Patents by Inventor Hiroaki Matsubara

Hiroaki Matsubara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11332687
    Abstract: The present invention provides a compound represented by formula (1) (in formula (1), R1 and R2 each independently represent a group represented by formula (2) or NHR0 (where R1 and R2 are not simultaneously NHR0), R0 represents any one of hydrogen, an alkyl group having 1-20 carbon atoms, an alkenyl group having 2-30 carbon atoms, an aryl group having 6-30 carbon atoms, an alkylaryl group having 7-30 carbon atoms, and an arylalkyl group having 7-30 carbon atoms, each R3 independently represents hydrogen or a hydrocarbon group having 1-30 carbon atoms, l represents an integer of 0-4, m represents an integer of 1-4 (where m is an integer of 2-4 in the case where R1 and R2 are a group represented by formula (2)), and each n independently represents an integer of 0-4, and, in formula (2), R4 represents a hydrocarbon group having 6-24 carbon atoms, and X1 and X2 each independently represent an oxygen atom or a sulfur atom).
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: May 17, 2022
    Assignee: Idemitsu Kosan Co..Ltd.
    Inventors: Kazushige Matsubara, Hiroaki Koshima, Toshiaki Iwai, Hideki Kamano
  • Publication number: 20220102252
    Abstract: There is provided a semiconductor device including: a conductive support including a first die pad and a second die pad having a potential different from a potential of the first die pad; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad; and a sealing resin that covers the first semiconductor element, the second semiconductor element, and at least a portion of the conductive support.
    Type: Application
    Filed: September 7, 2021
    Publication date: March 31, 2022
    Inventors: Yoshizo OSUMI, Hiroaki MATSUBARA, Tomohira KIKUCHI
  • Publication number: 20220077035
    Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a top surface, a bottom surface, and first to third side surfaces. The first terminals include a first edge terminal located closest to the third side surface. The second terminals include a second edge terminal located closest to the third side surface. A first creepage distance, which is a shortest distance from the first edge terminal to the second edge terminal along the first side surface, the third side surface, and the second side surface, is shorter than a second creepage distance, which is a shortest distance from the first edge terminal to the second edge terminal along the first side surface, the bottom surface, and the second side surface.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventor: Hiroaki MATSUBARA
  • Publication number: 20220077082
    Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventors: Yoshizo OSUMI, Hiroaki MATSUBARA, Tomohira KIKUCHI
  • Publication number: 20220077037
    Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, and a second semiconductor element. The conductive support member includes a first die pad and a second die pad separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. The first die pad has a first main surface mounting the first semiconductor element, and a first back surface opposing the first main surface. The second die pad has a second main surface mounting the second semiconductor element, and a second back surface opposing the second main surface. When viewed along a second direction, a distance in the first direction between the first back surface and the second back surface is larger than a distance in the first direction between the first main surface and the second main surface.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventors: Yoshizo OSUMI, Hiroaki MATSUBARA, Tomohira KIKUCHI
  • Publication number: 20220077034
    Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a first side surface located on one side of a first direction, a second side surface located on the other side of the first direction, and third and fourth side surfaces that are separated from each other in a second direction orthogonal to both a thickness direction and the first direction and are connected to the first and second side surfaces. A first gate mark having a surface roughness larger than the other regions of the third side surface is formed on the third side surface. When viewed along the second direction, the first gate mark overlaps a pad gap provided between the first die pad and the second die pad in the first direction.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventor: Hiroaki MATSUBARA
  • Publication number: 20220077036
    Abstract: A semiconductor device includes a first die pad, a second die pad, a first semiconductor element, a second semiconductor element, an insulating element, first terminals, second terminals, and a sealing resin. The sealing resin has a top surface, a bottom surface, and a first side surface connected to the top surface and the bottom surface. The first side surface includes a first region connected to the top surface, a second region connected to the bottom surface, and a third region connected to the first region and the second region, the plurality of first terminals being exposed to the third region. A surface roughness of each of the top surface, the bottom surface, the first region, and the second region is larger than a surface roughness of the third region.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventor: Hiroaki MATSUBARA
  • Publication number: 20220028763
    Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.
    Type: Application
    Filed: October 12, 2021
    Publication date: January 27, 2022
    Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA
  • Publication number: 20220020678
    Abstract: A semiconductor device includes: a chip; a circuit element formed in the chip; an insulating layer formed over the chip so as to cover the circuit element; a multilayer wiring region formed in the insulating layer and including a plurality of wirings laminated and arranged in a thickness direction of the insulating layer so as to be electrically connected to the circuit element; at least one insulating region which does not include the wirings in an entire region in the thickness direction of the insulating layer and is formed in a region outside the multilayer wiring region in the insulating layer; and at least one terminal electrode disposed over the insulating layer so as to face the chip with the at least one insulating region interposed between the at least one terminal electrode and the chip.
