Patents by Inventor Hikari Murai

Hikari Murai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200277443
    Abstract: The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.
    Type: Application
    Filed: May 14, 2020
    Publication date: September 3, 2020
    Inventors: Tomohiko KOTAKE, Masato MIYATAKE, Hikari MURAI
  • Patent number: 10738165
    Abstract: The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: August 11, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Masato Miyatake, Hikari Murai
  • Publication number: 20200148543
    Abstract: A method for producing an aerogel composite includes drying a wet gel generated from a sol comprising a silica particles, and at least one selected from the group consisting of a silicon compound having a hydrolyzable functional group in a molecule, and a hydrolysis product of the silicon compound.
    Type: Application
    Filed: January 7, 2020
    Publication date: May 14, 2020
    Inventors: Tomohiko Kotake, Masato Miyatake, Hikari Murai
  • Publication number: 20200130331
    Abstract: An aerogel laminate roll is prepared by winding an aerogel laminate around a roll core, the aerogel laminate comprising a support and an aerogel layer disposed on the support and having a thickness of 200 ?m or less.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Inventors: Tomohiko KOTAKE, Masato MIYATAKE, Chisato KIKKAWA, Hiroyuki IZUMI, Hikari MURAI
  • Patent number: 10590001
    Abstract: The invention relates to an aerogel composite comprising an aerogel component and a silica particle, and being superior in thermal insulation properties and flexibility.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: March 17, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Masato Miyatake, Hikari Murai
  • Publication number: 20200071464
    Abstract: Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition.
    Type: Application
    Filed: November 7, 2019
    Publication date: March 5, 2020
    Inventors: Takao TANIGAWA, Yasuyuki MIZUNO, Tomio FUKUDA, Yuki NAGAI, Hikari MURAI
  • Patent number: 10563016
    Abstract: The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: February 18, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Masato Miyatake, Hikari Murai
  • Patent number: 10556405
    Abstract: The present invention relates to a production method for an aerogel laminate including a support, and an aerogel layer disposed on the support and having a thickness of 200 ?m or less, the method comprising a step of washing a wet gel laminate including the support and a wet gel layer disposed on the support by a roll-to-roll scheme.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: February 11, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Masato Miyatake, Chisato Kikkawa, Hiroyuki Izumi, Hikari Murai
  • Patent number: 10544305
    Abstract: Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: January 28, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Kasahara, Tetsurou Irino, Hikari Murai
  • Patent number: 10519279
    Abstract: Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: December 31, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Takao Tanigawa, Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai, Hikari Murai
  • Patent number: 10465089
    Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: November 5, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai
  • Patent number: 10414943
    Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: September 17, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi
  • Publication number: 20190263089
    Abstract: The present invention relates to an aerogel laminate having a structure in which an aerogel layer and a support having a heat ray reflective function or a heat ray absorbing function are laminated.
    Type: Application
    Filed: May 14, 2019
    Publication date: August 29, 2019
    Inventors: Tomohiko KOTAKE, Masato MIYATAKE, Chisato KIKKAWA, Hiroyuki IZUMI, Hikari MURAI
  • Publication number: 20190230790
    Abstract: The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 ?m or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.
    Type: Application
    Filed: August 15, 2016
    Publication date: July 25, 2019
    Inventors: Aya KASAHARA, Yasuyuki MIZUNO, Hikari MURAI
  • Patent number: 10323126
    Abstract: A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein R3 and R4 independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: June 18, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shunsuke Nagai, Shintaro Hashimoto, Shinichiro Abe, Masato Miyatake, Shin Takanezawa, Hikari Murai
  • Publication number: 20190023849
    Abstract: The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.
    Type: Application
    Filed: September 25, 2018
    Publication date: January 24, 2019
    Inventors: Tomohiko KOTAKE, Masato MIYATAKE, Hikari MURAI
  • Publication number: 20190002728
    Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 3, 2019
    Inventors: Kouji MORITA, Hikari MURAI, Shin TAKANEZAWA, Yasuo INOUE, Kazunaga SAKAI
  • Publication number: 20180327593
    Abstract: Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
    Type: Application
    Filed: December 3, 2015
    Publication date: November 15, 2018
    Inventors: Aya KASAHARA, Tetsurou IRINO, Hikari MURAI
  • Patent number: 10119047
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: November 6, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai, Tetsurou Irino
  • Publication number: 20180171135
    Abstract: Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion.
    Type: Application
    Filed: February 10, 2016
    Publication date: June 21, 2018
    Inventors: Aya KASAHARA, Yasuyuki MIZUNO, Hikari MURAI