Patents by Inventor Hiroaki Kusa
Hiroaki Kusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10166647Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: GrantFiled: November 2, 2016Date of Patent: January 1, 2019Assignee: EBARA CORPORATIONInventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
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Patent number: 10137552Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.Type: GrantFiled: April 12, 2017Date of Patent: November 27, 2018Assignee: EBARA CORPORATIONInventors: Kazuaki Maeda, Tamami Takahashi, Masaya Seki, Hiroaki Kusa
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Publication number: 20170216989Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.Type: ApplicationFiled: April 12, 2017Publication date: August 3, 2017Inventors: Kazuaki MAEDA, Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA
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Patent number: 9649739Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.Type: GrantFiled: August 18, 2015Date of Patent: May 16, 2017Assignee: EBARA CORPORATIONInventors: Kazuaki Maeda, Tamami Takahashi, Masaya Seki, Hiroaki Kusa
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Publication number: 20170072528Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: ApplicationFiled: November 2, 2016Publication date: March 16, 2017Inventors: Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA, Kenji YAMAGUCHI, Masayuki NAKANISHI
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Patent number: 9517544Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: GrantFiled: December 19, 2014Date of Patent: December 13, 2016Assignee: EBARA CORPORATIONInventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
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Publication number: 20150352682Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.Type: ApplicationFiled: August 18, 2015Publication date: December 10, 2015Inventors: Kazuaki MAEDA, Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA
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Patent number: 9138854Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.Type: GrantFiled: March 5, 2009Date of Patent: September 22, 2015Assignee: EBARA CORPORATIONInventors: Kazuaki Maeda, Tamami Takahashi, Masaya Seki, Hiroaki Kusa
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Publication number: 20150104620Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: ApplicationFiled: December 19, 2014Publication date: April 16, 2015Inventors: Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA, Kenji YAMAGUCHI, Masayuki NAKANISHI
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Patent number: 8986069Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: GrantFiled: April 30, 2012Date of Patent: March 24, 2015Assignee: Ebara CorporationInventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
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Patent number: 8771038Abstract: A polishing apparatus includes a stage configured to hold a substrate, a stage-rotating mechanism configured to rotate the stage, and a polishing head configured to polish a periphery of the substrate held by the stage. The polishing apparatus also includes a controller configured to control operations of the stage, the stage-rotating mechanism, and the polishing head, an image-capturing device configured to capture an image of the periphery of the substrate through at least one terminal imaging element arranged so as to face the periphery of the substrate, an image processor configured to process the image captured by the image-capturing device, and a liquid ejector configured to eject a light-transmissive liquid toward the periphery of the substrate to fill a space between the periphery of the substrate and the terminal imaging element with the liquid.Type: GrantFiled: June 24, 2008Date of Patent: July 8, 2014Assignee: Ebara CorporationInventors: Toshifumi Kimba, Hiroaki Kusa, Masaki Fujii
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Patent number: 8506362Abstract: A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.Type: GrantFiled: July 8, 2008Date of Patent: August 13, 2013Assignees: Kabushiki Kaisha Toshiba, Ebara CorporationInventors: Dai Fukushima, Atsushi Shigeta, Tamami Takahashi, Kenya Ito, Masaya Seki, Hiroaki Kusa
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Patent number: 8506363Abstract: A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.Type: GrantFiled: December 23, 2009Date of Patent: August 13, 2013Assignee: Ebara CorporationInventors: Tamami Takahashi, Hiroaki Kusa, Masaya Seki
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Patent number: 8414355Abstract: A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished by the polishing unit; and an image processing section configured to inspect a polished state of the substrate based on the image taken by the imaging module. The imaging module is configured to take the image of the periphery of the substrate when the polishing unit is not polishing the periphery of the substrate.Type: GrantFiled: July 23, 2009Date of Patent: April 9, 2013Assignee: Ebara CorporationInventors: Toshifumi Kimba, Hiroaki Kusa
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Publication number: 20120208437Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: ApplicationFiled: April 30, 2012Publication date: August 16, 2012Inventors: Tamami TAKAHASHI, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
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Patent number: 8187055Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.Type: GrantFiled: November 24, 2008Date of Patent: May 29, 2012Assignee: Ebara CorporationInventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
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Patent number: 8047896Abstract: The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44).Type: GrantFiled: October 2, 2007Date of Patent: November 1, 2011Assignee: Ebara CorporationInventors: Tamami Takahashi, Kenya Ito, Masaya Seki, Hiroaki Kusa
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Patent number: 7976361Abstract: A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.Type: GrantFiled: June 16, 2008Date of Patent: July 12, 2011Assignee: Ebara CorporationInventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenya Ito
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Publication number: 20110034106Abstract: A polishing apparatus is disclosed. The apparatus includes a stage (20) configured to hold a substrate W, a stage-rotating mechanism (40) configured to rotate the stage, a polishing head (42) configured to polish a periphery of the substrate held by the stage, a controller (70) configured to control operations of the stage (20), the stage-rotating mechanism (40), and the polishing head (42), an image-capturing device (61) configured to capture an image of the periphery of the substrate through at least one terminal imaging element (60) arranged so as to face the periphery of the substrate, an image processor (62) configured to process the image captured by the image-capturing device, and a liquid ejector (51) configured to eject a light-transmissive liquid toward the periphery of the substrate to fill a space between the periphery of the substrate and the terminal imaging element with the liquid.Type: ApplicationFiled: June 24, 2008Publication date: February 10, 2011Inventors: Toshifumi Kimba, Hiroaki Kusa, Masaki Fujii
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Publication number: 20110003540Abstract: A polishing apparatus according to the present invention includes a polishing tape (41) having a polishing surface, a substrate holder configured to hold and rotate a substrate (W), a press pad (50) configured to press the polishing tape against a bevel portion of the substrate held by the substrate holder, and a polishing-tape feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a pad body (53), a plate-shaped pressing section having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape and having a rear surface (51b) opposite to the pressing surface, and a plurality of coupling sections (52) coupling the pressing section to the pad body. A space (S) is formed between the rear surface of the pressing section and the pad body.Type: ApplicationFiled: July 8, 2008Publication date: January 6, 2011Inventors: Tamami Takahashi, Kenya Ito, Hiroaki Kusa, Masaya Seki