Patents by Inventor Hideya Ohtani

Hideya Ohtani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and tape carrier
    Patent number: 4977441
    Abstract: According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier, the control signal lead being formed on the tape carrier.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: December 11, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Hideya Ohtani, Toshimitsu Momoi, Eiji Ooi, Shuhei Sakuraba, Masayuki Morita, Yoshiaki Wakashima
  • Semiconductor device and process for producing the same, and tape carrier used in said process
    Patent number: 4792532
    Abstract: According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier. By mounting the semiconductor pellets having the aging wiring on the tape carrier, it is enabled to apply the power voltage and to supply the control signal to each of the plurality of the semiconductor pellets, and hence the operation test can be simultaneously conducted for the semiconductor pellets mounted on the tape carrier having an arbitrary length.
    Type: Grant
    Filed: December 29, 1986
    Date of Patent: December 20, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Hideya Ohtani, Toshimitsu Momoi, Eiji Ooi, Shuhei Sakuraba, Masayuki Morita, Yoshiaki Wakashima