Abstract: The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light.

Abstract: The present technology relates to an electronic circuit board, a base member, electronic equipment, an electronic equipment manufacturing method and an electronic circuit board manufacturing method that make it possible to mount an electronic circuit board easily on a curved surface, for example. An electronic circuit board has a deformable wiring board having a plurality of areas that is long in one direction and is formed to be partially continuous with each other, and the plurality of areas of the wiring board is provided with deformable plate-like plate members that are more rigid than the wiring board. For example, the present technology can be applied to an electronic circuit board on which various devices are mounted.

Abstract: Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. A semiconductor device according to one aspect of the present disclosure includes: a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface; wirings provided on the first and second surfaces; a first insulating film that covers the first surface; a second insulating film that covers the second surface; and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first and second insulating films.

Abstract: A force sensor module includes multiple force sensors disposed in series. The force sensors each include multiple sensor sections, a support substrate, and an organic member. The multiple sensor sections have respective force detection directions different from each other. The support substrate is separately provided for each of the force sensors and supports the multiple sensor sections. The organic member is provided in common to the force sensors. The organic member fixes the multiple force sensors in series and has a groove at a location corresponding to a gap between two support substrates adjacent to each other. The organic member is flexible.

Abstract: An optical sensor according to an embodiment of the present disclosure includes a light emitting substrate and a circuit board. The light emitting substrate includes a light emitting device. The circuit board is provided at a position opposing the light emitting device. The circuit board includes a light transmitting section and one or multiple light receiving devices. The light transmitting section transmits light of the light emitting device. The one or multiple light receiving devices receive light reflected by a reflective layer of the light of the light emitting device exiting through the light transmitting section. For example, the one or multiple light receiving devices are formed on a first major surface of the circuit board. For example, the light emitting substrate is disposed at a position opposing a second major surface, of the circuit board, on an opposite side to the first major surface, and is stacked on the circuit board with a first bump interposed therebetween.

Abstract: Provided is a protection structure that appropriately protects a side surface of a glass substrate in a semiconductor module. A semiconductor module is provided with a glass substrate. The glass substrate is provided with a plurality of straight line portions and a corner portion interposed between the straight line portions on a side surface thereof. A protective material is formed on at least a part of the side surface of the glass substrate. The corner portion of the glass substrate is located on an inner side of a straight line connecting ridges of protective materials formed on the straight line portions (a center side of the glass substrate). Therefore, the corner portion is protected against an impact on the side surface of the glass substrate.

Abstract: The present disclosure relates to a ranging device and a ranging module that allow a light emitting element and a light receiving element to be integrated with a simple structure. A light emitting substrate having a light emitting element is connected to a circuit substrate through first bumps, and a light receiving substrate having a single light emitting element or light emitting elements that are two-dimensionally disposed is connected to the circuit substrate through second bumps. The optical axis of a lens, the optical axis of the light emitting element, and the center axis of the light receiving element are disposed on substantially the same axis. The present technique can be applied to a ranging device that carries out ranging, and so forth.

Abstract: Disclosed herein is a display panel including a mounting substrate in which one or more light-emitting devices each including one or more light-emitting elements are mounted on a circuit substrate; and a transparent substrate disposed to face the light-emitting device side of the mounting substrate, wherein the transparent substrate has a transparent base material and a resin layer formed on the mounting substrate side of the transparent base material, and the resin layer is in contact with the light-emitting device and has, formed on an upper surface or a side surface of the light-emitting device, an inclined part which spreads from the light-emitting device side toward the transparent base material side.

Abstract: Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern.

Abstract: Disclosed herein is a method of transferring elements, including the steps of: holding a plurality of elements made at a first pitch on an element formation substrate on a temporary holding substrate in a state; forming a plurality of element mounting bases and obtaining an element disposition substrate; disposing an uncured adhesive agent layer on each of the bearing surfaces of the element mounting bases; making the temporary holding substrate and the element disposition substrate close to each other and causing some of the plurality of elements to come in contact with the uncured adhesive agent layer; curing the uncured adhesive agent layer, fixing the elements contacting the adhesive agent layer to the element mounting bases; and separating the temporary holding substrate and the element disposition substrate from each other with the elements contacting the adhesive agent layer being left on the respective element mounting bases.

Abstract: A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member.

