Patents by Inventor Hilton T. Toy
Hilton T. Toy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11887908Abstract: An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.Type: GrantFiled: December 21, 2021Date of Patent: January 30, 2024Assignee: International Business Machines CorporationInventors: Kamal K. Sikka, Katsuyuki Sakuma, Hilton T. Toy, Shidong Li, Ravi K Bonam
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Publication number: 20230197552Abstract: An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.Type: ApplicationFiled: December 21, 2021Publication date: June 22, 2023Inventors: Kamal K. Sikka, Katsuyuki Sakuma, Hilton T. Toy, Shidong Li, Ravi K. Bonam
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Patent number: 11545444Abstract: A lidded chip package apparatus has reduced latent thermal stress in an under-chip high-CTE layer of the chip package because the lid of the package was adhered to a substrate of the package and cured during a same thermal excursion as when underfill was dispensed and cured under a chip of the package, and the chip package was cooled from the combined underfill and lidding process to room temperature with the lid adhered to the chip and the substrate, thereby reducing latent thermal stress in the under-chip high-CTE layer of the chip package.Type: GrantFiled: December 31, 2020Date of Patent: January 3, 2023Assignee: International Business Machines CorporationInventors: Mukta Ghate Farooq, Katsuyuki Sakuma, Krishna R. Tunga, Hilton T. Toy
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Publication number: 20220208693Abstract: A lidded chip package apparatus has reduced latent thermal stress in an under-chip high-CTE layer of the chip package because the lid of the package was adhered to a substrate of the package and cured during a same thermal excursion as when underfill was dispensed and cured under a chip of the package, and the chip package was cooled from the combined underfill and lidding process to room temperature with the lid adhered to the chip and the substrate, thereby reducing latent thermal stress in the under-chip high-CTE layer of the chip package.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Inventors: Mukta Ghate Farooq, Katsuyuki Sakuma, Krishna R. Tunga, Hilton T. Toy
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Patent number: 11302651Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.Type: GrantFiled: September 19, 2019Date of Patent: April 12, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti
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Patent number: 11146003Abstract: Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.Type: GrantFiled: August 22, 2018Date of Patent: October 12, 2021Assignee: International Business Machines CorporationInventors: Alan F. Benner, Benjamin Vito Fasano, Paul Francis Fortier, Hilton T. Toy
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Patent number: 10978314Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.Type: GrantFiled: October 3, 2019Date of Patent: April 13, 2021Assignee: International Business Machines CorporationInventors: Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 10905029Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: October 29, 2019Date of Patent: January 26, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Patent number: 10892170Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader.Type: GrantFiled: June 1, 2018Date of Patent: January 12, 2021Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 10832987Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.Type: GrantFiled: March 24, 2018Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss
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Patent number: 10757833Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: June 21, 2019Date of Patent: August 25, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Publication number: 20200135495Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.Type: ApplicationFiled: October 3, 2019Publication date: April 30, 2020Inventors: Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 10636746Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.Type: GrantFiled: February 26, 2018Date of Patent: April 28, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti
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Patent number: 10593564Abstract: An electronic package includes a carrier and a semiconductor chip. In a first aspect, a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.Type: GrantFiled: April 12, 2018Date of Patent: March 17, 2020Assignee: International Business Machines CorporationInventors: Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20200068744Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
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Patent number: 10566215Abstract: A method includes electrically connecting an IC chip module to a motherboard and thermally contacting a heat sink to the IC chip module. The IC chip module includes a carrier comprising a top surface and a bottom surface configured to be electrically connected to the motherboard. The IC chip module includes a stiffening frame attached to the carrier top surface. The stiffening frame includes a base portion that has a central opening and a plurality of opposing sidewalls. The IC chip module further includes a semiconductor chip electrically connected to the carrier top surface and concentrically arranged within the central opening. The IC chip module further includes a first directional heat spreader thermally contacting the semiconductor chip. The first directional heat spreader includes a directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards first opposing sidewalls.Type: GrantFiled: November 3, 2017Date of Patent: February 18, 2020Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 10541156Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.Type: GrantFiled: October 31, 2018Date of Patent: January 21, 2020Assignee: International Business Machines CorporationInventors: Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 10542636Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: July 30, 2018Date of Patent: January 21, 2020Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
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Publication number: 20200013732Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.Type: ApplicationFiled: September 19, 2019Publication date: January 9, 2020Inventors: Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti
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Publication number: 20190335617Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: June 21, 2019Publication date: October 31, 2019Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