    Type: Application
    Filed: July 1, 2021
    Publication date: January 20, 2022
    Inventors: Hiroaki MATSUBARA, Kaori SUMITOMO, Maki MOROI, Naoki KINOSHITA
  • Patent number: 11177198
    Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: November 16, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Hiroaki Matsubara, Yasumasa Kasuya
  • Patent number: 10832996
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: November 10, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yasumasa Kasuya, Hiroaki Matsubara, Hiroshi Kumano, Toshio Nakajima, Shigeru Hirata, Yuji Ishimatsu
  • Patent number: 10789937
    Abstract: This invention is an improvement of technology for automatically generating response voice to voice uttered by a speaker (user), and is characterized by controlling a pitch of the response voice in accordance with a pitch of the speaker's utterance. A voice signal of the speaker's utterance (e.g., question) is received, and a pitch (e.g., highest pitch) of a representative portion of the utterance is detected. Voice data of a responsive to the utterance is acquired, and a pitch (e.g., average pitch) based on the acquired response voice data is acquired. A pitch shift amount for shifting the acquired pitch to a target pitch having a particular relationship to the pitch of the representative portion is determined. When response voice is to be synthesized on the basis of the response voice data, the pitch of the response voice to be synthesized is shifted in accordance with the pitch shift amount.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: September 29, 2020
    Assignee: Yamaha Corporation
    Inventors: Hiraku Kayama, Hiroaki Matsubara
  • Patent number: 10790258
    Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 29, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Hiroaki Matsubara, Yasumasa Kasuya, Taro Nishioka
  • Publication number: 20200251410
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Application
    Filed: April 20, 2020
    Publication date: August 6, 2020
    Inventors: Yasumasa KASUYA, Hiroaki MATSUBARA, Hiroshi KUMANO, Toshio NAKAJIMA, Shigeru HIRATA, Yuji ISHIMATSU
  • Patent number: 10679928
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: June 9, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yasumasa Kasuya, Hiroaki Matsubara, Hiroshi Kumano, Toshio Nakajima, Shigeru Hirata, Yuji Ishimatsu
  • Patent number: 10668835
    Abstract: In a seat for a vehicle which comprises a seat body, a slide mechanism, and a lift mechanism, the lift mechanism is configured such that a hip point of a specified physique occupant seated on the seat body draws a track which is approximated to a virtual rotational track of the hip point around a heel point when viewed from a vehicle side, whereby a change quantity of an ankle's angle is restricted below a first threshold and a change quantity of a knee's angle is restricted below a second threshold.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: June 2, 2020
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Yoshito Hirata, Hiroki Uemura, Hiroaki Matsubara, Tomonori Ohtsubo
  • Patent number: 10625493
    Abstract: A sealant film used by being laminated on a substrate includes a sealing layer including a first polyolefin resin and an antifogging agent and a first resin layer including 10% to 40% by mass of a cyclic polyolefin resin and 60% to 90% by mass of a second polyolefin resin, wherein the second polyolefin resin is not a cyclic polyolefin resin. The first resin layer is disposed on a surface of the sealing layer, and has a phase-separated structure in which the cyclic polyolefin resin is dispersed in the form of a layer in the second polyolefin resin.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: April 21, 2020
    Assignee: DIC Corporation
    Inventors: Hiroaki Matsubara, Tatsuhiko Usui, Yoshitaka Satoh
  • Publication number: 20200066619
    Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.
    Type: Application
    Filed: November 1, 2019
    Publication date: February 27, 2020
    Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA
  • Publication number: 20190392814
    Abstract: A voice dialogue apparatus includes a pitch adjusting unit configured to shift pitches of an entire period of a preceding voice, which is reproduced before a dialogue voice for a dialogue, according to a pitch of the dialogue voice, a first reproduction instructing unit configured to instruct reproduction of the preceding voice having been adjusted with the pitch adjusting unit, and a second reproduction instructing unit configured to instruct reproduction of the dialogue voice after the reproduction of the preceding voice with the first reproduction instructing unit.
    Type: Application
    Filed: September 5, 2019
    Publication date: December 26, 2019
    Inventors: Hiraku KAYAMA, Hiroaki MATSUBARA, Junya URA
  • Patent number: 10497644
    Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: December 3, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroaki Matsubara, Yasumasa Kasuya