Patents by Inventor Hideyuki Takamori
Hideyuki Takamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7550043Abstract: A processing chamber actually performs a heating process for a substrate. The processing chamber has an upper plate, a lower plate, and an exhaust opening. The upper plate heats a resist from a front surface of the substrate. The lower plate heats the resist from a rear surface of the substrate. The exhaust opening exhausts gas from the processing chamber. The upper plate is disposed in such a manner that it can be raised and lowered in the processing chamber by an upper air cylinder that composes an upper driving mechanism. The lower plate is disposed on a floor of the processing chamber. The exhaust opening is connected to a pump through a pipe. Heating temperature and heating time of the upper plate and the lower plate are controlled by a heating control portion. A pressure in the processing chamber is controlled by a pump. The pump is controlled by a pressure controlling portion.Type: GrantFiled: December 16, 2003Date of Patent: June 23, 2009Assignee: Tokyo Electron LimitedInventors: Masatoshi Shiraishi, Masatsugu Nakama, Hideyuki Takamori
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Patent number: 6962477Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.Type: GrantFiled: November 16, 2004Date of Patent: November 8, 2005Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Hideyuki Takamori
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Publication number: 20050095115Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.Type: ApplicationFiled: November 16, 2004Publication date: May 5, 2005Inventors: Kiyohisa Tateyama, Hideyuki Takamori
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Patent number: 6837672Abstract: A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.Type: GrantFiled: October 2, 2000Date of Patent: January 4, 2005Assignee: Tokyo Electron LimitedInventors: Kiyohisa Tateyama, Hideyuki Takamori
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Publication number: 20040126713Abstract: A processing chamber actually performs a heating process for a substrate. The processing chamber has an upper plate, a lower plate, and an exhaust opening. The upper plate heats a resist from a front surface of the substrate. The lower plate heats the resist from a rear surface of the substrate. The exhaust opening exhausts gas from the processing chamber. The upper plate is disposed in such a manner that it can be raised and lowered in the processing chamber by an upper air cylinder that composes an upper driving mechanism. The lower plate is disposed on a floor of the processing chamber. The exhaust opening is connected to a pump through a pipe. Heating temperature and heating time of the upper plate and the lower plate are controlled by a heating control portion. A pressure in the processing chamber is controlled by a pump. The pump is controlled by a pressure controlling portion.Type: ApplicationFiled: December 16, 2003Publication date: July 1, 2004Inventors: Masatoshi Shiraishi, Masatsugu Nakama, Hideyuki Takamori
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Patent number: 6635113Abstract: A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.Type: GrantFiled: May 18, 1999Date of Patent: October 21, 2003Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Noriyuki Anai, Masafumi Nomura, Kiyohisa Tateyama, Tsutae Omori
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Publication number: 20020187423Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: ApplicationFiled: August 7, 2002Publication date: December 12, 2002Inventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Yoshitaka Matsuda
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Patent number: 6485782Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.Type: GrantFiled: October 30, 2001Date of Patent: November 26, 2002Assignee: Tokyo Electron LimitedInventor: Hideyuki Takamori
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Publication number: 20020152954Abstract: A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.Type: ApplicationFiled: May 18, 1999Publication date: October 24, 2002Inventors: HIDEYUKI TAKAMORI, NORIYUKI ANAI, MASAFUMI NOMURA, KIYOHISA TATEYAMA, TSUTAE OMORI
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Patent number: 6451515Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: GrantFiled: August 4, 1999Date of Patent: September 17, 2002Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Yoshitaka Matsuda
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Patent number: 6447608Abstract: A coating process comprises the steps of (a) holding a-substrate using a spin chuck surrounded by inner and outer cups, such that the substrate can rotate, (b) rotating the substrate by rotating the spin chuck, and applying a coating liquid onto the substrate, thereby forming a coating on the substrate, (c) discharging, from the inner and outer cups, that part of the coating liquid which is scattered from the substrate while the substrate is rotated, (d) exhausting the inner and outer cups through a plurality of exhaust ports formed in outer peripheral portions of the outer cup, and (e) reducing, from a peripheral region of the substrate, the mist of the coating liquid which has occurred during the step (b), before the substrate stops rotation.Type: GrantFiled: September 29, 2000Date of Patent: September 10, 2002Assignee: Tokyo Electron LimitedInventors: Mitsuhiro Sakai, Hideyuki Takamori, Masafumi Nomura