Abstract: Disclosed herein is a display panel including a mounting substrate in which one or more light-emitting devices each including one or more light-emitting elements are mounted on a circuit substrate; and a transparent substrate disposed to face the light-emitting device side of the mounting substrate, wherein the transparent substrate has a transparent base material and a resin layer formed on the mounting substrate side of the transparent base material, and the resin layer is in contact with the light-emitting device and has, formed on an upper surface or a side surface of the light-emitting device, an inclined part which spreads from the light-emitting device side toward the transparent base material side.

Abstract: Disclosed herein is a method of transferring elements, including the steps of: holding a plurality of elements made at a first pitch on an element formation substrate on a temporarily holding substrate in a lamp state; forming a plurality of element mounting bases and obtaining an element disposition substrate; disposing an uncured adhesive agent layer on each of the bearing surfaces of the element mounting bases; making the temporarily holding substrate and the element disposition substrate close to each other and causing partial elements of the plurality of elements to come in contact with the uncured adhesive agent layer; curing the uncured adhesive agent layer, fixing the partial elements contacting the adhesive agent layer to the element mounting bases; and separating the temporarily holding substrate and the element disposition substrate from each other with the partial elements contacting the adhesive agent layer being left on the respective element mounting bases.

Abstract: Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern.

Abstract: An optical-electrical transmission connector having resistance to optical axis misalignment, having small loss, easily increasing the number of buses, and capable of being formed of a commonly-used material is provided. In a male connector, one collimating lens facing the other collimating lens when connecting the male connector to a female connector is arranged, and a light guide is arranged corresponding to the focal point of the one collimating lens. A positioning section is arranged corresponding to surroundings of the one collimating lens, and the positioning section has one inclined surface coming into contact with the other inclined surface when connecting the male connector to the female connector.

Abstract: A photoelectric conversion element array having a plurality of photoelectric conversion elements (emitting optics 4, receiving optics 5) arranged in an array, and the photoelectric conversion elements 4, 5 are arranged alternately at different positions so that every second one is aligned on the same line in the direction of array. A mounted structure of photoelectric conversion element array, having the emitting optics array and the receiving optics array in the photoelectric conversion element array of this invention, arranged on an interposer substrate 9 so as to oppose therewith, and these arrays are mounted on the interposer substrate 9 through the external connection terminals 7. An optical information processing apparatus 1 having the photoelectric conversion element array of the present invention, and an optical wave guide 3 opposed to the respective optics of the photoelectric conversion element arrays.

Abstract: An optical-electrical transmission connector having resistance to optical axis misalignment, having small loss, easily increasing the number of buses, and capable of being formed of a commonly-used material is provided. In a male connector, one collimating lens facing the other collimating lens when connecting the male connector to a female connector is arranged, and a light guide is arranged corresponding to the focal point of the one collimating lens. A positioning section is arranged corresponding to surroundings of the one collimating lens, and the positioning section has one inclined surface coming into contact with the other inclined surface when connecting the male connector to the female connector.

Abstract: Disclosed herein is an optical waveguide device including a cladding having first and second surfaces opposite to each other, a core laminated to the first surface of the cladding for guiding light in a longitudinal direction thereof, the core having a pair of light incident and emergent portions at the opposite ends, and a pair of light collimating or focusing members bonded to the second surface of the cladding at the opposite ends corresponding to the light incident and emergent portions of the core.

Abstract: A photoelectric transducer has an optical waveguide and a photoelectric transducer element array of photoelectric transducer elements optically coupled to the optical waveguide. The photoelectric transducer element array has a common conductive layer, and the photoelectric transducer elements are mounted on the common conductive layer in alignment with entrance or exit ends of the optical waveguide. The photoelectric transducer elements having respective first poles, and the photoelectric transducer element array has a second pole disposed in opposite relation to the first poles and connected as a reference potential setting electrode through the common conductive layer to at least two of the photoelectric transducer elements.

Abstract: A photoelectric conversion element array having a plurality of photoelectric conversion elements (emitting optics 4, receiving optics 5) arranged in an array, and the photoelectric conversion elements 4, 5 are arranged alternately at different positions so that every second one is aligned on the same line in the direction of array. A mounted structure of photoelectric conversion element array, having the emitting optics array and the receiving optics array in the photoelectric conversion element array of this invention, arranged on an interposer substrate 9 so as to oppose therewith, and these arrays are mounted on the interposer substrate 9 through the external connection terminals 7. An optical information processing apparatus 1 having the photoelectric conversion element array of the present invention, and an optical wave guide 3 opposed to the respective optics of the photoelectric conversion element arrays.