Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: This invention is an improvement of technology for automatically generating response voice to voice uttered by a speaker (user), and is characterized by controlling a pitch of the response voice in accordance with a pitch of the speaker's utterance. A voice signal of the speaker's utterance (e.g., question) is received, and a pitch (e.g., highest pitch) of a representative portion of the utterance is detected. Voice data of a responsive to the utterance is acquired, and a pitch (e.g., average pitch) based on the acquired response voice data is acquired. A pitch shift amount for shifting the acquired pitch to a target pitch having a particular relationship to the pitch of the representative portion is determined. When response voice is to be synthesized on the basis of the response voice data, the pitch of the response voice to be synthesized is shifted in accordance with the pitch shift amount.

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: In a seat for a vehicle which comprises a seat body, a slide mechanism, and a lift mechanism, the lift mechanism is configured such that a hip point of a specified physique occupant seated on the seat body draws a track which is approximated to a virtual rotational track of the hip point around a heel point when viewed from a vehicle side, whereby a change quantity of an ankle's angle is restricted below a first threshold and a change quantity of a knee's angle is restricted below a second threshold.

Abstract: A sealant film used by being laminated on a substrate includes a sealing layer including a first polyolefin resin and an antifogging agent and a first resin layer including 10% to 40% by mass of a cyclic polyolefin resin and 60% to 90% by mass of a second polyolefin resin, wherein the second polyolefin resin is not a cyclic polyolefin resin. The first resin layer is disposed on a surface of the sealing layer, and has a phase-separated structure in which the cyclic polyolefin resin is dispersed in the form of a layer in the second polyolefin resin.

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

Abstract: A voice dialogue apparatus includes a pitch adjusting unit configured to shift pitches of an entire period of a preceding voice, which is reproduced before a dialogue voice for a dialogue, according to a pitch of the dialogue voice, a first reproduction instructing unit configured to instruct reproduction of the preceding voice having been adjusted with the pitch adjusting unit, and a second reproduction instructing unit configured to instruct reproduction of the dialogue voice after the reproduction of the preceding voice with the first reproduction instructing unit.

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

Abstract: The present invention is provided with: a voice input section that receives a remark (a question) via a voice signal; a reply creation section that creates a voice sequence of a reply (response) to the remark; a pitch analysis section that analyzes the pitch of a first segment (e.g., word ending) of the remark; and a voice generation section (a voice synthesis section, etc.) that generates a reply, in the form of voice, represented by the voice sequence. The voice generation section controls the pitch of the entire reply in such a manner that the pitch of a second segment (e.g., word ending) of the reply assumes a predetermined pitch (e.g., five degrees down) with respect to the pitch of the first segment of the remark. Such arrangements can realize synthesis of replying voice capable of giving a natural feel to the user.

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

Abstract: This invention is an improvement of technology for automatically generating response voice to voice uttered by a speaker (user), and is characterized by controlling a pitch of the response voice in accordance with a pitch of the speaker's utterance. A voice signal of the speaker's utterance (e.g., question) is received, and a pitch (e.g., highest pitch) of a representative portion of the utterance is detected. Voice data of a responsive to the utterance is acquired, and a pitch (e.g., average pitch) based on the acquired response voice data is acquired. A pitch shift amount for shifting the acquired pitch to a target pitch having a particular relationship to the pitch of the representative portion is determined. When response voice is to be synthesized on the basis of the response voice data, the pitch of the response voice to be synthesized is shifted in accordance with the pitch shift amount.

Abstract: A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.

Abstract: A voice synthesizing apparatus includes: a voice inputter (102) configured to input a voice; an obtainer (22) configured to obtain a primary response to the voice inputted by the voice inputter (102); an analyzer (112) configured to analyze whether the primary response includes a repetition target; and a voice synthesizer (24) configured to, in a case where the analyzed primary response is determined to include the repetition target, synthesize a voice from a secondary response that includes the repetition target repeated at least twice to output the voice.

Abstract: In a seat for a vehicle which comprises a seat body, a slide mechanism, and a lift mechanism, the lift mechanism is configured such that a hip point of a specified physique occupant seated on the seat body draws a track which is approximated to a virtual rotational track of the hip point around a heel point when viewed from a vehicle side, whereby a change quantity of an ankle's angle is restricted below a first threshold and a change quantity of a knee's angle is restricted below a second threshold.

Abstract: This invention is an improvement of technology for automatically generating response voice to voice uttered by a speaker (user), and is characterized by controlling a pitch of the response voice in accordance with a pitch of the speaker's utterance. A voice signal of the speaker's utterance (e.g., question) is received, and a pitch (e.g., highest pitch) of a representative portion of the utterance is detected. Voice data of a responsive to the utterance is acquired, and a pitch (e.g., average pitch) based on the acquired response voice data is acquired. A pitch shift amount for shifting the acquired pitch to a target pitch having a particular relationship to the pitch of the representative portion is determined. When response voice is to be synthesized on the basis of the response voice data, the pitch of the response voice to be synthesized is shifted in accordance with the pitch shift amount.

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

Abstract: A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.