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Patent number: 6443641Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.Type: GrantFiled: June 6, 2001Date of Patent: September 3, 2002Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Mitsuhiro Sakai, Shinobu Tanaka, Yoichi Honda, Yuji Shimomura
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Publication number: 20020026894Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.Type: ApplicationFiled: October 30, 2001Publication date: March 7, 2002Inventor: Hideyuki Takamori
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Publication number: 20020025375Abstract: A method of processing a substrate for forming a coating film on a substrate comprising the steps of (a) mounting a substrate on a temperature controlling means which is capable of having a heat influence on the substrate, and controlling temperature of the substrate by the temperature controlling means, (b) controlling temperature of a coating solution to be supplied to the substrate, (c) controlling temperature of a contact member in contact with the substrate when the substrate is transported and held, (d) detecting temperature of an atmosphere of a process space for applying the coating solution to the substrate, (e) setting a desired temperature on the basis of temperature/film-thickness data previously obtained by forming the coating film on the substrate, (f) controlling a temperature controlling operation of at least step (c) on the basis of the desired temperature set in the step (e) and the temperature detected in the step (d), and (g) applying the coating solution to the substrate.Type: ApplicationFiled: August 29, 2001Publication date: February 28, 2002Inventors: Hideyuki Takamori, Masafumi Nomura, Tsutae Omori
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Publication number: 20010049070Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: ApplicationFiled: August 4, 1999Publication date: December 6, 2001Inventors: HIDEYUKI TAKAMORI, KIYOHISA TATEYAMA, KENGO MIZOSAKI, NORIYUKI ANAI, YOSHITAKA MATSUDA
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Patent number: 6319317Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.Type: GrantFiled: April 18, 2000Date of Patent: November 20, 2001Assignee: Tokyo Electron LimitedInventor: Hideyuki Takamori
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Patent number: 6306455Abstract: A method of processing a substrate for forming a coating film on a substrate comprising the steps of (a) mounting a substrate on a temperature controlling means which is capable of having a heat influence on the substrate, and controlling temperature of the substrate by the temperature controlling means, (b) controlling temperature of a coating solution to be supplied to the substrate, (c) controlling temperature of a contact member in contact with the substrate when the substrate is transported and held, (d) detecting temperature of an atmosphere of a process space for applying the coating solution to the substrate, (e) setting a desired temperature on the basis of temperature/film-thickness data previously obtained by forming the coating film on the substrate, (f) controlling a temperature controlling operation of at least step (c) on the basis of the desired temperature set in the step (e) and the temperature detected in the step (d), and (g) applying the coating solution to the substrate.Type: GrantFiled: August 27, 1998Date of Patent: October 23, 2001Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Masafumi Nomura, Tsutae Omori
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Publication number: 20010031147Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.Type: ApplicationFiled: June 6, 2001Publication date: October 18, 2001Inventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Mitsuhiro Sakai, Shinobu Tanaka, Yoichi Honda, Yuji Shimomura
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Publication number: 20010026691Abstract: Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.Type: ApplicationFiled: June 6, 2001Publication date: October 4, 2001Inventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Mitsuhiro Sakai, Shinobu Tanaka, Yoichi Honda, Yuji Shimomura
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Patent number: 6264748Abstract: A substrate processing apparatus comprises a processing section having a plurality of process units for applying a series of processes including a resist coating to a processing substrate, a developing process to an exposed substrate, and an etching to the developed processing substrate, a main transferring mechanism, moving along a transferring path, for transferring/receiving the processing substrate to/from the respective process units, and a loading/unloading portion having a transferring/receiving mechanism for transferring/receiving the processing substrate to/from the main transferring apparatus, wherein these process units, the transferring path, and the loading/unloading portion are integrally provided.Type: GrantFiled: August 6, 1998Date of Patent: July 24, 2001Assignee: Tokyo Electron LimitedInventors: Yasuyuki Kuriki, Hideyuki Takamori, Kozo Hara