Abstract: As a composite laser rod capable of satisfying the positional stability and output stability of a laser beam, a laser rod in which a laser active element is doped is intimately inserted into a hollow portion of a non-doped ceramic pipe that has a crystal structure the same as the laser rod followed by baking so as to remove a gap and strain at an interface between the laser rod and the ceramic pipe after the baking further followed by polishing a surface of the ceramic pipe to form a ceramic skin layer, and thereby a composite laser rod is formed. In the composite laser rod, an influence due to fluctuation in the cooling capacity of cooling water or a heat sink is averaged by a non-doped skin layer, temperature fluctuation of the laser rod is suppressed, and an influence of vibration from the cooling water or a cooling fan can be suppressed.

Abstract: Photodetectors 2a capable of converting optical signals that are received as input from the outside to electrical signals and supplying these electrical signals as output to output ports are mounted on two or more input ports of substrate 1 on which a semiconductor integrated circuit can be mounted; and moreover, the heights of these two or more photodetectors 2a are uniformly aligned, and the electrical signal input ports of the semiconductor integrated circuit that is mounted can be connected to the output ports of the above-described substrate 1.

Abstract: Light-emitting device array 2 is mounted on LSI 1, following which necessary light-emitting devices 2a among two or more light-emitting devices 2 that make up mounted light-emitting device array 2 are allowed to remain and unnecessary light-emitting devices 2a are removed in order to mount light-emitting devices on a plurality of output ports that are randomly arranged on LSI 1.

Abstract: Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening is formed at the position of the pit. Then, an electric field is applied to the high-concentration impurity Si template and Au is buried in the opening in the plated resist to form a Au-plated buried layer. An electrode pad is formed on a semiconductor chip. With the plated resist separated from the high-concentration impurity Si template, the electrode pad of the semiconductor chip is aligned with the Au-plated buried layer and is bonded by thermo-compression bonding. The Au-plated buried layer is transferred to the electrode pad to form an Au bump on the semiconductor chip.

Abstract: As a composite laser rod capable of satisfying the positional stability and output stability of a laser beam, a laser rod in which a laser active element is doped is intimately inserted into a hollow portion of a non-doped ceramic pipe that has a crystal structure the same as the laser rod followed by baking so as to remove a gap and strain at an interface between the laser rod and the ceramic pipe after the baking further followed by polishing a surface of the ceramic pipe to form a ceramic skin layer, and thereby a composite laser rod is formed. In the composite laser rod, an influence due to fluctuation in the cooling capacity of cooling water or a heat sink is averaged by a non-doped skin layer, temperature fluctuation of the laser rod is suppressed, and an influence of vibration from the cooling water or a cooling fan can be suppressed.

Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.

Abstract: A pair of opening portions are provided as an inlet port of refrigerant and an outlet port thereof, and refrigerant flow channels are formed left-right symmetrically in its plan view from one opening portion to the other opening portion. At the area adjusted to the area which is thermally connected to the heating element in the refrigerant flow channels, projections whose cross section thereof become smaller and smaller upward from the bottom surface of the refrigerant flow channels or downward from the upper surface, that is, widens toward the end, are formed. By joining the heat radiating plate having the projections formed therein to the other heat radiating plate, which is plate-shaped, together, a heat sink is assembled. Therefore, the heat sinks are excellent in terms of thermal conductivity and reliability, are produced at a low cost, and a laser module employing the same, a laser module apparatus, and a laser processing apparatus are obtainable.

Abstract: There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.

Abstract: The present invention relates to a device and a method for monitoring each of the propagated light beams that are propagated in each waveguide of an arrayed waveguide device and a method of fabricating the device. In the prior art, problems were encountered in deriving monitor light and photodetecting the derived monitor light within the waveguide substrate. In the present invention, waveguide directional couplers are formed in the spaces between the arrayed waveguides to derive a portion of the propagated light as monitor light. Cavities are provided at the ends of auxiliary waveguides connected to the directional couplers, and monitor light is guideded into these cavities. The monitor light, after being reflected upward or downward of the substrate by optical path conversion elements installed inside the cavities, is photodetected by photodiodes. The optical path conversion elements can be fabricated by inserting metal bumps into the cavities and then forming the bumps with a mold.

Abstract: An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Abstract: After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

Abstract: An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.

Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.

Abstract: An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror section is optically connected to one of a plurality of second optical paths.

Abstract: Disclosed is a wired board with a bump electrode whose production efficiency is improved. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening is formed in portion for the pit. Then, an electric field is applied to the high-concentration impurity Si template and Au is buried in the opening in the plated resist to form an Au-plated buried layer. An electrode pad is formed on a semiconductor chip. With the plated resist separated from the high-concentration impurity Si template, the electrode pad of the semiconductor chip is aligned with the Au-plated buried layer and is bonded by thermo-compression bonding. The Au-plated buried layer is transferred to the electrode pad to form Au bump on the semiconductor chip.

Abstract: The present invention relates to a device and a method for monitoring each of the propagated light beams that are propagated in each waveguide of an arrayed waveguide device and a method of fabricating the device. In the prior art, problems were encountered in deriving monitor light and photodetecting the derived monitor light within the waveguide substrate. In the present invention, waveguide directional couplers are formed in the spaces between the arrayed waveguides to derive a portion of the propagated light as monitor light. Cavities are provided at the ends of auxiliary waveguides connected to the directional couplers, and monitor light is guideded into these cavities. The monitor light, after being reflected upward or downward of the substrate by optical path conversion elements installed inside the cavities, is photodetected by photodiodes. The optical path conversion elements can be fabricated by inserting metal bumps into the cavities and then forming the bumps with a mold.

Abstract: As a composite laser rod capable of satisfying the positional stability and output stability of a laser beam, a laser rod in which a laser active element is doped is intimately inserted into a hollow portion of a non-doped ceramic pipe that has a crystal structure the same as the laser rod followed by baking so as to remove a gap and strain at an interface between the laser rod and the ceramic pipe after the baking further followed by polishing a surface of the ceramic pipe to form a ceramic skin layer, and thereby a composite laser rod is formed. In the composite laser rod, an influence due to fluctuation in the cooling capacity of cooling water or a heat sink is averaged by a non-doped skin layer, temperature fluctuation of the laser rod is suppressed, and an influence of vibration from the cooling water or a cooling fan can be suppressed.

Abstract: An electro-acoustic transducer is attached to a block of optical material, and forms an acoustic standing wave in the block; the acoustic standing wave periodically changes the refractive index of the optical material, and forms high refractive index portions alternated with low refractive index portions; and the high refractive index portions serve as optical wave guides, and the electro-acoustic transducer easily produces the optical wave guide in the block.

Abstract: An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.

Abstract: After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.