Patents by Inventor Hiroaki Takezawa

Hiroaki Takezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040005459
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 8, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6666994
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: December 23, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Publication number: 20030207073
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Application
    Filed: April 7, 2003
    Publication date: November 6, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Patent number: 6620345
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: September 16, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Publication number: 20030127632
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Application
    Filed: December 3, 2002
    Publication date: July 10, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Publication number: 20030116756
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Application
    Filed: December 3, 2002
    Publication date: June 26, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6569512
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Publication number: 20030079896
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Application
    Filed: December 3, 2002
    Publication date: May 1, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Matani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Patent number: 6524721
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: February 25, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6521144
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group; an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: February 18, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Patent number: 6512183
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: January 28, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Patent number: 6510059
    Abstract: In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: January 21, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Yukihiro Ishimaru, Takashi Kitae, Hiroaki Takezawa
  • Patent number: 6495247
    Abstract: A functional member having a molecular layer on its surface, wherein the molecular layer is formed through a coordinate bond, and the coordinate bond is a multidentate bond in which at least one molecule is bonded to one metallic atom of the member and two or more ligands of the molecule are coordinated.
    Type: Grant
    Filed: August 21, 1998
    Date of Patent: December 17, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tadashi Otake, Yasuo Takebe, Hiroshi Onishi, Norihisa Mino, Toru Shiino
  • Publication number: 20020185306
    Abstract: In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
    Type: Application
    Filed: July 18, 2001
    Publication date: December 12, 2002
    Inventors: Tsutomu Mitani, Yukihiro Ishimaru, Takashi Kitae, Hiroaki Takezawa
  • Patent number: 6488869
    Abstract: A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: December 3, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Minehiro Itagaki, Yoshihiro Bessho
  • Publication number: 20020158232
    Abstract: A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 31, 2002
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Patent number: 6465082
    Abstract: A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: October 15, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Masahide Tsukamoto, Minehiro Itagaki, Yoshihiro Bessho, Hideo Hatanaka, Yasushi Fukumura, Kazuo Eda, Toru Ishida
  • Patent number: 6429382
    Abstract: For the reliability in insulation and against sulfurization, the mounting structure of the invention includes an electric structure, and an electrically conductive adhesive layer including an electrically conductive filler disposed on the electric structure, and at least a portion of surface of the electrically conductive filler is exposed to an external environment, and an elution preventive film is disposed on at least a portion of the exposed surface. Further, an electrically conductive adhesive of this invention includes the electrically conductive filler, and an elution preventive film is disposed on the entire surface of the electrically conductive filler.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: August 6, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuyoshi Amami, Hiroaki Takezawa, Tsukasa Shiraishi, Yoshihiro Bessho
  • Publication number: 20020062988
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Application
    Filed: June 27, 2001
    Publication date: May 30, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Publication number: 20020050643
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Application
    Filed: September 7, 2001
    Publication date: May 2, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama