Patents by Inventor Hiroaki Koubu

Hiroaki Koubu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250041936
    Abstract: Provided are a silver powder that can reduce line resistance and a method of producing the same. The silver powder has a diameter at a cumulative value of 50% of 3 ?m or more and a ratio of particles of 10 ?m or larger of 10% or less. The silver powder includes flake-like particles having a major axis of 6 ?m or more and irregularly shaped particles having a major axis of less than 6 ?m, an average aspect ratio that is a ratio of average major axis relative to average thickness of the flake-like particles is 8 or more, and a shape factor that is a ratio of area of a circle having average maximum length of the irregularly shaped particles as a diameter relative to average particle area of the irregularly shaped particles is 1.7 to 1.9. Ignition loss is 0.1 wt % to 0.4 wt %.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 6, 2025
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Taro TORIGOE, Hiroaki KOUBU, Fumiya ABE, Minami KANASUGI
  • Patent number: 10376962
    Abstract: After preparing a silver-coated copper powder wherein the surface of a copper powder having an average particle diameter of 0.1 to 100 ?m is coated with silver, the silver-coated copper powder is sprayed into the tail flame region of a thermal plasma to cause silver on the surface of the copper powder to diffuse in the grain boundaries of copper on the inside of the copper powder, and thereafter, the surface of the copper powder is coated with silver to produce a metal composite powder wherein the percentage of the area occupied by silver on a cross section of the metal composite powder is 3 to 20% and wherein the surface thereof is coated with silver.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: August 13, 2019
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Hiroaki Koubu, Noriaki Nogami
  • Publication number: 20170113277
    Abstract: After preparing a silver-coated copper powder wherein the surface of a copper powder having an average particle diameter of 0.1 to 100 ?m is coated with silver, the silver-coated copper powder is sprayed into the tail flame region of a thermal plasma to cause silver on the surface of the copper powder to diffuse in the grain boundaries of copper on the inside of the copper powder, and thereafter, the surface of the copper powder is coated with silver to produce a metal composite powder wherein the percentage of the area occupied by silver on a cross section of the metal composite powder is 3 to 20% and wherein the surface thereof is coated with silver.
    Type: Application
    Filed: October 24, 2016
    Publication date: April 27, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Hiroaki Koubu, Noriaki Nogami
  • Publication number: 20170113278
    Abstract: There is prepared a silver-coated copper powder wherein the surface of a copper powder having an average particle diameter of 0.1 to 100 ?m is coated with 5% by weight or more of silver, and the silver-coated copper powder is sprayed into the tail flame region of a thermal plasma to cause silver on the surface of the copper powder to diffuse in the grain boundaries of copper on the inside of the copper powder to produce a metal composite powder wherein the percentage of the area occupied by silver on a cross section of the metal composite powder is 3 to 20%.
    Type: Application
    Filed: October 24, 2016
    Publication date: April 27, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Hiroaki Koubu, Noriaki Nogami