Abstract: It is possible to improve a measurement accuracy of a liquid flow volume, thereby improving reproducibility of a measured value. Provided is a flow volume measuring device including a light source which emits light to a measuring-target region; a light receiving element which receives light scattered at the measuring-target region from the light emitted from the light source; a contact member having translucency with respect to a wavelength of the emitted light and a wavelength of the scattered light, the contact member including a surface which faces the measuring-target region and with which the measuring-target region is contactable over the entire surface; and a flow volume measuring unit which measures a flow volume of liquid flowing through the measuring-target region based upon the scattered light.

Abstract: The invention relates to a production method for dough for breads, a production method for breads, a method for preventing a moist feeling of breads from decreasing, and a starch composition to be added to dough in a middle stage of mixing in producing dough for breads. According to the invention, dough for breads is produced by a method comprising: a step of preparing a starch composition containing 50% by mass to 97% by mass of pregelatinized starch and 3% by mass to 50% by mass of an edible oil and fat; a step of adding the starch composition to the dough in a middle stage of mixing; and a step of further kneading the dough in the middle stage of mixing to which the starch composition is added. According to preferred embodiments of the invention, breads which can maintain its moist feeling can be provided.

Abstract: The present invention pertains to: a cheese-like food, preferably a cheese-like food having a texture inherent to cheese and a high heat meltability; a method for manufacturing a cheese-like food; and a method for improving the heat meltability of a cheese-like food. The cheese-like food according to the present invention, which comprises 2-30 mass % inclusive of an acetylated oxidized starch, 10-35 mass % inclusive of an edible fat or oil, and 30-65 mass % inclusive of water, is characterized in that the solid fat content at 10° C. of the edible fat or oil is 20-95% inclusive.

Abstract: It is possible to improve a measurement accuracy of a liquid flow volume, thereby improving reproducibility of a measured value. Provided is a flow volume measuring device including a light source which emits light to a measuring-target region; a light receiving element which receives light scattered at the measuring-target region from the light emitted from the light source; a contact member having translucency with respect to a wavelength of the emitted light and a wavelength of the scattered light, the contact member including a surface which faces the measuring-target region and with which the measuring-target region is contactable over the entire surface; and a flow volume measuring unit which measures a flow volume of liquid flowing through the measuring-target region based upon the scattered light.

Abstract: An electronic device according to one aspect includes a blood flow data acquisition unit configured to acquire information related to blood flowing inside a living body as blood flow data based on Doppler shift, a power spectrum calculator configured to calculate a power spectrum of the blood flow data based on the blood flow data, and an outline index calculator configured to calculate an outline index from the power spectrum. An electronic device according to one aspect further includes an estimator configured to estimate viscosity of the blood based on the outline index, and the estimator is configured to display an estimation result of the viscosity of the blood on a display.

Abstract: A semiconductor light emitting element in which changes in light distribution characteristics due to inclination angle of side surfaces are suppressed. The semiconductor light emitting element includes a semiconductor structure having a light extracting surface as its upper surface; a reflecting layer disposed on side surfaces of the semiconductor structure; and a positive electrode and a negative electrode disposed on a lower surface of the semiconductor structure. Side surfaces of the semiconductor structure are inclined, expanding upward from the lower surface to the upper surface. At least a portion of each side surface includes a plurality of protrusions, a plurality of recesses, or a combination thereof.

Abstract: A semiconductor light emitting element in which changes in light distribution characteristics due to inclination angle of side surfaces are suppressed. The semiconductor light emitting element includes a semiconductor structure having a light extracting surface as its upper surface; a reflecting layer disposed on side surfaces of the semiconductor structure; and a positive electrode and a negative electrode disposed on a lower surface of the semiconductor structure. Side surfaces of the semiconductor structure are inclined, expanding upward from the lower surface to the upper surface. At least a portion of each side surface includes a plurality of protrusions, a plurality of recesses, or a combination thereof.

Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Abstract: In this invention, the rate of decrease of an oxidation suppressing element in a solder bath during use is measured, and a solder alloy including the oxidation suppressing element in the same or greater proportion than the rate of decrease in the amount is suitably added in accordance with the decrease in the solder bath. As a simple method, in flow soldering of an Sn—Ag based or Sn—Ag—Cu based solder alloy, to compensate for a decrease in the P content of the solder bath which is observed during operation, a solder alloy containing 60-100 ppm by mass of P in an Sn—Ag based or Sn—Ag—Cu based solder alloy for replenishing a solder bath is supplied to maintain not only the P content but also the surface level of molder solder bath.