiroki Ebata, Fumio Kageyama, Toshitaka Kosaka, Hideto Ogasawara, Akinori Amano, Nobuhiro Takizawa
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Patent number: 9732223Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.Type: GrantFiled: July 25, 2014Date of Patent: August 15, 2017Assignee: MITSUI CHEMICALS, INC.Inventors: Isao Washio, Hiroki Ebata, Hideto Ogasawara, Nobuhiro Takizawa, Fumio Kageyama, Akinori Amano
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Publication number: 20170210883Abstract: The purpose of the present invention is to provide a resin composition for obtaining a reflective panel that has high reflectivity, and that experiences minimal decline in reflectivity even when exposed to heat in the course of an LED package manufacturing process, a reflow soldering process during mounting of an LED package, or the like, or to heat and light from a light source in the service environment. This resin composition for a reflective panel includes 45-80 mass % of a thermoplastic resin (A) comprising at least one of a polyester resin (A1) and a polyamide resin (A2), that have a melting point (Tm) or glass transition temperature (Tg) of at least 250° C., as measured by a differential scanning calorimeter (DSC), 17-54.99% of a white pigment (B), and 0.01-3 mass % of at least one compound (C) represented by general formula (1) (wherein (A), (B), and (C) total 100 mass %).Type: ApplicationFiled: June 29, 2015Publication date: July 27, 2017Applicant: MITSUI CHEMICALS, INC.Inventors: Kaoru OHSHIMIZU, Hideto OGASAWARA, Hiroki EBATA, Takashi HAMA
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Publication number: 20170210879Abstract: The purpose of the present invention is to provide a polyester resin composition for a reflection plate having high reflectance and small decrease of reflectance under exposure to heat during production of an LED package or reflow soldering step for mounting, or exposure to heat and light from a light source. A polyester resin composition of the present invention contains: 30-80% by mass of (A) a polyester resin having a melting point or glass transition temperature of 250° C. or more as measured by DSC; 5-30% by mass of (B) a fibrous reinforcing material having an average fiber length (l) of 2-300 ?m, an average fiber diameter (d) of 0.05-18 ?m and an aspect ratio (l/d) of 2-20, said aspect ratio being a quotient of 1 by d; and 5-50% by mass of (C) a white pigment (with the total of (A), (B) and (C) being 100% by mass).Type: ApplicationFiled: June 29, 2015Publication date: July 27, 2017Applicant: Mitsui Chemicals, Inc.Inventors: Kaoru OHSHIMIZU, Hideto OGASAWARA, Hiroki EBATA, Takashi HAMA
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Publication number: 20170174863Abstract: The present invention addresses the problem of providing a polyester resin composition for reflective materials which gives a reflective material having a high reflectance. The polyester resin composition for reflective materials comprises: a polyester resin (A) comprising an alicyclic dicarboxylic acid ingredient unit (a1) and an aliphatic diol ingredient unit (b1); and a white pigment (B). The amount of the alicyclic dicarboxylic acid ingredient unit (a1) is 50 mol % or more of the amount of all the dicarboxylic acid ingredient units (a) in the polyester resin (A), and the amount of the aliphatic diol ingredient unit (b1) is 50 mol % or more of the amount of all the diol ingredient units (b) in the polyester resin (A). The alicyclic dicarboxylic acid ingredient unit (a1) comprises the cis and trans forms of cis-trans isomers, the proportion of the cis form determined by NMR being 20 mol % or higher.Type: ApplicationFiled: March 26, 2015Publication date: June 22, 2017Applicant: MITSUI CHEMICALS, INC.Inventors: Kaoru OHSHIMIZU, Hideto OGASAWARA, Hiroki EBATA, Takashi HAMA, Fumio KAGEYAMA, Shintaro MITSUNAGA, Nobuhiro TAKIZAWA, Akinori AMANO
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Publication number: 20160168381Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.Type: ApplicationFiled: July 25, 2014Publication date: June 16, 2016Applicant: MITSUI CHEMICALS, INC.Inventors: Isao WASHIO, Hiroki EBATA, Hideto OGASAWARA, Nobuhiro TAKIZAWA, Fumio KAGEYAMA, Akinori AMANO
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Publication number: 20160090482Abstract: The present invention is directed to a polyester resin composition for providing a reflector having excellent mechanical strength and heat resistance, maintaining high reflectance even in a heated environment such as an LED manufacturing process or a reflow soldering process, and having small change in shrinkage rate. The polyester resin composition for a reflective material is a composition comprising 30 to 80% by mass of a polyester resin (A) with a melting point or a glass transition temperature of 250° C. or more, 10 to 35% by mass of a glass fiber (B) with a minor axis of 3 to 8 ?m, 5 to 50% by mass of a white pigment (C), and 0.3 to 1.5% by mass of an olefin polymer (D) containing 0.2 to 1.8% of a functional group structural unit (all based on a total of (A), (B), (C) and (D) which is 100% by mass).Type: ApplicationFiled: May 9, 2014Publication date: March 31, 2016Applicant: MITSUI CHEMICALS., INC.Inventors: Hiroki EBATA, Hideto OGASAWARA, Isao WASHIO, Fumio KAGEYAMA, Nobuhiro TAKIZAWA, Akinori AMANO, Takashi HAMA
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Publication number: 20150329670Abstract: To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.Type: ApplicationFiled: November 12, 2013Publication date: November 19, 2015Applicant: MITSUI CHEMICALS, INC.Inventors: Isao WASHIO, Hiroki EBATA, Fumio KAGEYAMA, Toshitaka KOSAKA, Hideto OGASAWARA, Akinori AMANO, Nobuhiro TAKIZAWA
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Patent number: 9151455Abstract: The purpose of the present invention is to provide a thermoplastic resin composition for a reflector plate with which it is possible to obtain a molded article having excellent moldability, high mechanical strength, excellent heat resistance and a high reflectance that is stable over time, and it is possible to obtain a reflector plate with which there is little reduction in reflectance due to heating. The thermoplastic resin composition for a reflector of the invention comprises 30 to 80 weight % of a thermoplastic resin (A) having structural units containing carbonyl groups and a melting point or glass transition temperature of 250° C. or higher, 10 to 50 weight % of an inorganic filler (B) containing an inorganic filler (B-1) that comprises a carbonyl structure and has an aspect ratio of 10 to 100, and 5 to 50 weight % of a white pigment (C).Type: GrantFiled: June 7, 2012Date of Patent: October 6, 2015Assignee: MITSUI CHEMICALS, INC.Inventors: Hideto Ogasawara, Takashi Hama, Nobuhiro Takizawa, Akinori Amano
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Patent number: 9153757Abstract: The purpose of the present invention is to provide a thermoplastic resin composition for a reflective material which has excellent mechanical strength, excellent heat resistance, excellent high reflectance, and excellent moldability, and which makes it possible to obtain a reflective plate with little decline in reflectance caused by heating. A first embodiment of this thermoplastic resin composition for a reflective material includes: a polyester resin (A) that has a melting point or glass transition temperature of 250° C. or higher and includes an alicyclic hydrocarbon structure; a thermoplastic resin (B) that has a polyolefin backbone and a functional group; a white pigment (C); and an inorganic filler (D); the thermoplastic resin (B) either including 0.1 to 1.8 wt % of a functional group unit (B1) that further includes a heteroatom, or further including an aromatic hydrocarbon structure (B2), and the limiting viscosity [?] being 0.04 to 1.0 dl/g.Type: GrantFiled: July 31, 2012Date of Patent: October 6, 2015Assignee: MITSUI CHEMICALS, INC.Inventors: Hideto Ogasawara, Takashi Hama, Kuniaki Kawabe, Hirotaka Kanaya, Nobuhiro Takizawa, Akinori Amano, Hiroki Ebata, Kan Komiya
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Publication number: 20150274964Abstract: The purpose of the present invention is to provide a polyester resin with improved mechanical properties, molding performance, and, preferably, fire retardancy. This polyester resin composition contains the following: a polyester resin (A) that has a melting point or glass transition temperature of at least 250° C.; a thermoplastic resin (B) that has an olefin-derived constitutional unit and an aromatic hydrocarbon structure and has an intrinsic viscosity ([?]), as measured in decalin at 135° C., of 0.04 to 1.0 dl/g; and a copolymer (C) that has an olefin-derived constitutional unit, an ?,?-unsaturated-carboxylic-ester-derived constitutional unit, and a cyclic oxy-hydrocarbon structure.Type: ApplicationFiled: November 19, 2013Publication date: October 1, 2015Applicant: Mitsui Chemicals, Inc.Inventors: Isao Washio, Hideto Ogasawara, Hiroki Ebata, Fumio Kageyama, Nobuhiro Takizawa, Akinori Amano
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Publication number: 20140167091Abstract: The purpose of the present invention is to provide a thermoplastic resin composition for a reflective material which has excellent mechanical strength, excellent heat resistance, excellent high reflectance, and excellent moldability, and which makes it possible to obtain a reflective plate with little decline in reflectance caused by heating. A first embodiment of this thermoplastic resin composition for a reflective material includes: a polyester resin (A) that has a melting point or glass transition temperature of 250° C. or higher and includes an alicyclic hydrocarbon structure; a thermoplastic resin (B) that has a polyolefin backbone and a functional group; a white pigment (C); and an inorganic filler (D); the thermoplastic resin (B) either including 0.1 to 1.8 wt % of a functional group unit (B1) that further includes a heteroatom, or further including an aromatic hydrocarbon structure (B2), and the limiting viscosity [?] being 0.04 to 1.0 dl/g.Type: ApplicationFiled: July 31, 2012Publication date: June 19, 2014Applicant: Mitsui Chemicals, Inc.Inventors: Hideto Ogasawara, Takashi Hama, Kuniaki Kawabe, Hirotaka Kanaya, Nobuhiro Takizawa, Akinori Amano, Hiroki Ebata, Kan Komiya
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Patent number: 8710132Abstract: Disclosed is a flame-retardant polyamide composition excellent in fluidity during molding and granulation ability on a twin-screw extruder or the like. A molded article produced from the composition is excellent in mechanical properties including stiffness, heat resistance and flame retardancy during a reflow soldering process, and shows low warpage. Specifically disclosed is a flame-retardant polyamide composition comprising 20 to 80 mass % of a specific polyamide resin (A), 1 to 40 mass % of a flame retardant (B), 5 to 60 mass % of a glass fiber (C), and 0.5 to 5 mass % of an auxiliary flame retardant (D), which can be molded in an article having reduced warpage. Preferably, the glass fiber (C) has a cross section having an aspect ratio of greater than 3.Type: GrantFiled: November 19, 2007Date of Patent: April 29, 2014Assignee: Mitsui Chemicals, Inc.Inventors: Hideto Ogasawara, Masashi Seki
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Publication number: 20140097737Abstract: The purpose of the present invention is to provide a thermoplastic resin composition for a reflector plate with which it is possible to obtain a molded article having excellent moldability, high mechanical strength, excellent heat resistance and a high reflectance that is stable over time, and it is possible to obtain a reflector plate with which there is little reduction in reflectance due to heating. The thermoplastic resin composition for a reflector of the invention comprises 30 to 80 weight % of a thermoplastic resin (A) having structural units containing carbonyl groups and a melting point or glass transition temperature of 250° C. or higher, 10 to 50 weight % of an inorganic filler (B) containing an inorganic filler (B-1) that comprises a carbonyl structure and has an aspect ratio of 10 to 100, and 5 to 50 weight % of a white pigment (C).Type: ApplicationFiled: June 7, 2012Publication date: April 10, 2014Applicant: Mitsui Chemicals Inc.Inventors: Hideto Ogasawara, Takashi Hama, Nobuhiro Takizawa, Akinori Amano
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Patent number: 8426549Abstract: A polyamide resin composition for reflectors, which gives a molding having high mechanical strength and excellent heat resistance and which stably exhibits a high reflectance and can provide a reflector that resists a decrease in reflectance caused by heating, particularly in a LED production process and a reflow soldering process. A reflector obtained by molding the resin composition is also provided. The polyamide resin composition is composed of defined amounts of a polyamide resin (A), an inorganic filler (B) and a white pigment (C) (with the proviso that the total of the components (A), (B) and (C) does not exceed 100% by weight). The components of the polyamide resin (A) are defined and the polyamide resin (A) has a terminal amino group concentration of 70 to 230 mmol/kg.Type: GrantFiled: April 11, 2006Date of Patent: April 23, 2013Assignee: Mitsui Chemicals, Inc.Inventor: Hideto Ogasawara
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Publication number: 20100076137Abstract: Disclosed is a flame-retardant polyamide composition excellent in fluidity during molding and granulation ability on a twin-screw extruder or the like. A molded article produced from the composition is excellent in mechanical properties including stiffness, heat resistance and flame retardancy during a reflow soldering process, and shows low warpage. Specifically disclosed is a flame-retardant polyamide composition comprising 20 to 80 mass % of a specific polyamide resin (A), 1 to 40 mass % of a flame retardant (B), 5 to 60 mass % of a glass fiber (C), and 0.5 to 5 mass % of an auxiliary flame retardant (D), which can be molded in an article having reduced warpage. Preferably, the glass fiber (C) has a cross section having an aspect ratio of greater than 3.Type: ApplicationFiled: November 19, 2007Publication date: March 25, 2010Applicant: MITSUI CHEMCIALS INC.Inventors: Hideto Ogasawara, Masashi Seki
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Publication number: 20090088507Abstract: To provide a polyamide resin composition for reflectors, which gives a molding having high mechanical strength and excellent heat resistance and stably having a high reflectance and can give a reflector rarely suffering lowering of reflectance caused by heating particularly in a LED production process and a reflow soldering process, and a reflector obtained by molding the resin composition.Type: ApplicationFiled: April 11, 2006Publication date: April 2, 2009Applicant: Mitsui Chemicals, Inc.Inventor: Hideto Ogasawara
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Publication number: 20070161741Abstract: A polyamide resin composition comprising a polyamide resin (A), an inorganic filler (B), and a white pigment (C) and can provide a molded product which is excellent in mechanical strength and heat resistance. The composition can also comprise a specific ultraviolet absorber (D), or both an ultraviolet absorber (D) and a hindered amine compound (E). The polyamide resin composition can impart excellent mechanical strength, heat resistance and adhesive properties to a sealing resin such as an epoxy resin of a molded product, particularly precision insert molded products, and the resin composition can provide a reflector plate that realizes a reduced drop of light reflectance.Type: ApplicationFiled: December 7, 2004Publication date: July 12, 2007Applicant: Mitsui Chemicals, Inc.Inventor: Hideto Ogasawara